CN100477021C - 用于在挠性基底材料上制备电阻器的技术 - Google Patents

用于在挠性基底材料上制备电阻器的技术 Download PDF

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Publication number
CN100477021C
CN100477021C CNB038250748A CN03825074A CN100477021C CN 100477021 C CN100477021 C CN 100477021C CN B038250748 A CNB038250748 A CN B038250748A CN 03825074 A CN03825074 A CN 03825074A CN 100477021 C CN100477021 C CN 100477021C
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CN
China
Prior art keywords
layer
flexible substrate
semiconductor device
region
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038250748A
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English (en)
Chinese (zh)
Other versions
CN1695209A (zh
Inventor
凯文·M·杜罗彻
理查德·J·塞亚
维克拉姆·B·克里什纳默西
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General Electric Co
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General Electric Co
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Publication date
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Publication of CN1695209A publication Critical patent/CN1695209A/zh
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Publication of CN100477021C publication Critical patent/CN100477021C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H01C3/06—Flexible or folding resistors, whereby such a resistor can be looped or collapsed upon itself
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
    • H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006—Thin film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
CNB038250748A 2002-09-30 2003-08-28 用于在挠性基底材料上制备电阻器的技术 Expired - Fee Related CN100477021C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/261,052 2002-09-30
US10/261,052 US6709944B1 (en) 2002-09-30 2002-09-30 Techniques for fabricating a resistor on a flexible base material

Publications (2)

Publication Number Publication Date
CN1695209A CN1695209A (zh) 2005-11-09
CN100477021C true CN100477021C (zh) 2009-04-08

Family

ID=31977937

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038250748A Expired - Fee Related CN100477021C (zh) 2002-09-30 2003-08-28 用于在挠性基底材料上制备电阻器的技术

Country Status (7)

Country Link
US (2) US6709944B1 (enExample)
EP (1) EP1550140A1 (enExample)
JP (1) JP2006501670A (enExample)
KR (1) KR20050065565A (enExample)
CN (1) CN100477021C (enExample)
AU (1) AU2003268263A1 (enExample)
WO (1) WO2004032154A1 (enExample)

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US20100044080A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
US20100038119A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
US7825491B2 (en) * 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
WO2001017320A1 (en) * 1999-08-27 2001-03-08 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
KR100674824B1 (ko) 2004-12-08 2007-01-25 삼성전기주식회사 자기저항소자 제조방법
EP1750309A3 (en) * 2005-08-03 2009-07-29 Samsung Electro-mechanics Co., Ltd Light emitting device having protection element
US7923844B2 (en) * 2005-11-22 2011-04-12 Shocking Technologies, Inc. Semiconductor devices including voltage switchable materials for over-voltage protection
US20100263200A1 (en) * 2005-11-22 2010-10-21 Lex Kosowsky Wireless communication device using voltage switchable dielectric material
US8222116B2 (en) 2006-03-03 2012-07-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
US7981325B2 (en) * 2006-07-29 2011-07-19 Shocking Technologies, Inc. Electronic device for voltage switchable dielectric material having high aspect ratio particles
US20080032049A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having high aspect ratio particles
EP2084748A4 (en) * 2006-09-24 2011-09-28 Shocking Technologies Inc VOLTAGE GRADUATED RESPONSE VOLTAGE-SWITCHABLE DIELECTRIC MATERIAL, AND METHOD FOR MANUFACTURING THE SAME
US20120119168A9 (en) * 2006-11-21 2012-05-17 Robert Fleming Voltage switchable dielectric materials with low band gap polymer binder or composite
JP5374063B2 (ja) * 2007-03-28 2013-12-25 三菱重工業株式会社 金属溶解用ルツボ及びその表面処理方法
US7793236B2 (en) * 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US20100006884A1 (en) * 2007-08-07 2010-01-14 Epistar Corporation Light Emitting Device and Manufacturing Method Therof
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US7727808B2 (en) * 2008-06-13 2010-06-01 General Electric Company Ultra thin die electronic package
US20100047535A1 (en) * 2008-08-22 2010-02-25 Lex Kosowsky Core layer structure having voltage switchable dielectric material
US20100065785A1 (en) * 2008-09-17 2010-03-18 Lex Kosowsky Voltage switchable dielectric material containing boron compound
JP2012504870A (ja) * 2008-09-30 2012-02-23 ショッキング テクノロジーズ インコーポレイテッド 導電コアシェル粒子を含有する電圧で切替可能な誘電体材料
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US8362871B2 (en) * 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
KR101679099B1 (ko) 2009-03-26 2016-11-23 쇼킹 테크놀로지스 인코포레이티드 전압 스위칭형 유전 물질을 갖는 소자
US9053844B2 (en) * 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
KR101065409B1 (ko) * 2009-11-04 2011-09-16 삼성모바일디스플레이주식회사 유기 발광 조명 장치
US20110198544A1 (en) * 2010-02-18 2011-08-18 Lex Kosowsky EMI Voltage Switchable Dielectric Materials Having Nanophase Materials
US9224728B2 (en) * 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9320135B2 (en) * 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
CN102324289B (zh) * 2011-05-31 2014-05-14 四平市吉华高新技术有限公司 厚膜电阻板及其制造方法
TWI497535B (zh) 2011-07-28 2015-08-21 Cyntec Co Ltd 具有軟性材料層之微電阻元件及其製造方法
CN102903467B (zh) * 2011-07-29 2016-04-06 乾坤科技股份有限公司 具有软性材料层的微电阻元件及其制造方法
DE102012208730A1 (de) * 2012-05-24 2013-11-28 Osram Opto Semiconductors Gmbh Optoelektronische Bauelementevorrichtung und Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung
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CN111780653B (zh) * 2020-06-09 2022-01-07 中国电子科技集团公司第四十九研究所 基于碳膜纳米导电材料的电阻体及其制备方法
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CN113410382B (zh) * 2021-06-15 2022-11-29 西安微电子技术研究所 一种铬硅系薄膜电阻及其制备方法
CN114256063A (zh) * 2021-12-16 2022-03-29 上海华虹宏力半导体制造有限公司 一种图形轮廓质量提高方法
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EP0388888A2 (en) * 1989-03-20 1990-09-26 Hitachi, Ltd. Metal-organic macromolecular synthetic resin composite and process for producing the same
CN1162825A (zh) * 1996-03-11 1997-10-22 松下电器产业株式会社 电阻器及其制造方法

Also Published As

Publication number Publication date
KR20050065565A (ko) 2005-06-29
US20040063294A1 (en) 2004-04-01
US7158383B2 (en) 2007-01-02
US6709944B1 (en) 2004-03-23
JP2006501670A (ja) 2006-01-12
CN1695209A (zh) 2005-11-09
EP1550140A1 (en) 2005-07-06
AU2003268263A1 (en) 2004-04-23
WO2004032154A1 (en) 2004-04-15
US20040114336A1 (en) 2004-06-17

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Termination date: 20090928