KR20060092245A - Ｍｅｍｓ 정전 척의 제조 방법 - Google Patents

Ｍｅｍｓ 정전 척의 제조 방법 Download PDF

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Publication number
KR20060092245A
KR20060092245A KR1020067007513A KR20067007513A KR20060092245A KR 20060092245 A KR20060092245 A KR 20060092245A KR 1020067007513 A KR1020067007513 A KR 1020067007513A KR 20067007513 A KR20067007513 A KR 20067007513A KR 20060092245 A KR20060092245 A KR 20060092245A
Authority
KR
South Korea
Prior art keywords
conductive layer
forming
layer
substrate
semiconductor platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020067007513A
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English (en)
Korean (ko)
Inventor
피터 켈러맨
슈 퀸
어니 알렌
더글라스 브라운
Original Assignee
액셀리스 테크놀로지스, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 액셀리스 테크놀로지스, 인크. filed Critical 액셀리스 테크놀로지스, 인크.
Publication of KR20060092245A publication Critical patent/KR20060092245A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)
KR1020067007513A 2003-10-28 2004-10-28 Ｍｅｍｓ 정전 척의 제조 방법 Withdrawn KR20060092245A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/695,153 2003-10-28
US10/695,153 US6946403B2 (en) 2003-10-28 2003-10-28 Method of making a MEMS electrostatic chuck

Publications (1)

Publication Number Publication Date
KR20060092245A true KR20060092245A (ko) 2006-08-22

Family

ID=34549968

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067007513A Withdrawn KR20060092245A (ko) 2003-10-28 2004-10-28 Ｍｅｍｓ 정전 척의 제조 방법

Country Status (8)

Country Link
US (1) US6946403B2 (https=)
EP (1) EP1678752B1 (https=)
JP (1) JP4725740B2 (https=)
KR (1) KR20060092245A (https=)
CN (1) CN100524683C (https=)
DE (1) DE602004006639T2 (https=)
TW (1) TWI360856B (https=)
WO (1) WO2005045921A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9878901B2 (en) 2014-04-04 2018-01-30 Analog Devices, Inc. Fabrication of tungsten MEMS structures

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US20090115060A1 (en) * 2007-11-01 2009-05-07 Infineon Technologies Ag Integrated circuit device and method
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DE102008054982A1 (de) * 2008-12-19 2010-07-01 Carl Zeiss Smt Ag Wafer-Chuck für die EUV-Lithographie
US7932570B1 (en) * 2009-11-09 2011-04-26 Honeywell International Inc. Silicon tab edge mount for a wafer level package
US9330952B2 (en) 2009-12-30 2016-05-03 Solexel, Inc. Bipolar mobile electrostatic carriers for wafer processing
AU2011249478B2 (en) 2010-05-06 2014-12-04 Regenics As Use of cellular extracts for skin rejuvenation
CN103222043B (zh) * 2010-09-08 2016-10-12 恩特格林斯公司 一种高传导静电夹盘
US10242890B2 (en) * 2011-08-08 2019-03-26 Applied Materials, Inc. Substrate support with heater
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JP6359236B2 (ja) * 2012-05-07 2018-07-18 トーカロ株式会社 静電チャック
WO2014008110A1 (en) * 2012-07-06 2014-01-09 LuxVue Technology Corporation Compliant bipolar micro device transfer head with silicon electrodes
US8569115B1 (en) 2012-07-06 2013-10-29 LuxVue Technology Corporation Method of forming a compliant bipolar micro device transfer head with silicon electrodes
JP5441021B1 (ja) * 2012-09-12 2014-03-12 Ｔｏｔｏ株式会社 静電チャック
EP3459522B1 (en) 2012-12-10 2021-02-17 Regenics AS Use of egg cellular extracts for wound treatment
JP6526575B2 (ja) 2013-02-07 2019-06-05 エーエスエムエル ホールディング エヌ．ブイ． リソグラフィ装置及び方法
US20160230269A1 (en) * 2015-02-06 2016-08-11 Applied Materials, Inc. Radially outward pad design for electrostatic chuck surface
US10381248B2 (en) 2015-06-22 2019-08-13 Lam Research Corporation Auto-correction of electrostatic chuck temperature non-uniformity
US10763142B2 (en) 2015-06-22 2020-09-01 Lam Research Corporation System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
US10386821B2 (en) * 2015-06-22 2019-08-20 Lam Research Corporation Systems and methods for calibrating scalar field contribution values for a limited number of sensors including a temperature value of an electrostatic chuck and estimating temperature distribution profiles based on calibrated values
US9673025B2 (en) * 2015-07-27 2017-06-06 Lam Research Corporation Electrostatic chuck including embedded faraday cage for RF delivery and associated methods for operation, monitoring, and control
US20180025931A1 (en) * 2016-07-22 2018-01-25 Applied Materials, Inc. Processed wafer as top plate of a workpiece carrier in semiconductor and mechanical processing
US20180102247A1 (en) * 2016-10-06 2018-04-12 Asm Ip Holding B.V. Substrate processing apparatus and method of manufacturing semiconductor device
US10535505B2 (en) * 2016-11-11 2020-01-14 Lam Research Corporation Plasma light up suppression
US10943808B2 (en) * 2016-11-25 2021-03-09 Applied Materials, Inc. Ceramic electrostatic chuck having a V-shape seal band
US20180148835A1 (en) 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
EP3884513A4 (en) * 2018-11-19 2022-08-03 Entegris, Inc. ELECTROSTATIC CHUCK WITH CHARGE DISCHARGE COATING
JP7350153B2 (ja) * 2020-03-04 2023-09-25 東京エレクトロン株式会社 基板処理装置および基板処理方法
US12272585B2 (en) * 2021-04-27 2025-04-08 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer chuck structure with holes in upper surface to improve temperature uniformity
US12497697B2 (en) * 2021-10-08 2025-12-16 Applied Materials, Inc. Layer with discrete islands formed on a substrate support
KR102715367B1 (ko) * 2021-12-02 2024-10-08 세메스 주식회사 기판 지지 유닛 및 이를 포함하는 기판 처리 장치

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US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9878901B2 (en) 2014-04-04 2018-01-30 Analog Devices, Inc. Fabrication of tungsten MEMS structures

Also Published As

Publication number Publication date
JP4725740B2 (ja) 2011-07-13
DE602004006639D1 (de) 2007-07-05
EP1678752A1 (en) 2006-07-12
EP1678752B1 (en) 2007-05-23
TW200518144A (en) 2005-06-01
DE602004006639T2 (de) 2008-01-31
CN100524683C (zh) 2009-08-05
US6946403B2 (en) 2005-09-20
WO2005045921A1 (en) 2005-05-19
US20050099758A1 (en) 2005-05-12
JP2007510310A (ja) 2007-04-19
CN1894788A (zh) 2007-01-10
TWI360856B (en) 2012-03-21

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