CN100550439C - 半导体发光器件及制造方法 - Google Patents
半导体发光器件及制造方法 Download PDFInfo
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- CN100550439C CN100550439C CNB200510115051XA CN200510115051A CN100550439C CN 100550439 C CN100550439 C CN 100550439C CN B200510115051X A CNB200510115051X A CN B200510115051XA CN 200510115051 A CN200510115051 A CN 200510115051A CN 100550439 C CN100550439 C CN 100550439C
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- emitting diode
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
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- H01L2924/1204—Optical Diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/068,645 | 2005-02-22 | ||
US11/068,645 US7405433B2 (en) | 2005-02-22 | 2005-02-22 | Semiconductor light emitting device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1825641A CN1825641A (zh) | 2006-08-30 |
CN100550439C true CN100550439C (zh) | 2009-10-14 |
Family
ID=36911753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200510115051XA Expired - Fee Related CN100550439C (zh) | 2005-02-22 | 2005-11-23 | 半导体发光器件及制造方法 |
Country Status (6)
Country | Link |
---|---|
US (3) | US7405433B2 (zh) |
JP (1) | JP2006237609A (zh) |
KR (1) | KR101247426B1 (zh) |
CN (1) | CN100550439C (zh) |
DE (1) | DE102005052730A1 (zh) |
TW (1) | TW200631201A (zh) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7837348B2 (en) * | 2004-05-05 | 2010-11-23 | Rensselaer Polytechnic Institute | Lighting system using multiple colored light emitting sources and diffuser element |
US7819549B2 (en) * | 2004-05-05 | 2010-10-26 | Rensselaer Polytechnic Institute | High efficiency light source using solid-state emitter and down-conversion material |
WO2006098545A2 (en) | 2004-12-14 | 2006-09-21 | Seoul Opto Device Co., Ltd. | Light emitting device having a plurality of light emitting cells and package mounting the same |
JP4634810B2 (ja) * | 2005-01-20 | 2011-02-16 | 信越化学工業株式会社 | シリコーン封止型led |
US7405433B2 (en) | 2005-02-22 | 2008-07-29 | Avago Technologies Ecbu Ip Pte Ltd | Semiconductor light emitting device |
DE102005020908A1 (de) * | 2005-02-28 | 2006-08-31 | Osram Opto Semiconductors Gmbh | Beleuchtungsvorrichtung |
US8076680B2 (en) * | 2005-03-11 | 2011-12-13 | Seoul Semiconductor Co., Ltd. | LED package having an array of light emitting cells coupled in series |
EP1878062A2 (en) * | 2005-04-28 | 2008-01-16 | Koninklijke Philips Electronics N.V. | Light source comprising led arranged in recess |
KR101266130B1 (ko) * | 2005-06-23 | 2013-05-27 | 렌슬러 폴리테크닉 인스티튜트 | 단파장 led들 및 다운-컨버젼 물질들로 백색광을생성하기 위한 패키지 설계 |
DE112006004259A5 (de) | 2005-11-21 | 2012-09-06 | Seoul Semiconductor Co., Ltd. | Lichtemittierendes Element |
JP5268082B2 (ja) * | 2006-02-22 | 2013-08-21 | シチズン電子株式会社 | 光半導体装置 |
KR100731678B1 (ko) * | 2006-05-08 | 2007-06-22 | 서울반도체 주식회사 | 칩형 발광 다이오드 패키지 및 그것을 갖는 발광 장치 |
US7655486B2 (en) * | 2006-05-17 | 2010-02-02 | 3M Innovative Properties Company | Method of making light emitting device with multilayer silicon-containing encapsulant |
US7703942B2 (en) * | 2006-08-31 | 2010-04-27 | Rensselaer Polytechnic Institute | High-efficient light engines using light emitting diodes |
US8425271B2 (en) * | 2006-09-01 | 2013-04-23 | Cree, Inc. | Phosphor position in light emitting diodes |
DE102006046301A1 (de) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Optisches Element, strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines optischen Elements |
JP5194431B2 (ja) * | 2006-10-31 | 2013-05-08 | 旭硝子株式会社 | 発光素子用封入剤および発光素子 |
US7889421B2 (en) | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
JP2008159705A (ja) * | 2006-12-21 | 2008-07-10 | Matsushita Electric Works Ltd | 発光装置 |
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-
2005
- 2005-02-22 US US11/068,645 patent/US7405433B2/en not_active Expired - Fee Related
- 2005-10-07 TW TW094135166A patent/TW200631201A/zh unknown
- 2005-11-04 DE DE102005052730A patent/DE102005052730A1/de not_active Withdrawn
- 2005-11-23 CN CNB200510115051XA patent/CN100550439C/zh not_active Expired - Fee Related
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DE102005052730A1 (de) | 2006-09-14 |
US20080254556A1 (en) | 2008-10-16 |
TW200631201A (en) | 2006-09-01 |
JP2006237609A (ja) | 2006-09-07 |
US20140264399A1 (en) | 2014-09-18 |
US7405433B2 (en) | 2008-07-29 |
US20060186429A1 (en) | 2006-08-24 |
US8778705B2 (en) | 2014-07-15 |
KR20060093662A (ko) | 2006-08-25 |
US9236537B2 (en) | 2016-01-12 |
CN1825641A (zh) | 2006-08-30 |
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