CN100453234C - 具有下夹具的丝焊器 - Google Patents

具有下夹具的丝焊器 Download PDF

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CN100453234C
CN100453234C CNB200410011991XA CN200410011991A CN100453234C CN 100453234 C CN100453234 C CN 100453234C CN B200410011991X A CNB200410011991X A CN B200410011991XA CN 200410011991 A CN200410011991 A CN 200410011991A CN 100453234 C CN100453234 C CN 100453234C
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lower clamp
pressing plate
bolt
heating plate
finger
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斯特凡·巴隆
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Unaxis Shi Weiss Co Ltd
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    • H—ELECTRICITY
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Abstract

一种丝焊器(W)，具有下夹具(1)，用于将系统支架(7)的指形件(9)压紧在加热板(13)上。该下夹具(1)能够升高和降低。根据本发明的下夹具(1)具有用于支承压板(4)的四个导向件(2)，每个导向件(2)具有支撑面(3)和由驱动装置(6’、6)移动的螺栓(5’、5)。该下夹具(1)处于升高状态时该压板(4)支撑在该四个导向件(2)的支撑面(3)上。该下夹具(1)处于降低状态时该四个导向件(2)的螺栓(5’、5)将该压板(4)压紧在该系统支架(7)的指形件(9)上。四个螺栓(5’、5)中的至少一个可以单独移动，从而压板(4)能够暂时固定该系统支架(7)，而不需将所有的指形件(9)事先压紧在加热板(13)上。

Description

具有下夹具的丝焊器
技术领域
本发明涉及丝焊器，其具有下夹具(downholder)，用于将系统支架、特别是引丝框架的指形件压紧在加热板。
背景技术
在半导体芯片和系统支架之间电线连接的形成在技术行话中称之为丝焊，将被焊接的系统支架的指形件由压板压紧在加热板上。该压板具有窗口，以便能够接近该指形件的端部以进行结合。
丝焊器是一种在半导体芯片安装到基片之后利用其进行半导体芯片布线的设备。丝焊器具有一个细管，它夹在电极臂(horn)的末端。细管用于将焊丝固定到半导体芯片上的接点和基片上的接点并且引导这两个接点之间的焊丝。在形成半导体芯片上的接点和基片上的接点之间的焊丝连接时，首先将从细管突出的焊丝的端部熔制成焊丝球。随后，利用压力和超声波将焊丝球固定到半导体芯片上的接点。为此目的，超声波从超声换能器施加于电极臂。这种处理过程称为球焊。然后焊丝被拉至需要的长度，形成焊丝圈并焊接于基片上的接点。该处理过程的最后部分称为楔焊。在将焊丝固定到基片上的接点之后，扯断焊丝可以开始下一个焊接过程。
从瑞士专利说明书CH680176中已经知道下夹具，其中，压板具有活动轴承，以便将指形件均匀地压紧在支撑面上。该下夹具为系统支架很好地工作，其中，相邻指形件之间的平均距离，在技术行话中称之为间距，不小于一定值。但是当间距为50、40或仅仅25微米时，因为系统支架与压板或加热板具有不同的热膨胀系数会产生很多问题。
本发明的目的是开发一种下夹具，其适合用于加工具有40微米或更小的非常小的间距的系统支架。
发明内容
一种丝焊器，具有加热板和下夹具，带有待布线的半导体芯片的系统支架设置在该加热板上，而下夹具用来将系统支架的指形件压紧在加热板上。该下夹具包括可更换的压板并且能够升高和降低。在下夹具升高的情况下可以移动该系统支架。在下夹具降低的情况下进行半导体芯片的布线。根据本发明，下夹具具有四个用于支承压板的导向件。每个导向件具有支撑面和螺栓或销钉或类似的零件，其能够被驱动装置所移动。在下夹具升高的情况下，压板支靠在四个导向件的支撑面上并且螺栓也升高，因此它们不接触压板。降低下夹具分两部进行。第一步，降低下夹具，从而螺栓之一也被降低并压在压板上，同时其他螺栓升高并且不接触压板或至少不对压板产生作用力。因为，在降低时，压板碰撞系统支架的指形件，它被接触点所倾斜。因此，第一步之后，压板仅仅压在一个或少数几个相邻指形件上。加热到预定温度时其他的指形件可以相对于加热板自由移动。只要一达到预定的加热温度，压板的倾斜就消失。做到这样是由于四个导向件的所有螺栓降低使得它们压在压板上。在下夹具降低的情况下，四个导向件的螺栓将压板压在位于加热板上的系统支架的指形件上。
附图说明
附图包含在本说明书中并构成本说明书的一部分，附图示出本发明的一个或多个实施例，并且与详细的描述一起用来说明本发明的原理和实施。附图未按比例绘制。其中：
图1示出下夹具的透视图；
图2示出升高的下夹具的侧视图；
图3示出在进行半导体芯片布线的情况下降低的下夹具的侧视图；
图4示出在另一情况下降低的下夹具的侧视图；和
图5示出具有若干个窗口的压板。
具体实施方式
图1示出用于接纳压板(未示出)的下夹具1的透视图。该下夹具1用在进行丝焊时的丝焊器中，以便将系统支架的指形件压在加热板上。该丝焊器具有驱动装置20，用于沿表示为z方向的垂直方向在两个预定位置之间升高和降低该下夹具1。当下夹具1升高时，该系统支架能够被移动到加热板或从该加热板移开。当下夹具1降低时，则压板将系统支架的指形件压在加热板上。该下夹具1具有四个导向件2，压板支承在其上。将根据图2、3和4详细说明导向件的形式和功能。在所有的附图中，同样的附图标记表示同样的零部件。
图2示出沿z方向升高的下夹具1的侧视图。每个导向件2包括支撑面3，在下夹具1升高的情况下压板4支撑在该支撑面3上。该四个支撑面3形成一个平面。每个导向件2还包括一个螺栓5和一个用于沿z方向上下移动该螺栓5的驱动装置6。四个导向件2的螺栓5被升高从而它们不接触压板4。在这种情况下，能够移动系统支架7。压板4具有窗口8，从而可以接近系统支架7的指形件9的端部以进行半导体芯片10的布线。压板4的窗口8在面向系统支架7的一侧被连续的框架11所围绕。该框架11和压板4基本上平行于该加热板13的表面。加热板13刚性地设置在丝焊器W上。对于金属引线框而言在大约220℃的范围内的温度下进行半导体芯片的布线。加热板13被加热到这一温度。系统支架7被预热，但是在移动中很快就冷却下来，因此在完成移动过程后其温度很容易比加热板13的温度低60C。该系统支架7必须由加热板13加热到预定的温度，这需要一定时间。
图3示出沿z方向降低的下夹具1的侧视图，其中环绕窗口8的框架11支撑在该系统支架7的指形件9上并将指形件9压在加热板13上。压板4不再支撑在导向件2的支撑面3上，即，在支撑面13和压板4之间存在气隙12。为了产生使压板4将指形件9压在加热板13上的必要的接触压力，四个导向件2的螺栓5由对应的驱动装置6沿z方向降低，从而它们压在压板4上。
在生产中，系统支架7沿移动方向逐步移动，并且每次在加热板13上提供下一个半导体芯片10用以进行丝焊，因而，下夹具1处于图2所示的状态。移动过程一结束，该下夹具1降低并且分两个步骤，首先进入图4所示的状态并且最终进入图3所示的状态。
在开始降低下夹具1时，四个导向件2的所有螺栓5被升高并且不接触压板4。在降低压板4时或刚刚降低压板4之后，四个螺栓5中的一个，即螺栓5’，由相应的驱动装置6’降低，从而在框架11支撑在系统支架7的指形件9’上之后它压在压板4上。其效果在于压板4由框架11的最接近螺栓5’的P点倾斜。因此框架11和压板4以角度φ倾斜于加热板13的表面。因此压板4处于倾斜位置。因此框架11仅仅将靠近点P处的一个或几个指形件9’压靠在加热板13上，同时其余的指形件9尚未夹紧在框架11和加热板13之间。下夹具1在这种状态下保持一段预定的时间τ，也就是直到系统支架7被加热到加热板13的温度或至少几乎到加热板13的温度。加热时，系统支架7膨胀，从而尚未夹紧的指形件9可以相对于加热板13移动。
在预定的时间τ过去之后，四个导向件2的螺栓5’、5都降低，从而它们全都压在压板4上。这有使框架11往回倾斜并且所有的指形件9被均匀地压在加热板13上的作用。下夹具1这时处于图3所示的状态。
螺栓5沿z方向的移动或者是位移控制的，或者是力控制的。也就是说，或者螺栓5由对应的驱动装置6移动到预定的z位置，或者螺栓5由对应的驱动装置6沿z方向移动，直到预定的力作用在其上。由螺栓5施加在压板4上的力可以选定为或者对于所有螺栓5大小都相等，或者不相等。螺栓5的驱动装置可以是任何类型，例如，气动装置、压电装置或电磁马达。
可以单独移动该一个螺栓5’，而其他三个螺栓5一起上下移动，或者可以单独移动所有四个螺栓5’、5。还有，可以在降低过程的第一步中同时降低四个螺栓5中的两个，从而不是单独的点P，而是框架11的一边支撑在系统支架7上并且压板4由这个边所倾斜。移动螺栓5’、5的驱动装置6由丝焊器的控制单元控制。
在其他应用中，压板4具有若干各窗口8，每个窗口8都具有环绕的框架11，以便在一个工作循环中对位于丝焊器的焊接头移动范围内的若干个半导体芯片进行布线。此外，在其他应用中，窗口8相对于压板4的纵轴线14对称设置。图5示出这样的压板4。而且，在下夹具1降低的第一步中螺栓5’降低并且点P使压板4倾斜。
优选地，压板4具有空腔，螺栓5接合在其中的，从而相对于该下夹具1自动调节压板4的位置。
本发明具有如下优点：
丝焊器的焊接头工作范围内的金属引线框的热膨胀在两个水平方向通常为几十微米。本发明能够使引线框在加热过程中的膨胀不受阻碍，并且引线框的指形件只有在热膨胀完成或接近完成时才被夹紧。尽管如此，该引线框还是被固定在一个位置。这使得它能够事先开始该指形件9’、9的光学测量，从而首先测量靠近点P的指形件。
指形件9的夹紧与窗口8的位置或窗口相对于压板4的位置无关。也就是说在一些应用中窗口8在压板4上对称地设置。
将指形件9压在加热板13上的力与系统支架7的厚度无关并且因此与其厚度的变化无关。
尽管表示和说明了本发明的实施例应用，但是对于本领域技术人员来说，在本说明的启发下可以做出更多的修改，而不脱离本发明的概念。因此本发明并不局限于所附权利要求及其等同物内。

Claims (1)

1.丝焊器，包括
加热板；
下夹具，下夹具用于将加热板上的系统支架的指形件压紧在加热板上，该下夹具具有用于支承压板的四个导向件，每个导向件包括支撑面、螺栓和用于移动螺栓的驱动装置，
用于升高和降低该下夹具的驱动装置，在该下夹具处于升高状态时该压板支撑在该四个导向件的支撑面上，并且在该下夹具处于降低状态时该四个导向件的螺栓将该压板压紧在该系统支架的指形件上，以及
控制所述驱动装置来移动螺栓的控制单元，该控制单元适于控制所述驱动装置来移动螺栓，使得四个螺栓中的至少一个可以相对于其他螺栓单独移动。
CNB200410011991XA 2003-09-25 2004-09-27 具有下夹具的丝焊器 Expired - Fee Related CN100453234C (zh)

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DE102004047499B4 (de) 2007-11-29
TW200523059A (en) 2005-07-16
US20050067462A1 (en) 2005-03-31
US7134589B2 (en) 2006-11-14

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