CN100411501C - 用于混合式空气和液体冷却堆叠的电子模块的方法和装置 - Google Patents
用于混合式空气和液体冷却堆叠的电子模块的方法和装置 Download PDFInfo
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- 239000007788 liquid Substances 0.000 title claims abstract description 33
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- 238000001816 cooling Methods 0.000 title abstract description 17
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- 230000007246 mechanism Effects 0.000 claims description 13
- 238000009792 diffusion process Methods 0.000 claims description 6
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- 238000010521 absorption reaction Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000007599 discharging Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 230000003321 amplification Effects 0.000 description 4
- 239000002826 coolant Substances 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 4
- 238000003199 nucleic acid amplification method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000000306 recurrent effect Effects 0.000 description 3
- 239000011358 absorbing material Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012814 acoustic material Substances 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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Abstract
一种机柜装置,所述机柜装置为机架安装的堆叠电子装置组件提供混合式气冷和液冷。换热器被安装在所述堆叠的电子装置的侧面,受安装在所述电子装置后面的空气移动装置的推动,空气在所述机柜内从一侧流向另一侧。辅助空气移动装置可以被安装在所述机柜内以增强空气流动。在一个替代实施例中,在所述机柜的正面与背面之间提供有气-液换热器,并且由会聚供给压力通风系统、空气移动装置引导空气所通过的电子装置抽屉、扩散返回压力通风系统以及位于底部的连接风道形成闭合气流环路。在该实施例的一个变形例中,连接风道同时位于顶部和底部,并且供给和返回风道分别是加倍会聚和加倍扩散的。可以添加辅助吹风机以增加总的系统气流。
Description
技术领域
本发明一般地涉及用于冷却诸如机架安装的计算机服务器单元之类的单个电子单元的机架安装的集合物的系统和方法。
背景技术
集成电路芯片以及包含所述芯片的模块的功耗不断增加,以便实现处理器性能的增长。这种趋势同时在模块和系统级别提出了冷却挑战。需要增加的气流速度来有效地冷却高功率模块并限制排放到计算机中心的空气的温度。
在许多大型服务器应用中,处理器及其关联的电子装置(例如,存储器、磁盘驱动器、电源等)被组装在堆叠于机架或框架内的可拆卸抽屉结构中。在其他情况下,所述电子装置可以处于机架或框架内的固定位置。通常,所述组件由沿平行气流路径移动的空气来冷却,通常由前到后,由一个或多个空气移动装置(例如,风扇或吹风机)来推动。在某些情况下,通过提供更大的气流(通过使用功率更大的空气移动装置,或通过增加现有空气移动装置的旋转速度(即,RPM)),可以处理单个抽屉内增加的功耗。但是,在计算机安装(即,数据中心)的情况下,这种方法在框架级别正变得不可管理。由排出框架的空气携带的明显热负荷将最终超过室内空气调节有效处理该负荷的能力。对于具有“服务器场”或相互靠近的大型计算机框架组的大型安装而言尤其如此。在此类安装中,不仅室内空气调节受到挑战,而且这种情况还可以导致排出某个框架的“热”空气的某些部分被吸入相邻框架的空气进口的再循环问题。进而,虽然在单个抽屉中的强有力(或更高RPM)的空气移动装置的噪声水平可能处于可接受的噪声限制内,但由于框架内的空气移动装置的数量,在框架级别的总体噪声可能是不可接受的。此外,框架中所需的用于使气流进入和排出的开口使得很难(如果不是不可能的话)提供有效的声学措施来降低框架外的噪声水平。最后,随着工作频率持续增加,我们正在接近这样一种情况:主要由于封盖存在空气流动所需的开口,致使紧密放置的计算机框架之间的电磁(EMC)串扰成为问题。
最近,有人尝试通过将气冷方法与安装在框架电子装置下面的服务器机柜内的气-水换热器相结合来解决上述某些缺陷。此类系统的一个实例是Sanmina的EcoBayTM 442。本发明建立在将在下面变得显而易见的现有方法之上。
出于上述原因,因此,本领域中需要一种用于冷却机架安装的模块电子单元的改进的和独立的装置。本发明的目标包括在解决例如上述声学和EMC限制的同时提供这样一种装置。
发明内容
此处所述的发明是在现有技术系统上的改进,所述发明提供了一种空气/液体散热机柜系统,所述系统具有用于电子设备的电磁和噪声控制能力。本发明利用其中组装一个或多个堆叠的电子装置抽屉的机柜方案。空气在所述机柜内循环以冷却所述电子装置,并且经过一个或多个气-液翅管换热器(在第一实施例中,安装在所述电子装置的侧面,并且在第二实施例中,安装在所述电子装置的正面和/或背面)以将总体系统热负荷传递给水,所述水然后排出框架。由于框架是封闭的并且由于内壁排列有吸声或隔音材料,由空气移动装置造成的噪声中的大部分将被包含在封闭的机柜内。同时,由于机柜是封闭的,仅在框架底部具有用于电缆的尽可能小的开口,就同时减小对来自所述机柜外部的电磁干扰和来自所述机柜内部的电磁幅射的敏感性而言,它还将展示改进的特性。
在一个实施例中,以一种侧面安装的气-液换热器来描述所述装置。在第二实施例中,所述换热器位于所述电子装置的正面和/或背面,并且空气循环为从顶部到底部,且在底部具有连接风道,在前盖形成会聚气流供给压力通风系统,在后盖形成扩散气流返回压力通风系统,同时一个或多个可选的空气移动装置被布置在所述压力通风系统中;在第二实施例的一个变形例中,连接风道在顶部,且具有会聚供给和扩散返回气流压力通风系统;在再一个变形例中,顶部和底部都具有连接风道,供给和返回气流压力通风系统分别是加倍地会聚的和加倍地扩散的。最后,描述了一种机构,所述机构用于在冷却剂丧失的情况下自动地打开通风板,以使室内空气可用于暂时冷却。
此处对由本发明的各个实施例实现的预期目标的描述并非旨在暗示或建议在本发明的最一般的实施例中,或在本发明的更具体的任一实施例中,任何或所有这些目标或者单独地或者共同地被展示为本质特征。
附图说明
在本说明书的结尾部分特别指出并明确要求了被看作本发明的主题。但是,通过结合附图参考以下说明,可以最佳地理解本发明的组织和实行方法,以及进一步的目标和优点,这些附图是:
图1是电子装置在可拆卸抽屉中的传统的气冷框架;
图2是用于带有侧面安装的冷却框架的电子装置框架的水平闭合环路气流散热系统的顶部截面图(未示出到换热器的水连接管道);
图3是图2的分解图;
图4a、4b和4c是侧面安装的冷却空气子框架的更详细的视图;
图5a是本发明的第二实施例中的机柜和堆叠的电子装置抽屉的截面侧视图;
图5b是本发明的第二实施例的一个变形例中的机柜和堆叠的电子装置抽屉的截面侧视图;
图6是前后盖均打开的机柜的顶视图;
图7是示出整体式气-液换热器的后部截面图;
图8a是示出一组单个气-液换热器的正面截面图;
图8b是该组单个气-液换热器被单独铰接时的等距图;
图9是风道置于机柜顶部以便空气从返回管流向供给管的机柜结构;
图10是风道同时置于机柜顶部和底部以便空气从返回管流向供给管的机柜结构;
图11a是第二实施例的通风板打开的闭合环路气/液散热机柜系统的顶部截面图;
图11b是第二实施例的通风板打开的闭合环路气/液散热机柜系统的侧面截面图;
图12a是具有多个自动打开的通风口盖的门的顶部视图;
图12b是从框架内向外观看时,具有多个自动打开的通风口盖的门的视图;
图13a是从框架内向外观看时,用于锁住和打开门通风口盖的机构的详细视图;
图13b是图13a的门机构的顶部视图;
图13c是通风口盖与门表面之间的垫片密封的放大截面;
图13d是通风口盖闩锁部件的顶部截面图;
图13e是接合到盖闩锁中的闩锁柱塞的放大正视图;
图14a是具有处理适合第一实施例的温度过高情况的方法的第一实施例的顶部截面图;以及
图14b是止动件的放大。
具体实施方式
如图1所示,在现有技术的典型机架安装的结构中,多个空气移动装置(例如,风扇或吹风机11)提供冷却抽屉13中电子装置组件12所需的强制气流15。冷气通过框架前面的百叶窗盖14进入,并通过框架后面的百叶窗盖16排出。
本发明的第一实施例利用了封闭式空气循环散热的原理,并引入了与布置在电子装置框架侧面上的换热器相配合的气流结构;它可以是优选的,因为它提供了以下优点:
-侧面安装的换热器不易受到由于工作时漏水而引起的意外损坏。
-框架的高度没有扩大。这在喷淋头离地面小于9英尺的室内很重要,因为安全规范要求框架顶部离喷淋头最少18英寸。
-侧面冷却空气子框架单独运输并安装在其自身的轮脚上,极大地简化了现场装配。
-可能由空气冷却换热器产生的冷凝彻底远离电子装置。
-换热器的定位考虑到较大的尺寸且具有关联的较大散热能力。
图2示出了正在讨论的实施例的顶部截面图。在本实施例中,闭合环路气流的路径1101本质上是水平的,因为它从一侧到另一侧。具体地说,由位于侧面安装的冷却空气子框架1102中的换热器21冷却的空气被导向前盖31内的电子装置框架10的前面。由电子装置12散逸的热量在经过电子装置框架时被传递给空气。空气由后盖32被再次导入侧面安装的冷却空气子框架1102,从而完成闭合的环路气流。如果需要处理与闭合环路流相关的额外压力下降,则可以在侧面安装的冷却空气子框架1102中添加空气移动装置25。注意,换热器21在所述子框架的宽度之间对角地放置。这种结构保证了最佳的热传递,同时最大程度地减小了给定宽度的子框架的空气侧压力下降。使所述子框架的宽度最小很重要,因为它增加了电子装置框架的总体占地面积。
为了强调侧面安装的冷却空气子框架的特性,图3示出了框架组件的顶部分解图。注意,后盖32和前盖31以及冷却空气子框架1102均可单独运输并可在现场装配到电子装置框架。
最后,图4a、4b和4c进一步示出了冷却空气子框架,示出它是单独的框架,自身具有轮脚,以便容易地移动到电子装置框架侧面的位置。
根据本发明的第二实施例,图5a和5b示出了机柜和堆叠的电子装置抽屉的侧面截面图。如图5a所示,在堆叠的电子装置抽屉的正面(入口)和/或背面(出口)之间,提供了用于从闭合环路空气冷却流移除热量的气-液换热器21。由供给压力通风系统22、电子装置抽屉13、返回压力通风系统23以及机柜底部的连接风道24形成了闭合气流环路。虽然没有示出,但电缆可以穿过所述连接风道以便从机柜外面来提供信号I/O和电力。如图5b所示,可以分别在所述供给和返回空气压力通风系统的入口和出口处提供辅助风扇或吹风机25,以便增加总的系统气流并克服由于通过压力通风系统的气流而引起的任何额外压力下降。要指出的是,在供给压力通风系统22中利用了会聚截面外形,在返回压力通风系统23中利用了扩散截面外形。所述会聚和扩散外形由周围添加的填充材料28形成,所述填充材料优选地可以是诸如可从Northampton,MA的Silent Source InteriorAcoustical Products购买的典型聚氨酯SONEX之类的吸声材料。(此实例代表用作类似作用的一类产品,并非暗示对此产品具体特性的任何特定要求。)这样做以便使气流尽可能一致地通过每个抽屉。还应指出的是,机柜左侧和右侧的压力通风系统和换热器是盖(或门)的一部分或者被包括在其中,所述盖或门可以打开以便接近电子装置抽屉。可以看到,在包含堆叠的电子装置机柜的框架的中央部分下面29处,并且在前门和后门的下面27处都提供有轮脚,以便在它们移动到打开位置时可以支撑其重量。为了最大程度地减小甚至消除与计算机空间中的其他电子设备的电磁干扰,机柜的外壁将由一片连续的金属(例如金属片)或者包含连续金属片的复合/层叠结构来制成。所述金属片要覆盖几乎全部(如果不是全部的话)与机柜壁相关的表面。另外,所述金属片被电接地。此外,当机柜被连接到电子装置框架上时,应使用导电垫片或钢带以减小通过接口的EMC泄漏。这已经是安装计算设备的EMC相关的盖的标准过程。
图6提供了当前门31完全转动打开并且后门32部分打开时机柜的顶部视图,以便说明如何对计算机系统进行维护。还示出了从堆叠的电子装置抽屉向外伸出的部分打开的电子装置抽屉13。注意,在这种情况下,在未受影响的抽屉中的电子装置可以继续工作,因为没有任何操作中断通过所述抽屉的气流。温度可能稍微升高,并且到室内的热负荷也将稍微增加,但是由于这种情况将发生相对较短的时间(30分钟或更短),因此对计算机性能或可靠性应没有明显的影响。
图7示出了第二实施例中的机柜的正面截面图。液体冷却剂(例如水)通过底部开口进入机柜的41并离开42。图7示出了覆盖整个堆叠的电子装置抽屉的单个整体式气-液换热器21。可替代地,图8a示出了一组单个气-液换热器21被连接以覆盖堆叠的电子装置抽屉时的正面截面图。图8b示出了当其中一个换热器向外旋出以便可以打开抽屉13时,单个换热器的铰接。这样做的目的是,当必须从电子装置框架拉出或拆卸某个特定电子装置抽屉时,只有与相应电子装置抽屉关联的换热器被移动。在图7和8a中,跨风道的宽度,在气流风道的底部示出了空气移动装置25。此外,可以看到内衬在机柜的两个侧壁以及顶部和底部的吸声材料28。
图9和10示出了本发明的第二实施例的变形例。图9示出了用于使空气从返回管流向供给管的连接路径或风道24被放置在机柜的顶部的机柜结构。图10示出了气流连接风道24同时在机柜的顶部和底部时的机柜。在这种结构中,基本上总气流的一半通过机柜的上半部分,而总气流的另一半通过机柜的底部。虽然风道将占用更多的机柜空间,但这种结构将在堆叠的电子装置抽屉之间提供最一致的气流分布。可以注意到,在后一种结构中,供给和返回压力通风系统的截面外形71分别是加倍会聚的和加倍扩散的。可以容易地理解,机柜可以与包括堆叠的电子装置组件的框架制成一体,或者可以与周围的机柜制成一体。可替代地,周围的机柜可以单独制成,然后被连接到框架。
可以理解,当所述门打开时,未受影响的抽屉中的电子装置可以通过吸入室内空气进行冷却并将热气排到室内来继续工作。但是,尚未考虑到,在流向封闭框架中的换热器的冷却水中断的情况下,需采取何种操作来提供持续的冷却。在这种情况下,空气将继续在封闭框架中循环,将来自电子装置的热量带走,直到进入电子装置抽屉的空气温度变得如此高以致必须关闭电源。当然,从客户的观点来看,这种操作过程是非常不可接受的,因为无论业务为何,该过程都会直接影响业务行为。
下述改进提供了一种机构,用于在水冷失败时自动打开盖中的通风板以允许室内空气通过电子装置抽屉,并且仍允许计算机继续运行而温度不会过度升高。图11a和11b示出了适合于本发明的第二实施例的这种改进的方法,该方法同样可用于第一实施例中。图14示出了适合于本发明的第一实施例的方法。如容易理解的那样,该方法也可用于第二实施例中。这两种方法都避免了转动打开整个门,因此减少了对通道空间的占用。
图11a和11b示出了当计算机框架每一侧的门中的通风板打开时,闭合环路气液散热机柜系统的顶部截面图和侧面截面图。在系统检测到由于水冷失败(就无法接受的低水流速度或者冷却水温度过高而言)或辅助风扇或吹风机不起作用而造成的空气循环流温度过高之后,将立即存在这种结构。通风板81已自动向外转动,允许室内空气通过左右侧门中的开孔(cutout)。位于抽屉内的风扇或吹风机11通过每个电子装置抽屉吸入空气,从而冷却抽屉内的电子组件。排出的热空气被吹入室内。
在正常工作条件下,通风板紧贴所述门关闭,允许空气在系统机柜内循环。图12a和12b示出了具有通风板的门的顶视图和正视图(从系统机柜内观察)。在面向门一侧上的盖板周边提供有软橡胶垫片密封91。当所述板关闭时,所述密封足以阻止空气通过门中的开孔进入或流出。所采用的通风口盖81和门中开孔的数量可以多于或少于示出的数量。正视图示出了在正常工作条件下保持通风口盖关闭的门闩锁92的位置,还示出了在循环气流温度过高情况下用于打开一个或多个闩锁机构的启动电缆93和螺线管94。
图13a、13b、13c、13d和13e更详细地示出了用于锁住和打开通风板的机构。顶部视图13b示出了门,其中通风口盖81关闭,如将在正常工作中那样。图13c的放大视图示出了在通风口盖与门表面之间的每个通风口盖的内边缘周围提供的垫片密封91。当通风口盖关闭时,与通风口盖铰链线同轴地放置的扭簧(未示出)被压缩。当闩锁被释放时,由扭簧施加在通风口盖上的向外的力将打开通风口盖。由于牵引作用,扭簧还将阻止入口空气侧的门关闭。
图13d还示出了通风口盖闩锁组件的顶部截面图。当通风口盖关闭时,闩锁柱塞103被移回靠紧弹簧104,然后弹回到盖闩锁110中的位置,从而锁住关闭的通风口盖。这种布置使得服务技术人员在纠正无论何种情况引起的水冷失败事故后,可以单独关闭每个通风口盖。图13e示出了接合到盖闩锁110中的闩锁柱塞103的放大正视图。小直径的启动电缆93被连接到从每个柱塞的末端凸出的杆上。来自每个柱塞的电缆绕过塑料滚轮107向下到达所述门底部附近的公共杆(111,图13a)。来自公共杆的单条主电缆109连接到靠近门底部的螺线管108。在检测到循环气流温度过高的情况下,螺线管被电启动,下拉所述主电缆和公共杆。每条单独电缆向下移动相同的量,使每个闩锁柱塞从其通风口盖闩锁中收回。由此通风口盖被允许弹开,使系统机柜流结构从正常再循环封闭流模式切换到紧急开放流通过模式。由换热器提供的冷却可能以若干种方式失败。供给换热器的冷却水可能出现故障。换热器供给管线可能由于太多污垢而堵塞。最后,到换热器的供给管线上的软管或换热器内的管可能破裂从而导致冷却剂损耗。假如发生这些事件中的任何一个事件,继续运行机器所需的操作是打开所述盖以使室内空气可以提供所需的气流来冷却节点。由换热器提供的冷却的失败将通过位于每个节点内的温度传感器来检测,并且当多个(两个或更多)传感器达到其极限值时,将向门打开机构发送命令以打开门。可替代地,可以使用位于从空气入口到节点的上游的温度传感器。此外,在安装在换热器下面的盘中安装有泄漏传感器,并且如果检测到水,供给和返回管线上的螺线管操作的阀将被关闭。
图14a和14b示出了上面第一实施例中所述的前后门均打开时的系统。这是在系统检测到由于水冷失败(就无法接受的低水流速度或者冷却水温度过高而言)或辅助风扇或吹风机不起作用而造成的空气循环流温度过高之后,将立即存在的结构。如针对图13描述的那样,两个螺线管致动的闩锁将被启动以允许通风板转动打开。在图14a中,门31和32已自动向外转动,从而允许室内空气通过一个或多个机架。止动件43(链、柔性杆等)防止了门完全打开并阻塞通道--如图14b中更具体地示出的那样。由放置在抽屉内的鼓风机11将空气吸入并通过每个电子装置抽屉,由此冷却抽屉内的电子装置组件。排出的热气被吹入室内。注意,前门31和后门32优选地被铰接在相对侧上,如图14a所示。由于这一点,排出门32的热空气将不具有被吸入门31并返回系统中的倾向。
最后,可以容易地理解,如第一实施例描述的结构尤其适合于将现有的机架安装的电子装置系统“现场升级”到封闭系统,其中气-液换热器可扩充预先存在的气冷系统,方法是只需通过远程地构建侧面、盖和顶部,然后将它们连接到预先存在单元的适当位置并连接冷却剂供给设备。
虽然在此已根据本发明的特定优选实施例详细说明了本发明,但本领域的技术人员可以在其中实现许多修改和更改。因此,所附权利要求旨在覆盖所有落入本发明的真正精神和范围内的此类修改和更改。
Claims (20)
1. 一种用于冷却机架安装的电子设备的混合式气/液装置,所述装置包括:
a)机架单元,所述机架单元包括多个可拆卸的抽屉单元,每个所述抽屉单元都包含电子装置单元,每个可拆卸的单元都具有用于引导空气通过所述抽屉单元的空气移动装置;
b)机柜,所述机柜将所述机架单元完全装入,所述机柜包括两个侧面、底部、连接到所述侧面中的一个侧面以便可以转动打开以展现所述抽屉单元正面的前盖,和连接到所述侧面中的一个侧面以便可以转动打开以展现所述抽屉单元背面的后盖;以及
c)气-液换热器,所述气-液换热器在所述机柜内以相对于所述可拆卸抽屉单元的某一倾角安装在所述可拆卸抽屉单元的一个侧面上,由此所述抽屉单元、后盖、其上安装有所述气-液换热器的所述可拆卸抽屉单元的侧面以及前盖形成闭合气流环路。
2. 根据权利要求1的装置,进一步包括辅助空气移动装置,所述辅助空气移动装置安装在其上安装有所述气-液换热器的所述可拆卸抽屉单元的侧面。
3. 根据权利要求2的装置,其中所述前盖包括多个通风板以及具有过高温度条件触发器的自动闩锁机构。
4. 根据权利要求2的装置,其中所述后盖包括多个通风板以及具有过高温度条件触发器的自动闩锁机构。
5. 根据权利要求1的装置,其中所述机柜进一步包括吸声填充材料。
6. 根据权利要求1的装置,其中所述前盖和后盖被铰接在相对侧上,并且所述盖被允许由具有过高温度条件触发器的自动闩锁机构来打开。
7. 一种用于冷却机架安装的电子设备的混合式气/液封闭装置,所述装置包括:
a)机架单元,所述机架单元包括多个可拆卸的抽屉单元,每个所述抽屉单元都包含电子装置单元,每个可拆卸的抽屉单元都具有用于引导空气通过所述抽屉单元的空气移动装置;
b)机柜,所述机柜将所述机架单元完全装入,所述机柜包括两个侧面、底部、连接到所述侧面中的一个侧面以便可以转动打开以展现所述抽屉单元正面的前盖,和连接到所述侧面中的一个侧面以便可以转动打开以展现所述抽屉单元背面的后盖,所述两个盖和所述底部被构建成在所述前盖中形成供给气流压力通风系统,在所述后盖中形成返回气流压力通风系统,并形成连接风道,由此所述供给压力通风系统、抽屉单元、返回压力通风系统以及连接风道形成闭合气流环路;以及
c)气-液换热器,所述气-液换热器安装在所述机柜内。
8. 根据权利要求7的装置,其中所述气-液换热器安装在所述前盖内。
9. 根据权利要求8的装置,其中所述气-液换热器包括多个单独铰接的单元。
10. 根据权利要求7的装置,其中所述气-液换热器安装在所述后盖内。
11. 根据权利要求10的装置,其中所述气-液换热器包括多个单独铰接的单元。
12. 根据权利要求7的装置,其中一个气-液换热器安装在所述前盖内,并且一个气-液换热器安装在所述后盖内。
13. 根据权利要求7的装置,进一步包括安装在所述供给气流压力通风系统中的入口辅助空气移动装置,以及安装在所述返回气流压力通风系统中的出口辅助空气移动装置。
14. 根据权利要求8的装置,其中所述前盖包括多个通风板以及具有过高温度条件触发器的自动闩锁机构。
15. 根据权利要求10的装置,其中所述后盖包括多个通风板以及具有过高温度条件触发器的自动闩锁机构。
16. 根据权利要求7的装置,其中所述连接风道位于所述底部,所述供给气流压力通风系统具有会聚截面,并且所述返回气流压力通风系统具有扩散截面。
17. 根据权利要求16的装置,其中所述机柜进一步包括吸声填充材料。
18. 根据权利要求7的装置,其中所述连接风道位于所述顶部,所述供给气流压力通风系统具有会聚截面,并且所述返回气流压力通风系统具有扩散截面。
19. 根据权利要求7的装置,其中连接风道同时位于所述顶部和底部,并且其中所述供给和返回气流压力通风系统分别是加倍会聚和加倍扩散的。
20. 一种构建封闭气/水冷却的机架安装的电子装置的方法,所述方法包括:
a)提供预先存在的适当放置的机架单元,所述机架单元包括多个可拆卸的抽屉单元,每个所述抽屉单元都包含电子装置单元,每个可拆卸的单元都具有用于引导空气通过所述抽屉单元的空气移动装置;
b)将所述机架单元完全装入机柜,所述机柜包括两个侧面、底部、连接到所述侧面中的一个侧面以便可以转动打开以展现所述抽屉单元正面的前盖,以及连接到所述侧面中的一个侧面以便可以转动打开以展现所述抽屉单元背面的后盖,并且气-液换热器在所述机柜内以相对于所述可拆卸抽屉单元的某一倾角安装在所述可拆卸抽屉单元的一个侧面上,由此所述抽屉单元、后盖、其上安装有所述气-液换热器的所述可拆卸抽屉单元的侧面以及前盖形成闭合气流环路。
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AU (1) | AU2003302342A1 (zh) |
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Also Published As
Publication number | Publication date |
---|---|
ATE408981T1 (de) | 2008-10-15 |
TW200505325A (en) | 2005-02-01 |
DE60323668D1 (de) | 2008-10-30 |
US20040100770A1 (en) | 2004-05-27 |
TWI240607B (en) | 2005-09-21 |
EP1566087A1 (en) | 2005-08-24 |
WO2004049774A1 (en) | 2004-06-10 |
US6924981B2 (en) | 2005-08-02 |
JP4349527B2 (ja) | 2009-10-21 |
EP1566087B1 (en) | 2008-09-17 |
KR20050084871A (ko) | 2005-08-29 |
AU2003302342A1 (en) | 2004-06-18 |
KR100745534B1 (ko) | 2007-08-03 |
US20040190247A1 (en) | 2004-09-30 |
JP2006507676A (ja) | 2006-03-02 |
CN1711813A (zh) | 2005-12-21 |
US6775137B2 (en) | 2004-08-10 |
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