CN100444335C - 制造包含分离层的多层结构的方法 - Google Patents

制造包含分离层的多层结构的方法 Download PDF

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Publication number
CN100444335C
CN100444335C CNB2005800218458A CN200580021845A CN100444335C CN 100444335 C CN100444335 C CN 100444335C CN B2005800218458 A CNB2005800218458 A CN B2005800218458A CN 200580021845 A CN200580021845 A CN 200580021845A CN 100444335 C CN100444335 C CN 100444335C
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CN
China
Prior art keywords
intermediate layer
layer
power flux
luminous power
impurity
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Expired - Lifetime
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CNB2005800218458A
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English (en)
Chinese (zh)
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CN1998071A (zh
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米歇尔·布吕埃尔
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Apulinuofu
Soitec SA
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Individual
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • H10P90/1916—Preparing SOI wafers using bonding with separation or delamination along an ion implanted layer, e.g. Smart-cut
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers

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  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
CNB2005800218458A 2004-06-01 2005-05-20 制造包含分离层的多层结构的方法 Expired - Lifetime CN100444335C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0405883 2004-06-01
FR0405883A FR2870988B1 (fr) 2004-06-01 2004-06-01 Procede de realisation d'une structure multi-couches comportant, en profondeur, une couche de separation

Publications (2)

Publication Number Publication Date
CN1998071A CN1998071A (zh) 2007-07-11
CN100444335C true CN100444335C (zh) 2008-12-17

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Family Applications (1)

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CNB2005800218458A Expired - Lifetime CN100444335C (zh) 2004-06-01 2005-05-20 制造包含分离层的多层结构的方法

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US (1) US7846816B2 (enExample)
EP (1) EP1774579B1 (enExample)
JP (1) JP5335237B2 (enExample)
CN (1) CN100444335C (enExample)
AU (1) AU2005256723B8 (enExample)
BR (1) BRPI0511207A (enExample)
FR (1) FR2870988B1 (enExample)
WO (1) WO2006000669A2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8288684B2 (en) * 2007-05-03 2012-10-16 Electro Scientific Industries, Inc. Laser micro-machining system with post-scan lens deflection
FR2961719B1 (fr) * 2010-06-24 2013-09-27 Soitec Silicon On Insulator Procede de traitement d'une piece en un materiau compose
FR2965396B1 (fr) * 2010-09-29 2013-02-22 S O I Tec Silicon On Insulator Tech Substrat démontable, procédés de fabrication et de démontage d'un tel substrat
RU2469433C1 (ru) * 2011-07-13 2012-12-10 Юрий Георгиевич Шретер Способ лазерного отделения эпитаксиальной пленки или слоя эпитаксиальной пленки от ростовой подложки эпитаксиальной полупроводниковой структуры (варианты)
FR2978600B1 (fr) 2011-07-25 2014-02-07 Soitec Silicon On Insulator Procede et dispositif de fabrication de couche de materiau semi-conducteur
FR2980279B1 (fr) * 2011-09-20 2013-10-11 Soitec Silicon On Insulator Procede de fabrication d'une structure composite a separer par exfoliation
US20150053263A1 (en) * 2012-03-30 2015-02-26 Teijin Limited Semiconductor laminate and method for manufacturing same, method for manufacturing semiconductor device, semiconductor device, dopant composition, dopant injection layer, and method for forming doped layer
FR2991499A1 (fr) * 2012-05-31 2013-12-06 Commissariat Energie Atomique Procede et systeme d'obtention d'une tranche semi-conductrice
CN106340439A (zh) * 2015-07-06 2017-01-18 勤友光电股份有限公司 用于镭射剥离处理的晶圆结构
DE102016000051A1 (de) 2016-01-05 2017-07-06 Siltectra Gmbh Verfahren und Vorrichtung zum planaren Erzeugen von Modifikationen in Festkörpern
EP3433048B1 (de) 2016-03-22 2022-10-19 Siltectra GmbH Kombinierte laserbehandlung eines zu splittenden festkörpers
JP7256123B2 (ja) 2016-12-12 2023-04-11 ジルテクトラ ゲゼルシャフト ミット ベシュレンクテル ハフツング 構成部材を備えた固体層を薄くするための方法
TWI631022B (zh) * 2016-12-26 2018-08-01 謙華科技股份有限公司 熱印頭模組之製造方法
FR3079657B1 (fr) * 2018-03-29 2024-03-15 Soitec Silicon On Insulator Structure composite demontable par application d'un flux lumineux, et procede de separation d'une telle structure

Citations (1)

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Publication number Priority date Publication date Assignee Title
US20030170990A1 (en) * 1998-05-15 2003-09-11 Kiyofumi Sakaguchi Process for manufacturing a semiconductor substrate as well as a semiconductor thin film, and multilayer structure

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FR2506344B2 (fr) * 1980-02-01 1986-07-11 Commissariat Energie Atomique Procede de dopage de semi-conducteurs
US4415373A (en) * 1981-11-17 1983-11-15 Allied Corporation Laser process for gettering defects in semiconductor devices
CN1143394C (zh) * 1996-08-27 2004-03-24 精工爱普生株式会社 剥离方法、溥膜器件的转移方法和薄膜器件
JP2004140380A (ja) * 1996-08-27 2004-05-13 Seiko Epson Corp 薄膜デバイスの転写方法、及びデバイスの製造方法
JPH1126733A (ja) 1997-07-03 1999-01-29 Seiko Epson Corp 薄膜デバイスの転写方法、薄膜デバイス、薄膜集積回路装置，アクティブマトリクス基板、液晶表示装置および電子機器
US6306729B1 (en) * 1997-12-26 2001-10-23 Canon Kabushiki Kaisha Semiconductor article and method of manufacturing the same
JP3911929B2 (ja) * 1999-10-25 2007-05-09 セイコーエプソン株式会社 液晶表示装置の製造方法
US6300208B1 (en) * 2000-02-16 2001-10-09 Ultratech Stepper, Inc. Methods for annealing an integrated device using a radiant energy absorber layer
US7211214B2 (en) * 2000-07-18 2007-05-01 Princeton University Laser assisted direct imprint lithography
KR20040054811A (ko) 2001-11-30 2004-06-25 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 반도체 디바이스 및 그 제조 방법
US6555439B1 (en) * 2001-12-18 2003-04-29 Advanced Micro Devices, Inc. Partial recrystallization of source/drain region before laser thermal annealing
US7105425B1 (en) * 2002-05-16 2006-09-12 Advanced Micro Devices, Inc. Single electron devices formed by laser thermal annealing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030170990A1 (en) * 1998-05-15 2003-09-11 Kiyofumi Sakaguchi Process for manufacturing a semiconductor substrate as well as a semiconductor thin film, and multilayer structure

Also Published As

Publication number Publication date
AU2005256723B2 (en) 2011-02-10
FR2870988B1 (fr) 2006-08-11
US20090053877A1 (en) 2009-02-26
WO2006000669A2 (fr) 2006-01-05
EP1774579B1 (fr) 2012-05-16
EP1774579A2 (fr) 2007-04-18
FR2870988A1 (fr) 2005-12-02
JP2008501228A (ja) 2008-01-17
AU2005256723B8 (en) 2011-07-28
WO2006000669A3 (fr) 2007-01-25
AU2005256723A1 (en) 2006-01-05
CN1998071A (zh) 2007-07-11
BRPI0511207A (pt) 2007-11-27
JP5335237B2 (ja) 2013-11-06
US7846816B2 (en) 2010-12-07

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