CN100479139C - 驱动器芯片和显示设备 - Google Patents

驱动器芯片和显示设备 Download PDF

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CN100479139C
CN100479139C CNB2004800404512A CN200480040451A CN100479139C CN 100479139 C CN100479139 C CN 100479139C CN B2004800404512 A CNB2004800404512 A CN B2004800404512A CN 200480040451 A CN200480040451 A CN 200480040451A CN 100479139 C CN100479139 C CN 100479139C
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matrix
output
pads
input
driver chip
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CN1906761A (zh
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黄星龙
吴元植
崔成洛
宋春镐
尹胄永
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Samsung Display Co Ltd
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Samsung Electronics Co Ltd
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Abstract

一种驱动器芯片,包括基体,其中形成了驱动器电路。多个导电隆起焊盘位于基体的顶面上,所述多个导电隆起焊盘沿基体的纵向排列在多行中。在基体的顶面上形成多个导电线,所述导电线将驱动器电路与多个导电隆起焊盘电连接。

Description

驱动器芯片和显示设备
技术领域
本公开涉及一种驱动器芯片和包括所述驱动器芯片的显示设备。更具体地,本公开涉及一种具有增大面积的隆起焊盘(bump)的驱动器芯片和包括该驱动器芯片的显示设备。
背景技术
诸如移动通信终端、数字摄像机、笔记本计算机和计算机监视器之类的电子设备包括图像显示设备,用以显示图像。例如液晶显示设备的平板显示设备通常被用作图像显示设备。
液晶显示设备使用液晶来显示图像。液晶显示设备被广泛用于图像显示行业,这是由于液晶显示设备较薄且表现出较轻的重量、较低的功率消耗和较低的操作电压。
液晶显示设备包括液晶显示板和用以操作所述液晶显示板的驱动器芯片。
驱动器芯片将外部源所提供的图像数据转换为用于操作液晶显示板的驱动信号。驱动器芯片还将该驱动信号提供给液晶显示器。驱动器芯片通过玻板基芯片(COG)工艺与液晶显示板相连,用以减少制造成本。根据COG密封工艺,各向异性导电膜(ACF)被插入在驱动器芯片和液晶显示板之间。然后,在高温下压缩ACF,以使驱动器芯片与液晶显示板电连接。
驱动器芯片包括导电隆起焊盘。导电隆起焊盘将驱动器芯片与液晶显示板电连接。导电隆起焊盘的数目可以与在液晶显示板上形成的数据线和栅极线的数目相等。随着液晶显示板具有更高的分辨率,数据线和栅极线的数目增加。因此,驱动器芯片中的导电隆起焊盘的数目同样增加。
然而,因为要形成导电隆起焊盘的面积有限,随着导电隆起焊盘的数目增加,导电隆起焊盘之间的间隔减小,从而使每一个导电隆起焊盘变小。因此,在使用ACF的COG工艺中,会发生故障,导致短路或开路。
发明内容
技术问题
本发明提供一种具有增长面积的隆起焊盘的驱动器芯片。
本发明还提供一种包括该驱动器芯片的显示设备。
技术方案
根据本发明示范实施例的驱动器芯片包括基体,其中形成了驱动器电路。多个导电隆起焊盘位于基体的顶面上,所述多个导电隆起焊盘沿基体的纵向被排列在多行中。在基体的顶面上形成多个导电线,使驱动器电路与多个导电隆起焊盘电连接。
根据本发明示范实施例的显示设备包括驱动器芯片和显示板。驱动器芯片包括基体,其中形成了驱动器电路。多个导电隆起焊盘位于基体的顶面上,所述多个导电隆起焊盘沿基体的纵向被排列在多行中。多个导电线形成在基体的顶面上,使驱动器电路与多个导电隆起焊盘电连接。显示板包括:第一衬底,具有与驱动器芯片相连的焊点部分以及与焊点部分相连的多个信号线。
根据至少一个本发明实施例,多个导电隆起焊盘排列在至少四行中。所述多个导电隆起焊盘可以包括:多个输入隆起焊盘,排列在至少一行中;以及多个第一输出隆起焊盘,排列在至少三行中。
根据至少一个本发明实施例的驱动器芯片还可以包括位于基体的边缘(edge)区域并且与驱动器电路电连接的多个导电端子。所述多个导电端子包括:多个输入端子,从外部源接收信号;以及多个输出端子,输出来自驱动器电路的信号。所述多个输入端子从驱动器电路的第一侧延伸,并且沿基体的纵向排列,所述多个输出端子从驱动器电路的与第一侧相对的第二侧延伸,并且沿基体的纵向排列。通过多个导电线,所述多个输入端子与至少一行输入隆起焊盘电连接,而且所述多个输出端子与基体的顶面上的至少三行第一输出隆起焊盘电连接。
根据至少一个本发明实施例的驱动器芯片还可以包括位于基体和多个导电线之间的撞击吸收层。
根据至少一个本发明实施例,排列在每一行中的第一输出隆起焊盘与相邻行中的第一输出隆起焊盘沿基体的纵向间隔开。关于基体的中心线对称地排列多个第一输出隆起焊盘。
根据至少一个本发明实施例的驱动器芯片还可以包括:多个第二输出隆起焊盘,位于多个输入隆起焊盘以及多个第一输入隆起焊盘的一侧,并沿实质上与基体的纵向垂直的基体方向排列在至少一行中;以及多个第三输出隆起焊盘,位于多个输入隆起焊盘和多个第一输出隆起焊盘的另一侧,并且沿实质上与基体的纵向垂直的基体方向排列在至少一行中。
附图说明
参考附图,通过详细描述本发明的示范实施例,本发明的以上及其它特征将变得显而易见,图中:
图1是根据本发明示范实施例的驱动器芯片的透视图;
图2是图1所示的驱动器芯片的顶视图;
图3是图1所示的驱动器芯片中沿与基体的顶面平行的平面获取的截面图;
图4是沿图1的线A-A’获取的截面图;
图5是示出了在图2的输出隆起焊盘和导电线之间的连接的放大顶视图;
图6是隆起焊盘面积相对于输出隆起焊盘行数的图;
图7是根据本发明另一个实施例的驱动器芯片的顶视图;
图8是根据本发明另一个实施例的驱动器芯片的顶视图;
图9是根据本发明示范实施例的显示设备的透视图;
图10是图9所示的第一衬底的焊点部分的局部放大顶视图;以及
图11是沿图9的线B-B’获取的截面图。
具体实施方式
下面,参考附图,详细描述本发明的优选实施例。
图1是根据本发明示范实施例的驱动器芯片的透视图。图2是图1所示的驱动器芯片的顶视图。
参考图1和2,驱动器芯片100包括:基体110、导电隆起焊盘120和导电线130。
基体110由导电材料组成,并具有矩形平行六面体形状。在基体110内形成将来自外部源的图像信号转换为驱动信号的驱动器电路112(参见图3)。驱动器电路112由半导体制造工艺形成。
在基体110上形成至少四行导电隆起焊盘120。沿与基体110的纵向平行的第一方向在基体110上对准每一行。每一个导电隆起焊盘120具有沿与基体110的顶面平行的平面获取的四边形横截面。
导电隆起焊盘120包括输入隆起焊盘122和输出隆起焊盘124。可以沿第一方向在一行中对准输入隆起焊盘122。可以沿第一方向在三行中对准输出隆起焊盘124。根据导电隆起焊盘120的数目,可以在至少一行中对准输入隆起焊盘122,以及可以在至少三行中对准输出隆起焊盘124。输入隆起焊盘122和输出隆起焊盘124可以具有实质上相同的形状和尺寸。然而,当希望的输入隆起焊盘122的数目相对较小时,输入隆起焊盘122可以具有比输出隆起焊盘124更大的尺寸。
在其上形成了导电隆起焊盘的基体110的顶面上形成导电线130。在与基体110的第一方向平行的边缘区域中,导电线130与驱动器电路相连。每一个导电线130从边缘区域延伸到基体110的中心区域,以便与每一个导电隆起焊盘120相连。因此,基体110中的驱动器电路112通过导电线130与导电隆起焊盘120电连接。
通过在基体110的顶面上形成导电线130,可以将导电隆起焊盘120的位置转移到基体130的顶面的中心区域。此外,导电隆起焊盘120可以形成至少四行。
图3是图1所示的驱动器芯片中沿与基体的顶面平行的平面获取的截面图。图4是沿图1的线A-A’获取的截面图。
参考图3和4,基体110具有通过半导体制造工艺在基体110内形成的驱动器电路112。驱动器电路112将来自外部源的图像信号转换为驱动信号,以操作显示板(未示出)。
基体110被划分为单元区域(cell region)110a和外围区域110b。与单元区域110a相邻的外围区域110b环绕单元区域110a。
基体110具有与驱动器电路112相连的导电端子113。导电端子113从驱动器电路112延伸到外围区域110b。导电端子113包括输入端子114和输出端子115。输入端子114从外部源接收图像信号,而且输出端子115输出来自驱动器电路112的驱动信号。输入端子114从驱动器电路112的第一侧延伸,以便沿基体110的纵向排列。输出端子115从与第一侧相对的、驱动器电路112的第二侧延伸,以便沿基体110的纵向排列。根据希望的输出端子115的数目,输出端子115可以沿基体110的纵向排列在至少两行中。可选地,输出信号115可以沿驱动器电路112的第一侧、第三侧和第四侧排列在至少一行中。第三和第四侧实质上与驱动器电路112的第一侧垂直。
输入端子114和输出端子115分别通过在基体110的顶面上形成的导电线130与输入隆起焊盘122和输出隆起焊盘124电连接。
参考图4,在基体110的外围区域110b中形成导电端子113。导电端子113还外部地暴露于在基体110的外侧。在基体110的单元区域110a中形成导电隆起焊盘120。导电线130的一个末端部分与外围区域110b中的相应导电端子113相连。导电线130的另一个末端部分延伸到单元区域110a,以便与导电隆起焊盘120相连。导电线130由具有较低阻抗的金属材料组成,从而以稳定的状态将导电端子113与导电隆起焊盘120相连。
如上所述,通过使用导电线130,代替其上形成了导电端子113的外围区域110b,可以在单元区域110a中形成导电隆起焊盘120。因此,可以减小外围区域的尺寸,从而可以减小基体110的尺寸。
驱动器芯片100还可以包括在基体110和导电线130之间的撞击吸收层140。撞击吸收层140减少了通过导电隆起焊盘120对驱动器电路120的外部撞击。驱动器芯片100通过热压缩工艺与外部显示板(未示出)相连。在压缩工艺期间,可以将外部撞击转移到直接与显示板相连的导电隆起焊盘120上。因为导电隆起焊盘120排列在与驱动器电路112相对应的单元区域110a中,可以将转移到导电隆起焊盘120的外部撞击传送给驱动器电路,从而导致驱动器电路112的故障。因此,在导电隆起焊盘120和驱动器电路112之间形成的撞击吸收层140可以减少驱动器电路112上的外部装置。优选地,撞击吸收层140包括绝缘材料,以使导电线130彼此绝缘。
图5是示出了在图2的输出隆起焊盘和导电线之间的连接的放大顶视图。
参考图5,输出隆起焊盘124具有实质上相等的隆起焊盘宽度(BW)和隆起焊盘长度(BL)的四边形形状。输出隆起焊盘124在基体110的顶面上被排列在三行中。沿与基体110的纵向平行的第一方向排列每一行输出隆起焊盘124。三行彼此间隔第一距离d1。排列在每一行中的输出隆起焊盘124彼此间隔第二距离d2。沿实质上与基体110的第一方向垂直的第二方向定位定向每一行的输出隆起焊盘124。
导电线130从基体110的边缘区域延伸,以与相应的输出隆起焊盘124相连。每一个导电线130具有线宽LW。导电线130彼此间隔第三距离d3。
通过使输出隆起焊盘124排列在三行中,可以增加与外部显示板接触的输出隆起焊盘124的面积。
例如,具有大约240×320分辨率的显示板所使用的驱动器芯片100包括大约1040个输出隆起焊盘124,并具有20mm(宽)×3mm(长)的尺寸。通常,大约1040个输出隆起焊盘125的排列确定了输出隆起焊盘124的面积。
表1
 线宽(μm)   线之间的间隔(μm)  线与隆起焊盘之间的间隔(μm)   隆起焊盘之间的间隔(μm)  间距(μm)   隆起焊盘宽度(μm)
  2行  10   -  5   20  40   20
  3行  10   5  5   35  60   25
  4行  10   5  5   50  80   30
  5行  10   5  5   65  100   35
  6行  10   5  5   80  120   40
表1中示出了根据输出隆起焊盘124行数的隆起焊盘宽度(BL)。在表1中,线宽、线之间的间隔以及线与隆起焊盘之间的间隔取决于显示板的设计原理。在这种情况下,导电线130的线宽(LW)大约是10μm,导电线130之间的第三距离d3大约是5μm。导电线130和输出隆起焊盘124之间的间隔大约是5μm。输出隆起焊盘124之间的距离d2由线宽LW、线之间的间隔d3以及线与隆起焊盘之间的间隔确定。间距表示输出隆起焊盘124的中心和相邻输出隆起焊盘124的中心之间的距离。间距由基体110的顶面面积和输出隆起焊盘124的数目确定。隆起焊盘宽度BW与间距减去输出隆起焊盘124之间的间隔相对应。
如表1所示,输出隆起焊盘124的隆起焊盘宽度(BW)随行数增加而增加。因此,在输出隆起焊盘124的隆起焊盘长度(BL)恒定的情况下,输出隆起焊盘124的尺寸随行数增加而增加。因此,与所有输出隆起焊盘124的总面积相对应的隆起焊盘面积同样增加。
图6是隆起焊盘面积对输出隆起焊盘行数的图。在图6中,输出隆起焊盘124的隆起焊盘长度(BL)大约是80μm。
参考图6,隆起焊盘面积随行数增加而增加。具体地,当输出隆起焊盘124排列在2行中时,与隆起焊盘宽度、隆起焊盘长度以及输出隆起焊盘124数目的乘积相对应的隆起焊盘面积大约是1664μm2。当以3行排列输出隆起焊盘124时,隆起焊盘面积大约是2080μm2
优选地,隆起焊盘面积超过大约2000μm2,以使驱动器芯片100与显示板稳定相连。因此,如图6所示,可以通过将输出隆起焊盘124排列在至少3行中,来提高驱动器芯片和显示板之间的连接的可靠性。
图7是示出了根据本发明另一个实施例的驱动器芯片的顶视图。
参考图7,驱动器芯片200包括基体210、输入隆起焊盘220、输出隆起焊盘230以及导电线240。
沿与基体210的纵向相对应的基体210的第一方向,在一行中排列输入隆起焊盘220。
沿第一方向在三行中排列输出隆起焊盘230。排列在每一行中的输出隆起焊盘230与相邻行中的输出隆起焊盘230沿第一方向间隔第四距离d4。考虑到导电线240的线宽、输出隆起焊盘230和导电线240之间的距离等来确定第四距离d4。
输出隆起焊盘230关于cyber中心线CL对称地排列,该线CL将基体120的长度划分为实质上相等的两部分。各向异性导电膜(ACF)被用于将驱动器芯片200与外部显示板相连。当驱动器芯片200与显示板相结合时,包含在ACF中的粘合树脂在输出隆起焊盘230之间流动。通过对称地形成输出隆起焊盘230,粘合树脂可以均匀地分布在驱动器芯片200上。
每一个导电线240沿直线从延伸基体210的边缘区域延伸,以便与相应的输出隆起焊盘230相连。应当理解,在本发明的其它示范实施例中,导电线240可以不沿直线延伸。
当导电线240从基体210的边缘区域延伸到输出隆起焊盘230时,在与另一行中的输出隆起焊盘230相对应的位置,输出隆起焊盘230和导电线240之间的距离可以增加。输出隆起焊盘230和导电线240之间距离的增加可以减少在相邻的输出隆起焊盘230和导电线240之间产生的信号失真。
在本发明的本实施例中,输出隆起焊盘230排列在三行中。可选地,根据输出隆起焊盘230的行数,输出隆起焊盘230可以排列在至少四行中。
图8是示出了根据本发明另一个实施例的驱动器芯片的顶视图。
参考图8,驱动器芯片300包括:基体310、输入隆起焊盘320、第一输出隆起焊盘330、第二输出隆起焊盘340、第三输出隆起焊盘350以及导电线360。在本发明的本实施例中,输入隆起焊盘320和第一输出隆起焊盘330的结构实质上与图2所示的本发明实施例中的相同,因此此处不再详细描述。
第二和第三输出隆起焊盘340和350分别形成于输入隆起焊盘320和第一输出隆起焊盘330的两侧。第二和第三输出隆起焊盘340和350沿实质上与基体310的纵向垂直的基体310的第二方向被排列在至少一行中。尽管在图8中第二和第三输出隆起焊盘340和350排列在两行中,优选地,第二和第三输出隆起焊盘340和350被排列在与第一输出隆起焊盘330的行数相等的行数中。
例如,当结合了驱动器芯片300的显示板是液晶显示板时,第一输出隆起焊盘330与在液晶显示板上形成的数据线相连。第二和第三输出隆起焊盘340和350连接到在液晶显示板上与数据线垂直的栅极线。
已经描述了根据本发明的驱动器芯片的各种示范实施例。下面,描述具有驱动器芯片的显示设备。
图9是示出了根据本发明示范实施例的显示设备的透视图。图10是示出了图9所示的第一衬底的焊点部分的局部放大顶视图。本发明本实施例中的驱动器芯片具有实质上与图1和2中驱动器芯片100相同的结构。因此,相同的参考符号用于相同的单元,并省略其描述。
参考图9和10,显示设备500包括驱动器芯片100和显示板600。
显示板600的示例包括液晶显示板。显示板600包括第一衬底610、与第一衬底相对应的第二衬底620以及插入在第一衬底610和第二衬底620之间的液晶层615。
第一衬底610由透明玻璃制成。按照矩阵形状在第一衬底610上形成薄膜晶体管,作为开关器件。薄膜晶体管的源极端子与数据线相连,并且薄膜晶体管的栅极端子与栅极线相连。漏极与由透明导电材料制成的象素电极相连。
第一衬底610包括与驱动器芯片100相连的焊点部分700以及与焊点部分700相连的多个信号线730和740。
焊点部分700具有输入焊点710和输出焊点720。
在第一衬底710上沿一行形成输入焊点710。每一个输入焊点710与多个信号线730和740中相应的输入信号线730相连。输入信号线730与信号施加构件(未示出)相连,信号施加构件与第一衬底610相连,用于将图像信号从外部施加到第一衬底610。输入焊点710与输入隆起焊盘122相对应,以将图像信号从信号施加构件和输入信号线730施加到驱动器芯片100。
在与输入焊点710间隔预定距离的三行中形成输出焊点720。输出焊点720与驱动器芯片100上的输出焊点124相对应。每一个输出焊点720与多个信号线730和740中相应的输出信号线740相连。输出信号线740将从驱动器芯片100输出的图像信号施加到第一衬底610。输出信号线740在绝缘条件下与数据线、以及与数据线相交的栅极线相连。数据线613沿第一方向在第一衬底610上延伸,栅极线614沿实质上与第一方向垂直的第二方向在第一衬底610上延伸。
根据驱动器芯片100的隆起焊盘的排列,可以修改焊点部分700。因为焊点部分700的输入焊点710和输出焊点720分别与驱动器芯片100的输入隆起焊盘122和输出隆起焊盘124相对应,输入焊点710和输出焊点720的排列根据输入隆起焊盘122和输出隆起焊盘124的排列而改变。
第二衬底620具有通过薄膜制造工艺在其上形成的红、绿和蓝象素。在第二衬底620上形成由透明导电材料构成的公共电极622。
在显示板600中,给薄膜晶体管612的栅极端子和源极端子供电,以导通薄膜晶体管612。在象素电极和公共电极622之间形成电场。电场改变第一衬底610和第二衬底620之间的液晶的排列。液晶的排列改变改变了透光系数,用以显示图像。
驱动器芯片100与第一衬底610的焊点部分700相连。
图11是沿图9的线B-B’获取的截面图。
参考图11,通过COG工艺将驱动器芯片100安装在第一衬底610的焊点部分700上。在将各向异性导电膜800插入在驱动器芯片100和第一衬底610之间之后,驱动器芯片100与第一衬底610相结合。
各向异性导电膜800包括粘合树脂810和随机分布在粘合树脂810中的多个导电微粒820。
导电微粒820具有球形形状。导电微粒820位于输入隆起焊盘122和输入焊点710之间,且位于输出隆起焊盘124和输出焊点720之间。外部提供的压力使导电粒子820变形,并且经由粘合树脂810,使输入隆起焊盘122与输入焊点710相连,并且使输出隆起焊盘124与输出焊点720相连。
优选地,粘合树脂810由热固性树脂组成。由外部提供的热来固化粘合树脂,以使驱动器芯片100固定在第一衬底610上。
在本发明的本实施例中,作为显示板610的示例描述了液晶显示板。本领域的技术人员应当理解,可以将例如等离子体显示板和有机电致发光显示板的各种显示板用作显示板。
在包括根据本发明各种示范实施例的驱动器芯片的显示板中,与显示板相连的导电隆起焊盘可以通过导电线转移到驱动器芯片的中心部分。导电隆起焊盘可以排列在至少四行中。
将导电隆起焊盘排列在至少四行中会增加导电隆起焊盘之间的距离和每一个导电隆起焊盘的尺寸。
因此,可以提高显示板和驱动器芯片之间的连接可靠性。
尽管已经描述了本发明的示范实施例,可以理解,本发明不应该受限于这些示范实施例,并且在按照所附权利要求的本发明的精神和范围内,可以由本领域的普通技术人员进行各种改变和修改。

Claims (24)

1.一种驱动器芯片,包括:
基体,包括在其中形成的驱动器电路,所述基体的顶面包括与驱动器电路相对应的单元区域以及围绕所述单元区域的外围区域;
多个导电隆起焊盘,位于基体的顶面的单元区域上,所述多个导电隆起焊盘被沿基体的纵向排列在多行中;
多个导电端子,位于所述边缘区域中并且与驱动器电路电连接;以及
多个导电线,在基体的顶面上延伸,并且将所述多个导电端子与多个导电隆起焊盘电连接。
2.根据权利要求1所述的驱动器芯片,其中,所述多个导电隆起焊盘被排列在至少四行中。
3.根据权利要求2所述的驱动器芯片,其中,所述多个导电隆起焊盘包括:
排列在至少一行中的多个输入隆起焊盘;以及
排列在至少三行中的多个第一输出隆起焊盘。
4.根据权利要求1所述的驱动器芯片,其中,所述多个导电端子包括:
多个输入端子,从外部源接收信号;以及
多个输出端子,输出来自驱动器电路的信号。
5.根据权利要求4所述的驱动器芯片,其中,所述多个输入端子从驱动器电路的第一侧延伸,并且沿基体的纵向排列,所述多个输出端子从与第一侧相对的、驱动器电路的第二侧延伸,并且沿基体的纵向排列。
6.根据权利要求4所述的驱动器芯片,其中,所述多个输入端子通过多个导电线与基体顶面上的所述至少一行输入隆起焊盘电连接,而且所述多个输出端子通过多个导电线与基体顶面上的所述至少三行第一输出隆起焊盘电连接。
7.根据权利要求6所述的驱动器芯片,还包括:
撞击吸收层,位于基体和多个导电线之间。
8.根据权利要求3所述的驱动器芯片,其中,排列在每一行中的第一输出隆起焊盘与相邻行中的第一输出隆起焊盘沿基体的纵向间隔开。
9.根据权利要求8所述的驱动器芯片,其中,关于基体的中心线对称地排列所述多个第一输出隆起焊盘。
10.根据权利要求3所述的驱动器芯片,还包括:
多个第二输出隆起焊盘,位于多个输入隆起焊盘和多个第一输出隆起焊盘的一侧,并沿与基体的纵向垂直的基体方向排列在至少一行中;以及
多个第三输出隆起焊盘,位于多个输入隆起焊盘和多个第一输出隆起焊盘的另一侧,并且沿与基体的纵向垂直的基体方向排列在至少一行中。
11.一种显示设备,包括根据权利要求1所述的驱动器芯片。
12.一种显示设备,包括:
驱动器芯片,包括:
基体,包括在其中形成的驱动器电路,所述基体的顶面包括与驱动器电路相对应的单元区域以及围绕所述单元区域的外围区域;
多个导电隆起焊盘,位于基体的顶面的单元区域上,所述多个导电隆起焊盘被沿基体的纵向排列在多行中;
多个导电端子,位于基体的所述边缘区域中,并且与所述驱动器电路电连接;
多个导电线,在基体的顶面上延伸,并且将多个导电端子与多个导电隆起焊盘电连接;以及
显示板,包括:
第一衬底,包括与驱动器芯片相连的焊点部分以及与焊点部分相连的多个信号线。
13.根据权利要求12所述的显示设备,其中,所述多个导电隆起焊盘排列在至少四行中。
14.根据权利要求13所述的显示设备,其中,所述多个导电隆起焊盘包括:
排列在至少一行中的多个输入隆起焊盘;以及
排列在至少三行中的多个第一输出隆起焊盘。
15.根据权利要求14所述的显示设备,其中,所述焊点部分还包括:
多个输入焊点,位于焊点部分中,与所述多个输入隆起焊盘对应地排列;以及
多个输出焊点,位于焊点部分中,与所述多个第一输出隆起焊盘对应地排列。
16.根据权利要求15所述的显示设备,其中,所述多个信号线包括多个输入信号线和多个输出信号线,所述多个输入信号线将图像信号施加到第一衬底的所述多个输入焊点,和所述多个输出信号线将来自所述多个输出焊点的驱动信号施加到形成在第一衬底上的多个数据线以及多个栅极线。
17.根据权利要求16所述的显示设备,其中,显示板还包括:
第二衬底,位于第一衬底上;
公共电极,形成在第二衬底上,与第一衬底的所述多个数据线和所述多个栅极线相对;以及
液晶层,位于第一衬底和第二衬底之间。
18.根据权利要求14所述的显示设备,其中,所述多个导电端子包括:
多个输入端子,从外部源接收信号;以及
多个输出端子,输出来自驱动器电路的信号。
19.根据权利要求18所述的显示设备,其中,所述多个输入端子从驱动器电路的第一侧延伸,并且沿基体的纵向排列,所述多个输出端子从与第一侧相对的、驱动器电路的第二侧延伸,并且沿基体的纵向排列。
20.根据权利要求18所述的显示设备,其中,所述多个输入端子通过多个导电线与基体顶面上的至少一行输入隆起焊盘电连接,而且所述多个输出端子通过多个导电线与基体顶面上的至少三行第一输出隆起焊盘电连接。
21.根据权利要求20所述的显示设备,还包括:
撞击吸收层,位于基体和多个导电线之间。
22.根据权利要求14所述的显示设备,其中,排列在每一行中的所述第一输出隆起焊盘与相邻行中的第一输出隆起焊盘沿基体的纵向间隔开。
23.根据权利要求22所述的显示设备,其中,关于基体的中心线对称地排列所述多个第一输出隆起焊盘。
24.根据权利要求14所述的显示设备,还包括:
多个第二输出隆起焊盘,位于多个输入隆起焊盘和多个第一输入隆起焊盘的一侧,并沿与基体的纵向垂直的基体方向排列在至少一行中;以及
多个第三输出隆起焊盘,位于多个输入隆起焊盘和多个第一输出隆起焊盘的另一侧,并且沿与基体的纵向垂直的基体方向排列在至少一行中。
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