CN101359606B - 在半导体连接垫上的金属凸块形成方法 - Google Patents
在半导体连接垫上的金属凸块形成方法 Download PDFInfo
- Publication number
- CN101359606B CN101359606B CN2007101376657A CN200710137665A CN101359606B CN 101359606 B CN101359606 B CN 101359606B CN 2007101376657 A CN2007101376657 A CN 2007101376657A CN 200710137665 A CN200710137665 A CN 200710137665A CN 101359606 B CN101359606 B CN 101359606B
- Authority
- CN
- China
- Prior art keywords
- metal
- layer
- connection gasket
- metal layer
- formation method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007101376657A CN101359606B (zh) | 2007-07-31 | 2007-07-31 | 在半导体连接垫上的金属凸块形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007101376657A CN101359606B (zh) | 2007-07-31 | 2007-07-31 | 在半导体连接垫上的金属凸块形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101359606A CN101359606A (zh) | 2009-02-04 |
CN101359606B true CN101359606B (zh) | 2010-06-16 |
Family
ID=40332006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101376657A Withdrawn - After Issue CN101359606B (zh) | 2007-07-31 | 2007-07-31 | 在半导体连接垫上的金属凸块形成方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101359606B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6667230B2 (en) * | 2001-07-12 | 2003-12-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Passivation and planarization process for flip chip packages |
CN1635634A (zh) * | 2003-12-30 | 2005-07-06 | 中芯国际集成电路制造(上海)有限公司 | 生产芯片级封装用焊垫的方法与装置 |
CN1700460A (zh) * | 2004-05-20 | 2005-11-23 | 恩益禧电子股份有限公司 | 半导体器件 |
US7176583B2 (en) * | 2004-07-21 | 2007-02-13 | International Business Machines Corporation | Damascene patterning of barrier layer metal for C4 solder bumps |
-
2007
- 2007-07-31 CN CN2007101376657A patent/CN101359606B/zh not_active Withdrawn - After Issue
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6667230B2 (en) * | 2001-07-12 | 2003-12-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Passivation and planarization process for flip chip packages |
CN1635634A (zh) * | 2003-12-30 | 2005-07-06 | 中芯国际集成电路制造(上海)有限公司 | 生产芯片级封装用焊垫的方法与装置 |
CN1700460A (zh) * | 2004-05-20 | 2005-11-23 | 恩益禧电子股份有限公司 | 半导体器件 |
US7176583B2 (en) * | 2004-07-21 | 2007-02-13 | International Business Machines Corporation | Damascene patterning of barrier layer metal for C4 solder bumps |
Also Published As
Publication number | Publication date |
---|---|
CN101359606A (zh) | 2009-02-04 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20090204 Assignee: Xin Qiang Electronics (Qingyuan) Co., Ltd. Assignor: Yu Wanling Contract record no.: 2013990000433 Denomination of invention: Forming method for metal lug on semi-conductor connecting mat Granted publication date: 20100616 License type: Exclusive License Record date: 20130725 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20100616 Effective date of abandoning: 20220209 |
|
AV01 | Patent right actively abandoned |
Granted publication date: 20100616 Effective date of abandoning: 20220209 |