CN100438003C - 半导体器件 - Google Patents

半导体器件 Download PDF

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Publication number
CN100438003C
CN100438003C CNB200510072745XA CN200510072745A CN100438003C CN 100438003 C CN100438003 C CN 100438003C CN B200510072745X A CNB200510072745X A CN B200510072745XA CN 200510072745 A CN200510072745 A CN 200510072745A CN 100438003 C CN100438003 C CN 100438003C
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CN
China
Prior art keywords
film
semiconductor device
soldered ball
conductive film
articulamentum
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Expired - Fee Related
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CNB200510072745XA
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English (en)
Chinese (zh)
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CN1700460A (zh
Inventor
民田浩靖
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Renesas Electronics Corp
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NEC Corp
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Publication of CN1700460A publication Critical patent/CN1700460A/zh
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Publication of CN100438003C publication Critical patent/CN100438003C/zh
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CNB200510072745XA 2004-05-20 2005-05-19 半导体器件 Expired - Fee Related CN100438003C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004150726 2004-05-20
JP2004150726A JP4327657B2 (ja) 2004-05-20 2004-05-20 半導体装置

Publications (2)

Publication Number Publication Date
CN1700460A CN1700460A (zh) 2005-11-23
CN100438003C true CN100438003C (zh) 2008-11-26

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CNB200510072745XA Expired - Fee Related CN100438003C (zh) 2004-05-20 2005-05-19 半导体器件

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Country Link
US (1) US7221054B2 (ko)
JP (1) JP4327657B2 (ko)
KR (1) KR100687274B1 (ko)
CN (1) CN100438003C (ko)
TW (1) TWI278901B (ko)

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JP5050384B2 (ja) * 2006-03-31 2012-10-17 富士通セミコンダクター株式会社 半導体装置およびその製造方法
US7375021B2 (en) * 2006-04-04 2008-05-20 International Business Machines Corporation Method and structure for eliminating aluminum terminal pad material in semiconductor devices
JP4611943B2 (ja) * 2006-07-13 2011-01-12 Ｏｋｉセミコンダクタ株式会社 半導体装置
GB2444775B (en) * 2006-12-13 2011-06-08 Cambridge Silicon Radio Ltd Chip mounting
US7748116B2 (en) * 2007-04-05 2010-07-06 John Trezza Mobile binding in an electronic connection
CN101359606B (zh) * 2007-07-31 2010-06-16 俞宛伶 在半导体连接垫上的金属凸块形成方法
US8039960B2 (en) * 2007-09-21 2011-10-18 Stats Chippac, Ltd. Solder bump with inner core pillar in semiconductor package
TW200917386A (en) * 2007-10-03 2009-04-16 Advanced Semiconductor Eng Wafer structure with a buffer layer
US7713861B2 (en) * 2007-10-13 2010-05-11 Wan-Ling Yu Method of forming metallic bump and seal for semiconductor device
US7713860B2 (en) * 2007-10-13 2010-05-11 Wan-Ling Yu Method of forming metallic bump on I/O pad
US7439170B1 (en) * 2008-03-07 2008-10-21 International Business Machines Corporation Design structure for final via designs for chip stress reduction
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TWI278901B (en) 2007-04-11
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CN1700460A (zh) 2005-11-23
US7221054B2 (en) 2007-05-22

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