CN100505288C - 包括将电极连接到衬底内的其它导电元件的导电元件的电子器件及其形成工艺 - Google Patents

包括将电极连接到衬底内的其它导电元件的导电元件的电子器件及其形成工艺 Download PDF

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Publication number
CN100505288C
CN100505288C CNB200580045246XA CN200580045246A CN100505288C CN 100505288 C CN100505288 C CN 100505288C CN B200580045246X A CNB200580045246X A CN B200580045246XA CN 200580045246 A CN200580045246 A CN 200580045246A CN 100505288 C CN100505288 C CN 100505288C
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China
Prior art keywords
conductive element
electrode
conductive
organic layer
electronic device
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Expired - Fee Related
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CNB200580045246XA
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English (en)
Chinese (zh)
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CN101091254A (zh
Inventor
俞钢
S·帕卡什
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H10D64/01304—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H10D64/01326—Aspects related to lithography, isolation or planarisation of the conductor
    • H10D64/01328—Aspects related to lithography, isolation or planarisation of the conductor by defining the conductor using a sidewall spacer mask, a transformation under a mask or a plating at a sidewall
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H10K50/156—Hole transporting layers comprising a multilayered structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CNB200580045246XA 2004-12-29 2005-12-29 包括将电极连接到衬底内的其它导电元件的导电元件的电子器件及其形成工艺 Expired - Fee Related CN100505288C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/025,110 US7189991B2 (en) 2004-12-29 2004-12-29 Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices
US11/025,110 2004-12-29

Publications (2)

Publication Number Publication Date
CN101091254A CN101091254A (zh) 2007-12-19
CN100505288C true CN100505288C (zh) 2009-06-24

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Family Applications (1)

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CNB200580045246XA Expired - Fee Related CN100505288C (zh) 2004-12-29 2005-12-29 包括将电极连接到衬底内的其它导电元件的导电元件的电子器件及其形成工艺

Country Status (7)

Country Link
US (2) US7189991B2 (https=)
EP (1) EP1839336A4 (https=)
JP (1) JP5255279B2 (https=)
KR (1) KR101261653B1 (https=)
CN (1) CN100505288C (https=)
TW (1) TWI377711B (https=)
WO (1) WO2006072024A2 (https=)

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US7189991B2 (en) * 2004-12-29 2007-03-13 E. I. Du Pont De Nemours And Company Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices
US7563392B1 (en) * 2004-12-30 2009-07-21 E.I. Du Pont De Nemours And Company Organic conductive compositions and structures
DE102005037290A1 (de) * 2005-08-08 2007-02-22 Siemens Ag Flachbilddetektor
US7642109B2 (en) * 2005-08-29 2010-01-05 Eastman Kodak Company Electrical connection in OLED devices
US7700471B2 (en) * 2005-12-13 2010-04-20 Versatilis Methods of making semiconductor-based electronic devices on a wire and articles that can be made thereby
US7638416B2 (en) * 2005-12-13 2009-12-29 Versatilis Llc Methods of making semiconductor-based electronic devices on a wire and articles that can be made using such devices
JP5191650B2 (ja) * 2005-12-16 2013-05-08 シャープ株式会社 窒化物半導体発光素子および窒化物半導体発光素子の製造方法
US8247824B2 (en) * 2005-12-19 2012-08-21 Matthew Stainer Electronic devices comprising electrodes that connect to conductive members within a substrate and processes for forming the electronic devices
US7314786B1 (en) * 2006-06-16 2008-01-01 International Business Machines Corporation Metal resistor, resistor material and method
US8153029B2 (en) * 2006-12-28 2012-04-10 E.I. Du Pont De Nemours And Company Laser (230NM) ablatable compositions of electrically conducting polymers made with a perfluoropolymeric acid applications thereof
US8227877B2 (en) * 2010-07-14 2012-07-24 Macronix International Co., Ltd. Semiconductor bio-sensors and methods of manufacturing the same
CN114616515A (zh) * 2019-10-10 2022-06-10 康宁公司 用于形成包覆电极的系统及方法
US11929388B2 (en) * 2021-09-23 2024-03-12 Apple Inc. Local passive matrix displays

Citations (3)

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CN1295349A (zh) * 1999-10-26 2001-05-16 株式会社半导体能源研究所 电光装置
CN1412854A (zh) * 2001-10-10 2003-04-23 株式会社日立制作所 图像显示设备
CN1437177A (zh) * 2002-02-06 2003-08-20 株式会社日立制作所 有机发光显示器

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KR100257811B1 (ko) * 1997-10-24 2000-06-01 구본준 액정표시장치의 기판의 제조방법
TW484238B (en) * 2000-03-27 2002-04-21 Semiconductor Energy Lab Light emitting device and a method of manufacturing the same
KR100437475B1 (ko) * 2001-04-13 2004-06-23 삼성에스디아이 주식회사 평판 디스플레이 장치용 표시 소자 제조 방법
KR100495702B1 (ko) * 2001-04-13 2005-06-14 삼성에스디아이 주식회사 유기 전계 발광 표시 장치 및 그 제조 방법
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KR100443831B1 (ko) * 2001-12-20 2004-08-09 엘지.필립스 엘시디 주식회사 액정표시소자의 제조 방법
KR100941129B1 (ko) * 2002-03-26 2010-02-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광장치 및 그의 제조방법
KR100435054B1 (ko) * 2002-05-03 2004-06-07 엘지.필립스 엘시디 주식회사 유기전계 발광소자와 그 제조방법
KR100478759B1 (ko) * 2002-08-20 2005-03-24 엘지.필립스 엘시디 주식회사 유기전계 발광소자와 그 제조방법
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JP3861816B2 (ja) 2003-01-24 2006-12-27 住友電気工業株式会社 光送受信モジュール及びその製造方法
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CN1890698B (zh) * 2003-12-02 2011-07-13 株式会社半导体能源研究所 显示器件及其制造方法和电视装置
US7189991B2 (en) * 2004-12-29 2007-03-13 E. I. Du Pont De Nemours And Company Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices
KR100700650B1 (ko) * 2005-01-05 2007-03-27 삼성에스디아이 주식회사 유기 전계 발광 장치 및 그 제조 방법
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CN1295349A (zh) * 1999-10-26 2001-05-16 株式会社半导体能源研究所 电光装置
CN1412854A (zh) * 2001-10-10 2003-04-23 株式会社日立制作所 图像显示设备
CN1437177A (zh) * 2002-02-06 2003-08-20 株式会社日立制作所 有机发光显示器

Also Published As

Publication number Publication date
WO2006072024A3 (en) 2007-05-18
KR20070093137A (ko) 2007-09-17
WO2006072024A2 (en) 2006-07-06
CN101091254A (zh) 2007-12-19
US20060138401A1 (en) 2006-06-29
JP2008527424A (ja) 2008-07-24
US20070085077A1 (en) 2007-04-19
KR101261653B1 (ko) 2013-05-06
TW200633283A (en) 2006-09-16
EP1839336A4 (en) 2010-12-15
TWI377711B (en) 2012-11-21
EP1839336A2 (en) 2007-10-03
JP5255279B2 (ja) 2013-08-07
US7488975B2 (en) 2009-02-10
US7189991B2 (en) 2007-03-13

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