KR101261653B1 - 전극을 기판 내의 다른 전도성 부재에 연결시키는 전도성부재를 포함하는 전자 장치 및 이 전자 장치를 형성하는프로세스 - Google Patents

전극을 기판 내의 다른 전도성 부재에 연결시키는 전도성부재를 포함하는 전자 장치 및 이 전자 장치를 형성하는프로세스 Download PDF

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KR101261653B1
KR101261653B1 KR1020077017237A KR20077017237A KR101261653B1 KR 101261653 B1 KR101261653 B1 KR 101261653B1 KR 1020077017237 A KR1020077017237 A KR 1020077017237A KR 20077017237 A KR20077017237 A KR 20077017237A KR 101261653 B1 KR101261653 B1 KR 101261653B1
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conductive member
electrode
electronic device
conductive
organic layer
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Korean (ko)
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KR20070093137A (ko
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강 유
시바 프라카시
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이 아이 듀폰 디 네모아 앤드 캄파니
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H10D64/01304—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H10D64/01326—Aspects related to lithography, isolation or planarisation of the conductor
    • H10D64/01328—Aspects related to lithography, isolation or planarisation of the conductor by defining the conductor using a sidewall spacer mask, a transformation under a mask or a plating at a sidewall
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H10K50/156—Hole transporting layers comprising a multilayered structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020077017237A 2004-12-29 2005-12-29 전극을 기판 내의 다른 전도성 부재에 연결시키는 전도성부재를 포함하는 전자 장치 및 이 전자 장치를 형성하는프로세스 Expired - Fee Related KR101261653B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/025,110 US7189991B2 (en) 2004-12-29 2004-12-29 Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices
US11/025,110 2004-12-29

Publications (2)

Publication Number Publication Date
KR20070093137A KR20070093137A (ko) 2007-09-17
KR101261653B1 true KR101261653B1 (ko) 2013-05-06

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KR1020077017237A Expired - Fee Related KR101261653B1 (ko) 2004-12-29 2005-12-29 전극을 기판 내의 다른 전도성 부재에 연결시키는 전도성부재를 포함하는 전자 장치 및 이 전자 장치를 형성하는프로세스

Country Status (7)

Country Link
US (2) US7189991B2 (https=)
EP (1) EP1839336A4 (https=)
JP (1) JP5255279B2 (https=)
KR (1) KR101261653B1 (https=)
CN (1) CN100505288C (https=)
TW (1) TWI377711B (https=)
WO (1) WO2006072024A2 (https=)

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US7563392B1 (en) * 2004-12-30 2009-07-21 E.I. Du Pont De Nemours And Company Organic conductive compositions and structures
DE102005037290A1 (de) * 2005-08-08 2007-02-22 Siemens Ag Flachbilddetektor
US7642109B2 (en) * 2005-08-29 2010-01-05 Eastman Kodak Company Electrical connection in OLED devices
US7700471B2 (en) * 2005-12-13 2010-04-20 Versatilis Methods of making semiconductor-based electronic devices on a wire and articles that can be made thereby
US7638416B2 (en) * 2005-12-13 2009-12-29 Versatilis Llc Methods of making semiconductor-based electronic devices on a wire and articles that can be made using such devices
JP5191650B2 (ja) * 2005-12-16 2013-05-08 シャープ株式会社 窒化物半導体発光素子および窒化物半導体発光素子の製造方法
US8247824B2 (en) * 2005-12-19 2012-08-21 Matthew Stainer Electronic devices comprising electrodes that connect to conductive members within a substrate and processes for forming the electronic devices
US7314786B1 (en) * 2006-06-16 2008-01-01 International Business Machines Corporation Metal resistor, resistor material and method
US8153029B2 (en) * 2006-12-28 2012-04-10 E.I. Du Pont De Nemours And Company Laser (230NM) ablatable compositions of electrically conducting polymers made with a perfluoropolymeric acid applications thereof
US8227877B2 (en) * 2010-07-14 2012-07-24 Macronix International Co., Ltd. Semiconductor bio-sensors and methods of manufacturing the same
CN114616515A (zh) * 2019-10-10 2022-06-10 康宁公司 用于形成包覆电极的系统及方法
US11929388B2 (en) * 2021-09-23 2024-03-12 Apple Inc. Local passive matrix displays

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US20030146693A1 (en) 2002-02-06 2003-08-07 Shingo Ishihara Organic light-emitting display device
US20030205763A1 (en) * 2002-05-03 2003-11-06 Lg.Philips Lcd Co., Ltd. Organic electroluminescent display device and method of fabricating the same

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KR100257811B1 (ko) * 1997-10-24 2000-06-01 구본준 액정표시장치의 기판의 제조방법
US6587086B1 (en) * 1999-10-26 2003-07-01 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
TW484238B (en) * 2000-03-27 2002-04-21 Semiconductor Energy Lab Light emitting device and a method of manufacturing the same
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US7189991B2 (en) * 2004-12-29 2007-03-13 E. I. Du Pont De Nemours And Company Electronic devices comprising conductive members that connect electrodes to other conductive members within a substrate and processes for forming the electronic devices
KR100700650B1 (ko) * 2005-01-05 2007-03-27 삼성에스디아이 주식회사 유기 전계 발광 장치 및 그 제조 방법
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Also Published As

Publication number Publication date
WO2006072024A3 (en) 2007-05-18
KR20070093137A (ko) 2007-09-17
WO2006072024A2 (en) 2006-07-06
CN101091254A (zh) 2007-12-19
US20060138401A1 (en) 2006-06-29
JP2008527424A (ja) 2008-07-24
US20070085077A1 (en) 2007-04-19
TW200633283A (en) 2006-09-16
EP1839336A4 (en) 2010-12-15
TWI377711B (en) 2012-11-21
EP1839336A2 (en) 2007-10-03
JP5255279B2 (ja) 2013-08-07
US7488975B2 (en) 2009-02-10
US7189991B2 (en) 2007-03-13
CN100505288C (zh) 2009-06-24

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