CN100567393C - 一种表面改性球形SiO2颗粒的环氧树脂复合材料的制备方法 - Google Patents
一种表面改性球形SiO2颗粒的环氧树脂复合材料的制备方法 Download PDFInfo
- Publication number
- CN100567393C CN100567393C CNB2008100200407A CN200810020040A CN100567393C CN 100567393 C CN100567393 C CN 100567393C CN B2008100200407 A CNB2008100200407 A CN B2008100200407A CN 200810020040 A CN200810020040 A CN 200810020040A CN 100567393 C CN100567393 C CN 100567393C
- Authority
- CN
- China
- Prior art keywords
- weight
- parts
- epoxy resin
- particles
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 53
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 53
- 239000002131 composite material Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 73
- 239000002245 particle Substances 0.000 claims abstract description 53
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 35
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 34
- 229910052681 coesite Inorganic materials 0.000 claims abstract description 32
- 229910052906 cristobalite Inorganic materials 0.000 claims abstract description 32
- 229910052682 stishovite Inorganic materials 0.000 claims abstract description 32
- 229910052905 tridymite Inorganic materials 0.000 claims abstract description 32
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 22
- 229910004298 SiO 2 Inorganic materials 0.000 claims abstract description 14
- 239000000178 monomer Substances 0.000 claims abstract description 7
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 6
- 239000003999 initiator Substances 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims description 27
- 238000006243 chemical reaction Methods 0.000 claims description 15
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 10
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 9
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 230000004048 modification Effects 0.000 claims description 7
- 238000012986 modification Methods 0.000 claims description 7
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical group CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 6
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 5
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 5
- 230000002209 hydrophobic effect Effects 0.000 claims description 5
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 claims description 4
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 4
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 3
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 claims description 3
- -1 glycidoxy Chemical group 0.000 claims description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 claims description 2
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 2
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 8
- 239000005022 packaging material Substances 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 4
- 150000003254 radicals Chemical class 0.000 abstract description 4
- 238000011049 filling Methods 0.000 abstract description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 3
- 230000002378 acidificating effect Effects 0.000 abstract description 2
- 238000007385 chemical modification Methods 0.000 abstract description 2
- 238000006482 condensation reaction Methods 0.000 abstract description 2
- 238000007334 copolymerization reaction Methods 0.000 abstract description 2
- 229920001600 hydrophobic polymer Polymers 0.000 abstract description 2
- 238000011065 in-situ storage Methods 0.000 abstract description 2
- 230000000977 initiatory effect Effects 0.000 abstract description 2
- 239000010954 inorganic particle Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 5
- 238000013329 compounding Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2008100200407A CN100567393C (zh) | 2008-03-20 | 2008-03-20 | 一种表面改性球形SiO2颗粒的环氧树脂复合材料的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2008100200407A CN100567393C (zh) | 2008-03-20 | 2008-03-20 | 一种表面改性球形SiO2颗粒的环氧树脂复合材料的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101250317A CN101250317A (zh) | 2008-08-27 |
CN100567393C true CN100567393C (zh) | 2009-12-09 |
Family
ID=39953927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2008100200407A Expired - Fee Related CN100567393C (zh) | 2008-03-20 | 2008-03-20 | 一种表面改性球形SiO2颗粒的环氧树脂复合材料的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100567393C (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102504144B (zh) * | 2011-10-27 | 2015-08-05 | 武汉大学 | 一种纳米阳离子球型聚电解质刷的制备方法 |
CN104672785B (zh) * | 2014-06-30 | 2019-04-09 | 广东丹邦科技有限公司 | 一种环氧塑封料及其制备方法 |
JP6439929B2 (ja) * | 2015-02-06 | 2018-12-19 | セイコーエプソン株式会社 | シート製造装置及びシート製造方法 |
CN104610574B (zh) * | 2015-02-14 | 2017-11-07 | 青岛科技大学 | 聚合物接枝改性的二氧化硅纳米片及其制备方法和用途 |
CN105754379A (zh) * | 2016-03-28 | 2016-07-13 | 江南大学 | 一种氧化铝磨料粉体的表面改性方法 |
CN109456620A (zh) * | 2018-11-19 | 2019-03-12 | 江苏联瑞新材料股份有限公司 | 一种低粘度填料组合物及其制备方法 |
CN110951185A (zh) * | 2019-12-04 | 2020-04-03 | 石门成功高分子材料制造有限公司 | 一种聚氯乙烯改性材料的制备方法 |
CN111889040B (zh) * | 2020-07-24 | 2024-12-27 | 江苏联瑞新材料股份有限公司 | 一种降低球形二氧化硅微粉表面能的装置和方法 |
CN114106514B (zh) * | 2021-12-15 | 2023-09-12 | 广东生益科技股份有限公司 | 一种环氧树脂组合物、包含其的预浸料以及层压板和印制电路板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1766019A (zh) * | 2005-09-22 | 2006-05-03 | 长江水利委员会长江科学院 | 纳米复合水性环氧树脂涂层材料及制备方法 |
CN1256373C (zh) * | 2004-08-26 | 2006-05-17 | 长江水利委员会长江科学院 | 环氧树脂纳米二氧化硅复合材料制备工艺 |
CN1296416C (zh) * | 2005-03-24 | 2007-01-24 | 武汉理工大学 | 含有受阻胺的光稳定性无机/有机复合微粒子的制备方法 |
CN101054508A (zh) * | 2007-04-24 | 2007-10-17 | 中国科学院广州化学研究所 | 一种复合环氧型电子封装材料及其制备方法 |
-
2008
- 2008-03-20 CN CNB2008100200407A patent/CN100567393C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1256373C (zh) * | 2004-08-26 | 2006-05-17 | 长江水利委员会长江科学院 | 环氧树脂纳米二氧化硅复合材料制备工艺 |
CN1296416C (zh) * | 2005-03-24 | 2007-01-24 | 武汉理工大学 | 含有受阻胺的光稳定性无机/有机复合微粒子的制备方法 |
CN1766019A (zh) * | 2005-09-22 | 2006-05-03 | 长江水利委员会长江科学院 | 纳米复合水性环氧树脂涂层材料及制备方法 |
CN101054508A (zh) * | 2007-04-24 | 2007-10-17 | 中国科学院广州化学研究所 | 一种复合环氧型电子封装材料及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101250317A (zh) | 2008-08-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100567393C (zh) | 一种表面改性球形SiO2颗粒的环氧树脂复合材料的制备方法 | |
CN102775786B (zh) | 一种氧化石墨烯/氰酸酯树脂复合材料及其制备方法 | |
CN103819880B (zh) | 一种双亲共聚物修饰石墨烯改性环氧树脂的方法 | |
CN108504041B (zh) | 一种环氧树脂/聚离子液体复合材料及其制备方法 | |
CN101691419A (zh) | 超支化聚合物表面接枝改性纳米无机粒子/环氧树脂减摩耐磨复合材料及其制备方法 | |
CN101024751A (zh) | 一种含poss丙烯酸酯共聚物的涂层材料及其制备方法 | |
CN112374798B (zh) | 一种耐磨抗冲击环氧砂浆修补材料的制备方法 | |
CN110330769B (zh) | 纳米碳材料/纳米纤维素/环氧树脂抗静电薄膜制备法 | |
WO2020260638A1 (en) | Composition comprising a compound with two polymerizable groups, a multistage polymer and a thermoplastic polymer, its method of preparation, its use and article comprising it | |
CN110408071A (zh) | 一种常压干燥酚醛气凝胶及其制备方法 | |
CN1597775A (zh) | 环氧树脂纳米二氧化硅复合材料制备工艺 | |
CN102773892B (zh) | 基于纳米poss掺杂的木材-有机-无机杂化纳米复合材料的制备方法 | |
CN113388065A (zh) | 可控自组装聚合物微球以及环氧树脂增强增韧改性方法 | |
CN114292495B (zh) | 环氧树脂复合材料及其制备方法与应用 | |
CN106928656A (zh) | 纳米二氧化硅改性rfi用环氧树脂膜及其制备方法 | |
CN117004030A (zh) | 一种锆硅改性丙烯酸酯及其制备方法 | |
CN113416383B (zh) | 柔性线型高分子及无机纳米颗粒复合改性的氧化石墨烯-环氧树脂复合材料及其制备方法 | |
CN105482373B (zh) | 一种端环氧基聚苯乙烯低聚物增韧改性环氧树脂的方法 | |
CN114539962A (zh) | 一种增强不饱和聚酯胶粘剂及其制备方法 | |
KR20230063389A (ko) | 에폭시접착제 조성물 및 그 제조방법 | |
JPH0326716A (ja) | 変性エポキシ組成物の製造方法 | |
CN110951185A (zh) | 一种聚氯乙烯改性材料的制备方法 | |
CN101457020A (zh) | 纳米氮化硅/环氧基硅烷/氰酸酯树脂复合材料及其制备方法 | |
CN113667274B (zh) | 一种强韧环氧复合材料及其制备方法 | |
Su et al. | Mechanical properties and fracture behavior of dual-curable epoxyacrylate composites filled with different functionalized silica particles |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: 214014 Jiangsu province Wuxi chonganou mount a horse Pier Road No. 18 Chong Chong'an District Service Center Patentee after: Jiangnan University Patentee after: Nagase Chemtex (Wuxi) Corporation Address before: College of chemistry and material engineering Jiangnan University No. 1800 214122 Jiangsu city of Wuxi Province Li Lake Avenue Patentee before: Jiangnan University Patentee before: Nagase Chemtex (Wuxi) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091209 Termination date: 20150320 |
|
EXPY | Termination of patent right or utility model |