CN100439565C - 对Sn合金的表面处理剂及表面处理方法 - Google Patents

对Sn合金的表面处理剂及表面处理方法 Download PDF

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Publication number
CN100439565C
CN100439565C CNB038199971A CN03819997A CN100439565C CN 100439565 C CN100439565 C CN 100439565C CN B038199971 A CNB038199971 A CN B038199971A CN 03819997 A CN03819997 A CN 03819997A CN 100439565 C CN100439565 C CN 100439565C
Authority
CN
China
Prior art keywords
alloy
surface treatment
ester
phosphoric acid
acid ester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB038199971A
Other languages
English (en)
Chinese (zh)
Other versions
CN1678769A (zh
Inventor
大内高志
熊谷正志
槌谷与志明
谷本宪治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
Nippon Mining and Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Publication of CN1678769A publication Critical patent/CN1678769A/zh
Application granted granted Critical
Publication of CN100439565C publication Critical patent/CN100439565C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00Coating not provided for in groups C23C2/00 - C23C24/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Chemical Treatment Of Metals (AREA)
CNB038199971A 2002-10-18 2003-08-25 对Sn合金的表面处理剂及表面处理方法 Expired - Lifetime CN100439565C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP304554/2002 2002-10-18
JP2002304554A JP4215235B2 (ja) 2002-10-18 2002-10-18 Sn合金に対する表面処理剤及び表面処理方法

Publications (2)

Publication Number Publication Date
CN1678769A CN1678769A (zh) 2005-10-05
CN100439565C true CN100439565C (zh) 2008-12-03

Family

ID=32105120

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038199971A Expired - Lifetime CN100439565C (zh) 2002-10-18 2003-08-25 对Sn合金的表面处理剂及表面处理方法

Country Status (5)

Country Link
JP (1) JP4215235B2 (ja)
KR (1) KR100673181B1 (ja)
CN (1) CN100439565C (ja)
TW (1) TWI276703B (ja)
WO (1) WO2004035862A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004339583A (ja) * 2003-05-16 2004-12-02 Sony Corp 錫又は錫合金材の表面処理剤、錫又は錫合金材及びその表面処理方法、錫合金系はんだ材料及びこれを用いたはんだペースト、錫合金系はんだ材料の製造方法、電子部品、プリント配線板、並びに電子部品の実装構造
WO2007029589A1 (ja) * 2005-09-07 2007-03-15 Nippon Mining & Metals Co., Ltd. 錫および錫合金の水系酸化防止剤
JP5137317B2 (ja) * 2006-04-03 2013-02-06 Jx日鉱日石金属株式会社 電子部品
JP4904953B2 (ja) 2006-04-06 2012-03-28 日立電線株式会社 配線用導体及びその製造方法並びに端末接続部並びにPbフリーはんだ合金
WO2008072654A1 (ja) * 2006-12-12 2008-06-19 Senju Metal Industry Co., Ltd. 鉛フリーはんだ用フラックスとはんだ付け方法
WO2008142960A1 (ja) * 2007-05-21 2008-11-27 Nippon Mining & Metals Co., Ltd. レジンブリードアウト防止剤及びレジンブリードアウト防止方法
EP2376678B1 (en) * 2009-01-14 2012-09-12 Atotech Deutschland GmbH Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface
JP5667152B2 (ja) * 2012-09-19 2015-02-12 Jx日鉱日石金属株式会社 表面処理めっき材およびその製造方法、並びに電子部品
CN105414795B (zh) * 2015-12-30 2017-10-20 中山翰华锡业有限公司 一种耐低温抗氧化无铅焊锡及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0888942A (ja) * 1994-09-14 1996-04-02 Matsushita Electric Works Ltd 非接触式充電装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3155139B2 (ja) * 1993-12-28 2001-04-09 株式会社神戸製鋼所 耐酸化性に優れたすずまたはすず合金めっき材およびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0888942A (ja) * 1994-09-14 1996-04-02 Matsushita Electric Works Ltd 非接触式充電装置

Also Published As

Publication number Publication date
KR100673181B1 (ko) 2007-01-22
TWI276703B (en) 2007-03-21
TW200408727A (en) 2004-06-01
KR20050039851A (ko) 2005-04-29
WO2004035862A1 (ja) 2004-04-29
JP2004137574A (ja) 2004-05-13
JP4215235B2 (ja) 2009-01-28
CN1678769A (zh) 2005-10-05

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: JX NIPPON MINING + METALS CORP.

Free format text: FORMER OWNER: NIPPON MINING + METALS CO., LTD.

Effective date: 20110324

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20110324

Address after: Tokyo, Japan

Patentee after: JX Nippon Mining & Metals Corp.

Address before: Tokyo, Japan

Patentee before: Nippon Mining & Metals Co.,Ltd.

CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan

Patentee after: JX NIPPON MINING & METALS Corp.

Address before: Tokyo, Japan

Patentee before: JX Nippon Mining & Metals Corp.

CP01 Change in the name or title of a patent holder
CP02 Change in the address of a patent holder

Address after: No.4, 10-fan, erdingmu, huzhimen, Tokyo, Japan

Patentee after: JX NIPPON MINING & METALS Corp.

Address before: Tokyo, Japan

Patentee before: JX NIPPON MINING & METALS Corp.

CP02 Change in the address of a patent holder
CX01 Expiry of patent term

Granted publication date: 20081203

CX01 Expiry of patent term