CN100541905C - 平面电路用箱体 - Google Patents

平面电路用箱体 Download PDF

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Publication number
CN100541905C
CN100541905C CNB2005101030908A CN200510103090A CN100541905C CN 100541905 C CN100541905 C CN 100541905C CN B2005101030908 A CNB2005101030908 A CN B2005101030908A CN 200510103090 A CN200510103090 A CN 200510103090A CN 100541905 C CN100541905 C CN 100541905C
Authority
CN
China
Prior art keywords
planar circuit
casing
circuit substrate
cavity
planar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005101030908A
Other languages
English (en)
Chinese (zh)
Other versions
CN1750318A (zh
Inventor
小泉大辅
佐藤圭
楢桥祥一
正村达郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Docomo Inc
Original Assignee
NTT Docomo Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NTT Docomo Inc filed Critical NTT Docomo Inc
Publication of CN1750318A publication Critical patent/CN1750318A/zh
Application granted granted Critical
Publication of CN100541905C publication Critical patent/CN100541905C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6683—High-frequency adaptations for monolithic microwave integrated circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1616—Cavity shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
CNB2005101030908A 2004-09-17 2005-09-19 平面电路用箱体 Expired - Fee Related CN100541905C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004271667A JP4536467B2 (ja) 2004-09-17 2004-09-17 平面回路用筐体
JP2004271667 2004-09-17

Publications (2)

Publication Number Publication Date
CN1750318A CN1750318A (zh) 2006-03-22
CN100541905C true CN100541905C (zh) 2009-09-16

Family

ID=35645634

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005101030908A Expired - Fee Related CN100541905C (zh) 2004-09-17 2005-09-19 平面电路用箱体

Country Status (5)

Country Link
US (1) US7564699B2 (ko)
EP (1) EP1643550B1 (ko)
JP (1) JP4536467B2 (ko)
KR (1) KR100679609B1 (ko)
CN (1) CN100541905C (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5044476B2 (ja) 2008-04-11 2012-10-10 ホシデン株式会社 シールドケース及び基板アッセンブリ
US8116090B2 (en) * 2009-04-09 2012-02-14 Bae Systems Information And Electronic Systems Integration Inc. Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly utilizing ball grid array (BGA) technology

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0241265A1 (en) * 1986-04-09 1987-10-14 Nec Corporation Radio transceiver including and antenna switching circuit capable of changing reception sensitivity
EP0393338A2 (de) * 1989-04-15 1990-10-24 ANT Nachrichtentechnik GmbH Anordnung zum Kontaktieren einer planaren Mikrowellenschaltung in einem Hohlleiter oder Gehäuse
US5566040A (en) * 1994-05-18 1996-10-15 Societe Nationale D'etude Et De Construction De Moteurs D'aviation Protection arrangement for an electronic device sensitive to electromagnetic radiation
CN1145571A (zh) * 1995-06-08 1997-03-19 阿尔卑斯电气株式会社 屏蔽盒
CN1987899A (zh) * 2006-12-13 2007-06-27 公安部第一研究所 用于证件和票据的个人或个性视读信息加载保护方法

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JPH04564Y2 (ko) * 1986-10-31 1992-01-09
US4758927A (en) * 1987-01-21 1988-07-19 Tektronix, Inc. Method of mounting a substrate structure to a circuit board
JPH02128434U (ko) * 1989-03-29 1990-10-23
US5111362A (en) * 1990-09-18 1992-05-05 Intel Corporation Enclosure assembly with two identical covers having modifiable supports for asymmetrically housing a printed circuit board or the like
JPH0521979A (ja) * 1991-07-12 1993-01-29 Fujitsu Ltd プリント板のシールド構造
US5355104A (en) * 1993-01-29 1994-10-11 Hughes Aircraft Company Phase shift device using voltage-controllable dielectrics
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JP3102735B2 (ja) 1993-10-27 2000-10-23 株式会社ケンウッド プリント基板の取付構造
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JPH08330772A (ja) * 1995-05-31 1996-12-13 Fujitsu Ltd 通信装置の筐体構造
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JPH09307260A (ja) 1996-05-15 1997-11-28 Mitsubishi Electric Corp 回路ブロック相互間シールド機構
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JP3267521B2 (ja) 1996-11-08 2002-03-18 アルプス電気株式会社 プリント基板の取付構造
JPH10200287A (ja) * 1997-01-10 1998-07-31 Mitsubishi Electric Corp シールド構造体
JPH10200288A (ja) * 1997-01-13 1998-07-31 Sony Corp 電磁シールド構造
JPH10294585A (ja) * 1997-04-22 1998-11-04 Kokusai Electric Co Ltd プリント基板用シールドケース
US6160710A (en) * 1998-04-03 2000-12-12 Ericsson Inc. Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
US6407925B1 (en) * 1999-09-17 2002-06-18 Denso Corporation Casing for electronic control devices
JP2001135967A (ja) * 1999-11-05 2001-05-18 Anritsu Corp 高周波ユニットのシールド構造
JP2001218461A (ja) * 2000-01-31 2001-08-10 Sony Corp スイッチング電源装置
JP3648119B2 (ja) * 2000-03-01 2005-05-18 株式会社ケーヒン 電子回路基板の収容ケース
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JP4244280B2 (ja) * 2002-04-22 2009-03-25 ホーチキ株式会社 伝送機器の筐体構造
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0241265A1 (en) * 1986-04-09 1987-10-14 Nec Corporation Radio transceiver including and antenna switching circuit capable of changing reception sensitivity
EP0393338A2 (de) * 1989-04-15 1990-10-24 ANT Nachrichtentechnik GmbH Anordnung zum Kontaktieren einer planaren Mikrowellenschaltung in einem Hohlleiter oder Gehäuse
US5566040A (en) * 1994-05-18 1996-10-15 Societe Nationale D'etude Et De Construction De Moteurs D'aviation Protection arrangement for an electronic device sensitive to electromagnetic radiation
CN1145571A (zh) * 1995-06-08 1997-03-19 阿尔卑斯电气株式会社 屏蔽盒
CN1987899A (zh) * 2006-12-13 2007-06-27 公安部第一研究所 用于证件和票据的个人或个性视读信息加载保护方法

Also Published As

Publication number Publication date
CN1750318A (zh) 2006-03-22
JP2006086445A (ja) 2006-03-30
KR20060051373A (ko) 2006-05-19
EP1643550B1 (en) 2015-03-18
KR100679609B1 (ko) 2007-02-08
JP4536467B2 (ja) 2010-09-01
US20070223202A1 (en) 2007-09-27
EP1643550A3 (en) 2007-03-21
EP1643550A2 (en) 2006-04-05
US7564699B2 (en) 2009-07-21

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Granted publication date: 20090916

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