CN100524683C - 制作mems静电夹具的方法 - Google Patents

制作mems静电夹具的方法 Download PDF

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Publication number
CN100524683C
CN100524683C CNB200480032031XA CN200480032031A CN100524683C CN 100524683 C CN100524683 C CN 100524683C CN B200480032031X A CNB200480032031X A CN B200480032031XA CN 200480032031 A CN200480032031 A CN 200480032031A CN 100524683 C CN100524683 C CN 100524683C
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CN
China
Prior art keywords
conductive layer
forming
substrate
layer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB200480032031XA
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English (en)
Chinese (zh)
Other versions
CN1894788A (zh
Inventor
P·克雷曼
S·秦
E·亚伦
D·布朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axcelis Technologies Inc
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Axcelis Technologies Inc
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Publication date
Application filed by Axcelis Technologies Inc filed Critical Axcelis Technologies Inc
Publication of CN1894788A publication Critical patent/CN1894788A/zh
Application granted granted Critical
Publication of CN100524683C publication Critical patent/CN100524683C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)
CNB200480032031XA 2003-10-28 2004-10-28 制作mems静电夹具的方法 Expired - Fee Related CN100524683C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/695,153 2003-10-28
US10/695,153 US6946403B2 (en) 2003-10-28 2003-10-28 Method of making a MEMS electrostatic chuck

Publications (2)

Publication Number Publication Date
CN1894788A CN1894788A (zh) 2007-01-10
CN100524683C true CN100524683C (zh) 2009-08-05

Family

ID=34549968

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB200480032031XA Expired - Fee Related CN100524683C (zh) 2003-10-28 2004-10-28 制作mems静电夹具的方法

Country Status (8)

Country Link
US (1) US6946403B2 (https=)
EP (1) EP1678752B1 (https=)
JP (1) JP4725740B2 (https=)
KR (1) KR20060092245A (https=)
CN (1) CN100524683C (https=)
DE (1) DE602004006639T2 (https=)
TW (1) TWI360856B (https=)
WO (1) WO2005045921A1 (https=)

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AU2007285483B2 (en) 2006-05-11 2011-12-22 Regenics As Administration of cells and cellular extracts for rejuvenation
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US20090115060A1 (en) * 2007-11-01 2009-05-07 Infineon Technologies Ag Integrated circuit device and method
CA2723848C (en) 2008-05-09 2013-01-08 Regenics As Method of making salmon egg cytoplasmic extracts and use for increasing collagen production in skin
DE102008054982A1 (de) * 2008-12-19 2010-07-01 Carl Zeiss Smt Ag Wafer-Chuck für die EUV-Lithographie
US7932570B1 (en) * 2009-11-09 2011-04-26 Honeywell International Inc. Silicon tab edge mount for a wafer level package
US9330952B2 (en) 2009-12-30 2016-05-03 Solexel, Inc. Bipolar mobile electrostatic carriers for wafer processing
AU2011249478B2 (en) 2010-05-06 2014-12-04 Regenics As Use of cellular extracts for skin rejuvenation
CN103222043B (zh) * 2010-09-08 2016-10-12 恩特格林斯公司 一种高传导静电夹盘
US10242890B2 (en) * 2011-08-08 2019-03-26 Applied Materials, Inc. Substrate support with heater
NL2009874A (en) 2011-12-23 2013-06-26 Asml Netherlands Bv Support, lithographic apparatus and device manufacturing method.
JP6359236B2 (ja) * 2012-05-07 2018-07-18 トーカロ株式会社 静電チャック
WO2014008110A1 (en) * 2012-07-06 2014-01-09 LuxVue Technology Corporation Compliant bipolar micro device transfer head with silicon electrodes
US8569115B1 (en) 2012-07-06 2013-10-29 LuxVue Technology Corporation Method of forming a compliant bipolar micro device transfer head with silicon electrodes
JP5441021B1 (ja) * 2012-09-12 2014-03-12 Ｔｏｔｏ株式会社 静電チャック
EP3459522B1 (en) 2012-12-10 2021-02-17 Regenics AS Use of egg cellular extracts for wound treatment
JP6526575B2 (ja) 2013-02-07 2019-06-05 エーエスエムエル ホールディング エヌ．ブイ． リソグラフィ装置及び方法
US9878901B2 (en) 2014-04-04 2018-01-30 Analog Devices, Inc. Fabrication of tungsten MEMS structures
US20160230269A1 (en) * 2015-02-06 2016-08-11 Applied Materials, Inc. Radially outward pad design for electrostatic chuck surface
US10381248B2 (en) 2015-06-22 2019-08-13 Lam Research Corporation Auto-correction of electrostatic chuck temperature non-uniformity
US10763142B2 (en) 2015-06-22 2020-09-01 Lam Research Corporation System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
US10386821B2 (en) * 2015-06-22 2019-08-20 Lam Research Corporation Systems and methods for calibrating scalar field contribution values for a limited number of sensors including a temperature value of an electrostatic chuck and estimating temperature distribution profiles based on calibrated values
US9673025B2 (en) * 2015-07-27 2017-06-06 Lam Research Corporation Electrostatic chuck including embedded faraday cage for RF delivery and associated methods for operation, monitoring, and control
US20180025931A1 (en) * 2016-07-22 2018-01-25 Applied Materials, Inc. Processed wafer as top plate of a workpiece carrier in semiconductor and mechanical processing
US20180102247A1 (en) * 2016-10-06 2018-04-12 Asm Ip Holding B.V. Substrate processing apparatus and method of manufacturing semiconductor device
US10535505B2 (en) * 2016-11-11 2020-01-14 Lam Research Corporation Plasma light up suppression
US10943808B2 (en) * 2016-11-25 2021-03-09 Applied Materials, Inc. Ceramic electrostatic chuck having a V-shape seal band
US20180148835A1 (en) 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
EP3884513A4 (en) * 2018-11-19 2022-08-03 Entegris, Inc. ELECTROSTATIC CHUCK WITH CHARGE DISCHARGE COATING
JP7350153B2 (ja) * 2020-03-04 2023-09-25 東京エレクトロン株式会社 基板処理装置および基板処理方法
US12272585B2 (en) * 2021-04-27 2025-04-08 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer chuck structure with holes in upper surface to improve temperature uniformity
US12497697B2 (en) * 2021-10-08 2025-12-16 Applied Materials, Inc. Layer with discrete islands formed on a substrate support
KR102715367B1 (ko) * 2021-12-02 2024-10-08 세메스 주식회사 기판 지지 유닛 및 이를 포함하는 기판 처리 장치

Citations (4)

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US5530616A (en) * 1993-11-29 1996-06-25 Toto Ltd. Electrostastic chuck
CN1157482A (zh) * 1995-11-24 1997-08-20 日本电气株式会社 静电式夹盘
WO2002001611A2 (en) * 2000-06-23 2002-01-03 Applied Materials, Inc. Electrostatic chuck and method of fabricating the same
US6556414B2 (en) * 2000-06-02 2003-04-29 Sumitomo Osaka Cement Co., Ltd. Electrostatic and vacuum chucking holding apparatus

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US5103367A (en) * 1987-05-06 1992-04-07 Unisearch Limited Electrostatic chuck using A.C. field excitation
JP2779950B2 (ja) * 1989-04-25 1998-07-23 東陶機器株式会社 静電チャックの電圧印加方法および電圧印加装置
US5452177A (en) * 1990-06-08 1995-09-19 Varian Associates, Inc. Electrostatic wafer clamp
US5325261A (en) * 1991-05-17 1994-06-28 Unisearch Limited Electrostatic chuck with improved release
US5444597A (en) * 1993-01-15 1995-08-22 Blake; Julian G. Wafer release method and apparatus
US5822171A (en) * 1994-02-22 1998-10-13 Applied Materials, Inc. Electrostatic chuck with improved erosion resistance
US5583736A (en) * 1994-11-17 1996-12-10 The United States Of America As Represented By The Department Of Energy Micromachined silicon electrostatic chuck
US5792562A (en) * 1995-01-12 1998-08-11 Applied Materials, Inc. Electrostatic chuck with polymeric impregnation and method of making
US5838529A (en) * 1995-12-22 1998-11-17 Lam Research Corporation Low voltage electrostatic clamp for substrates such as dielectric substrates
US5810933A (en) * 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
US5958813A (en) * 1996-11-26 1999-09-28 Kyocera Corporation Semi-insulating aluminum nitride sintered body
US6117246A (en) * 1997-01-31 2000-09-12 Applied Materials, Inc. Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck
JPH10284583A (ja) 1997-04-04 1998-10-23 Mitsubishi Electric Corp 静電チャック除電方法及び半導体製造装置
US6138745A (en) * 1997-09-26 2000-10-31 Cvc Products, Inc. Two-stage sealing system for thermally conductive chuck
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
US6149774A (en) * 1998-06-10 2000-11-21 Delsys Pharmaceutical Corporation AC waveforms biasing for bead manipulating chucks
JP3323135B2 (ja) * 1998-08-31 2002-09-09 京セラ株式会社 静電チャック
TW432453B (en) * 1998-11-12 2001-05-01 Applied Materials Inc Apparatus for protecting a substrate support surface and method of fabricating same
US6067222A (en) * 1998-11-25 2000-05-23 Applied Materials, Inc. Substrate support apparatus and method for fabricating same
US6236555B1 (en) * 1999-04-19 2001-05-22 Applied Materials, Inc. Method for rapidly dechucking a semiconductor wafer from an electrostatic chuck utilizing a hysteretic discharge cycle
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP2002009139A (ja) * 2000-06-20 2002-01-11 Nikon Corp 静電チャック

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5530616A (en) * 1993-11-29 1996-06-25 Toto Ltd. Electrostastic chuck
CN1157482A (zh) * 1995-11-24 1997-08-20 日本电气株式会社 静电式夹盘
US6556414B2 (en) * 2000-06-02 2003-04-29 Sumitomo Osaka Cement Co., Ltd. Electrostatic and vacuum chucking holding apparatus
WO2002001611A2 (en) * 2000-06-23 2002-01-03 Applied Materials, Inc. Electrostatic chuck and method of fabricating the same

Also Published As

Publication number Publication date
JP4725740B2 (ja) 2011-07-13
DE602004006639D1 (de) 2007-07-05
KR20060092245A (ko) 2006-08-22
EP1678752A1 (en) 2006-07-12
EP1678752B1 (en) 2007-05-23
TW200518144A (en) 2005-06-01
DE602004006639T2 (de) 2008-01-31
US6946403B2 (en) 2005-09-20
WO2005045921A1 (en) 2005-05-19
US20050099758A1 (en) 2005-05-12
JP2007510310A (ja) 2007-04-19
CN1894788A (zh) 2007-01-10
TWI360856B (en) 2012-03-21

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090805

Termination date: 20101028