CN100534271C - 用于印刷电路板的导孔的制作方法 - Google Patents
用于印刷电路板的导孔的制作方法 Download PDFInfo
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- CN100534271C CN100534271C CNB2006100607503A CN200610060750A CN100534271C CN 100534271 C CN100534271 C CN 100534271C CN B2006100607503 A CNB2006100607503 A CN B2006100607503A CN 200610060750 A CN200610060750 A CN 200610060750A CN 100534271 C CN100534271 C CN 100534271C
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2006100607503A CN100534271C (zh) | 2006-05-19 | 2006-05-19 | 用于印刷电路板的导孔的制作方法 |
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CNB2006100607503A CN100534271C (zh) | 2006-05-19 | 2006-05-19 | 用于印刷电路板的导孔的制作方法 |
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Publication Number | Publication Date |
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CN101076229A CN101076229A (zh) | 2007-11-21 |
CN100534271C true CN100534271C (zh) | 2009-08-26 |
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CNB2006100607503A Active CN100534271C (zh) | 2006-05-19 | 2006-05-19 | 用于印刷电路板的导孔的制作方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104039091A (zh) * | 2014-06-18 | 2014-09-10 | 四川深北电路科技有限公司 | 印制电路板三阶埋盲孔制作方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102026484B (zh) * | 2009-09-22 | 2013-01-02 | 奈电软性科技电子(珠海)有限公司 | 一种线路板的压合导通工艺及叠板结构 |
CN101925257B (zh) * | 2010-05-07 | 2012-07-04 | 竞华电子(深圳)有限公司 | 印刷线路板的铜窗制作方法 |
CN101925268B (zh) * | 2010-05-07 | 2012-07-04 | 竞华电子(深圳)有限公司 | 多层板的制作方法 |
CN102244980A (zh) * | 2010-05-13 | 2011-11-16 | 台光电子材料股份有限公司 | 金属基板的制造方法 |
CN102612266B (zh) * | 2011-01-21 | 2014-10-01 | 富葵精密组件(深圳)有限公司 | 电路板的制作方法 |
CN103124476A (zh) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | 印制电路板及其加工方法 |
CN103596368A (zh) * | 2013-10-14 | 2014-02-19 | 大连太平洋电子有限公司 | 一种改进的激光直接钻孔加工方法 |
CN112788850A (zh) * | 2020-12-24 | 2021-05-11 | 苏州禾弘电子科技有限公司 | 一种电路板盲孔梯形形状制造方法 |
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2006
- 2006-05-19 CN CNB2006100607503A patent/CN100534271C/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104039091A (zh) * | 2014-06-18 | 2014-09-10 | 四川深北电路科技有限公司 | 印制电路板三阶埋盲孔制作方法 |
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Publication number | Publication date |
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CN101076229A (zh) | 2007-11-21 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20170310 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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TR01 | Transfer of patent right | ||
CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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CP03 | Change of name, title or address |