JP4321413B2 - ディスクアレイ装置 - Google Patents
ディスクアレイ装置 Download PDFInfo
- Publication number
- JP4321413B2 JP4321413B2 JP2004255518A JP2004255518A JP4321413B2 JP 4321413 B2 JP4321413 B2 JP 4321413B2 JP 2004255518 A JP2004255518 A JP 2004255518A JP 2004255518 A JP2004255518 A JP 2004255518A JP 4321413 B2 JP4321413 B2 JP 4321413B2
- Authority
- JP
- Japan
- Prior art keywords
- disk
- heat
- unit box
- unit
- array device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
- G11B33/125—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a plurality of recording/reproducing devices, e.g. modular arrangements, arrays of disc drives
- G11B33/127—Mounting arrangements of constructional parts onto a chassis
- G11B33/128—Mounting arrangements of constructional parts onto a chassis of the plurality of recording/reproducing devices, e.g. disk drives, onto a chassis
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1413—Reducing the influence of the temperature by fluid cooling
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1426—Reducing the influence of the temperature by cooling plates, e.g. fins
Description
2 制御基板
3 コネクタ
4 LSI
5 熱伝導シート
7 キャニスタ
10 熱伝導グリース
16 取っ手
17 リリースボタン
20 ガイドレール
21 大型基板
23 コネクタ
26 ディスクドライブ
27 ユニットボックス
29 ガイドレール
31 筐体
100 コールドプレート
101 配管
102 ラジエータ
103 放熱フィン
108 分岐継手
110 熱伝導促進部材
111 突条
117 ジョイント
Claims (1)
- 記録ディスクと記録・再生ヘッドとこれらを駆動する駆動機構が収納された薄型ケースに、前記駆動機構を制御する制御基板を組み付けて形成されたディスクドライブを複数備え、該複数のディスクドライブを厚さ方向に並べてユニットボックスに収納してなるディスクアレイ装置において、
前記薄型ケースおよび前記ユニットボックスは、それぞれ熱伝導性を有する材料で形成され、
前記ユニットボックスは、前記複数のディスクドライブの厚さ方向に平行な壁面をそれぞれ有する上段ユニットボックスと下段ユニットボックスを2段重ねて形成され、前記上段ユニットボックスの上面と前記下段ユニットボックスの下面の壁面に冷却媒体が封入された吸熱部を有してなることを特徴とするディスクアレイ装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004255518A JP4321413B2 (ja) | 2004-09-02 | 2004-09-02 | ディスクアレイ装置 |
US11/043,994 US7675748B2 (en) | 2004-09-02 | 2005-01-28 | Disk array system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004255518A JP4321413B2 (ja) | 2004-09-02 | 2004-09-02 | ディスクアレイ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006073099A JP2006073099A (ja) | 2006-03-16 |
JP4321413B2 true JP4321413B2 (ja) | 2009-08-26 |
Family
ID=36145106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004255518A Expired - Fee Related JP4321413B2 (ja) | 2004-09-02 | 2004-09-02 | ディスクアレイ装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7675748B2 (ja) |
JP (1) | JP4321413B2 (ja) |
Families Citing this family (53)
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WO2006129281A2 (en) * | 2005-06-02 | 2006-12-07 | Koninklijke Philips Electronics N.V. | Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module |
US7190583B1 (en) * | 2005-08-29 | 2007-03-13 | Verigy Pte Ltd | Self contained, liquid to air cooled, memory test engineering workstation |
JP2008191996A (ja) * | 2007-02-06 | 2008-08-21 | Hitachi Ltd | ディスクアレイ装置および電子装置 |
JP4664943B2 (ja) * | 2007-06-13 | 2011-04-06 | 株式会社日立製作所 | 電子機器 |
JP2009098823A (ja) * | 2007-10-16 | 2009-05-07 | Hitachi Ltd | 電子装置システム |
EP2117288A1 (en) * | 2008-05-07 | 2009-11-11 | 3M Innovative Properties Company | Heat-management system for a cabinet containing electronic equipment |
DE102008030308A1 (de) | 2008-06-30 | 2009-12-31 | Lindenstruth, Volker, Prof. | Gebäude für ein Rechenzentrum mit Einrichtungen zur effizienten Kühlung |
JP5209428B2 (ja) * | 2008-09-24 | 2013-06-12 | 株式会社日立製作所 | 電子機器 |
US8570747B2 (en) * | 2008-12-04 | 2013-10-29 | Hewlett-Packard Development Company, L.P. | Carbon laminated enclosure |
US7965509B2 (en) * | 2009-04-06 | 2011-06-21 | International Business Machines Corporation | High performance dual-in-line memory (DIMM) array liquid cooling assembly and method |
US20100254758A1 (en) * | 2009-04-06 | 2010-10-07 | International Business Machines Corporation | Apparatus and method for forming a mechanical, fluid-tight connection |
US7978472B2 (en) * | 2009-06-10 | 2011-07-12 | International Business Machines Corporation | Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof |
US8582298B2 (en) * | 2009-06-22 | 2013-11-12 | Xyber Technologies | Passive cooling enclosure system and method for electronics devices |
US9036351B2 (en) | 2009-06-22 | 2015-05-19 | Xyber Technologies, Llc | Passive cooling system and method for electronics devices |
US8547123B2 (en) | 2009-07-15 | 2013-10-01 | Teradyne, Inc. | Storage device testing system with a conductive heating assembly |
US8628239B2 (en) * | 2009-07-15 | 2014-01-14 | Teradyne, Inc. | Storage device temperature sensing |
US7995349B2 (en) * | 2009-07-15 | 2011-08-09 | Teradyne, Inc. | Storage device temperature sensing |
US8466699B2 (en) | 2009-07-15 | 2013-06-18 | Teradyne, Inc. | Heating storage devices in a testing system |
US8094453B2 (en) * | 2009-09-30 | 2012-01-10 | International Business Machines Corporation | Compliant conduction rail assembly and method facilitating cooling of an electronics structure |
US8631698B2 (en) * | 2010-02-02 | 2014-01-21 | Teradyne, Inc. | Test slot carriers |
US8544745B2 (en) | 2011-03-03 | 2013-10-01 | Genesis Technology Usa, Inc. | Heat-dissipating card connector |
DE112011105140T5 (de) | 2011-05-25 | 2014-01-09 | Hewlett-Packard Development Company, L.P. | Blade-Computersystem |
EP2555605A1 (en) * | 2011-08-01 | 2013-02-06 | GSI Helmholtzzentrum für Schwerionenforschung GmbH | Mobile data centre unit with efficient cooling means |
US8659897B2 (en) | 2012-01-27 | 2014-02-25 | International Business Machines Corporation | Liquid-cooled memory system having one cooling pipe per pair of DIMMs |
EP2663172A1 (en) | 2012-05-11 | 2013-11-13 | eCube Computing GmbH | Method for operating a data centre with efficient cooling means |
US20140049908A1 (en) * | 2012-08-20 | 2014-02-20 | André Sloth Eriksen | Thermal management system |
EP2901829B1 (en) * | 2012-09-25 | 2019-12-18 | Liquidcool Solutions, Inc. | Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices |
EP2929650B1 (en) * | 2012-12-05 | 2020-06-03 | Siemens Canada Limited | Network device |
US9713287B2 (en) * | 2013-01-15 | 2017-07-18 | Artesyn Embedded Computing, Inc. | Integrated thermal inserts and cold plate |
GB2511071B (en) * | 2013-02-21 | 2015-12-16 | Xyratex Tech Ltd | A data storage system and a method of cooling a data storage system |
US9535471B2 (en) | 2013-02-21 | 2017-01-03 | Seagate Technology Llc | Data storage system and a method of cooling a data storage system |
KR101493943B1 (ko) * | 2013-11-20 | 2015-02-17 | 김범준 | 방열시스템 |
CA2835982A1 (en) | 2013-12-05 | 2015-06-05 | Lawrence Anthony Carota | Drive array |
CN103713714B (zh) * | 2013-12-17 | 2017-03-15 | 华为技术有限公司 | 立体风道刀片框及其机箱 |
US9357670B2 (en) * | 2014-02-18 | 2016-05-31 | Lockheed Martin Corporation | Efficient heat transfer from conduction-cooled circuit cards |
WO2015156817A1 (en) | 2014-04-11 | 2015-10-15 | Hewlett-Packard Development Company, L. P. | Liquid coolant supply |
CA2952522A1 (en) | 2014-06-20 | 2015-12-23 | Nortek Air Solutions Canada, Inc. | Systems and methods for managing conditions in enclosed space |
JP6299551B2 (ja) * | 2014-10-01 | 2018-03-28 | 富士通株式会社 | 発熱装置の冷却装置 |
FR3030708B1 (fr) * | 2014-12-22 | 2018-02-16 | Airbus Operations Sas | Plaque froide, formant notamment partie structurale d'un equipement a composants generateurs de chaleur |
WO2016132744A1 (ja) * | 2015-02-19 | 2016-08-25 | パナソニックIpマネジメント株式会社 | 冷却装置およびこれを搭載した電子機器 |
JP2016156604A (ja) * | 2015-02-19 | 2016-09-01 | パナソニックIpマネジメント株式会社 | 冷却装置およびこれを搭載した電子機器 |
US10448543B2 (en) | 2015-05-04 | 2019-10-15 | Google Llc | Cooling electronic devices in a data center |
EP3985322A3 (en) | 2015-05-15 | 2022-08-31 | Nortek Air Solutions Canada, Inc. | Air conditioning system with a liquid to air membrane energy exchanger |
FR3042886B1 (fr) * | 2015-10-26 | 2018-05-11 | Calyos Sa | Equipement informatique avec bloc d'alimentation electrique refroidi |
US10028401B2 (en) * | 2015-12-18 | 2018-07-17 | Microsoft Technology Licensing, Llc | Sidewall-accessible dense storage rack |
CA3010515C (en) | 2016-01-08 | 2023-03-21 | Nortek Air Solutions Canada, Inc. | Integrated make-up air system in 100% air recirculation system |
TWI598727B (zh) * | 2016-06-08 | 2017-09-11 | 訊凱國際股份有限公司 | 外接式功能擴充裝置 |
CN110416164B (zh) * | 2018-04-28 | 2023-08-08 | 伊姆西Ip控股有限责任公司 | 用于盘阵列的外壳 |
CN112114634A (zh) * | 2019-06-19 | 2020-12-22 | 成都嘉提信息技术有限公司 | 一种cpu散热装置 |
CN112002355B (zh) * | 2020-07-27 | 2022-02-18 | 北京浪潮数据技术有限公司 | 一种硬盘液冷散热系统及服务器 |
US20220264771A1 (en) * | 2021-02-18 | 2022-08-18 | Nvidia Corporation | Intelligent two-phase refrigerant-to-air heat exchanger for datacenter cooling systems |
CN112951284B (zh) * | 2021-03-05 | 2022-07-01 | 福建江夏学院 | 一种智慧教室用数据存储装置 |
US11785743B2 (en) * | 2021-04-22 | 2023-10-10 | Hewlett Packard Enterprise Development Lp | Temperature control of closely packed electronic assemblies |
Family Cites Families (16)
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US4493010A (en) * | 1982-11-05 | 1985-01-08 | Lockheed Corporation | Electronic packaging module utilizing phase-change conductive cooling |
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JP3019088B1 (ja) | 1998-11-18 | 2000-03-13 | 日本電気株式会社 | 磁気ディスク装置 |
US6115251A (en) * | 1999-04-15 | 2000-09-05 | Hewlett Packard Company | Cooling apparatus for computer subsystem |
JP2001332978A (ja) | 2000-05-18 | 2001-11-30 | Sony Corp | データストリーム変換装置とその方法、可変長符号化データストリーム生成装置とその方法、および、カメラシステム |
US7024573B2 (en) * | 2002-02-05 | 2006-04-04 | Hewlett-Packard Development Company, L.P. | Method and apparatus for cooling heat generating components |
US6618249B2 (en) * | 2002-02-05 | 2003-09-09 | Quantum Corporation | Thermal cooling system for densely packed storage devices |
JP4071043B2 (ja) | 2002-05-24 | 2008-04-02 | 株式会社日立製作所 | 電子機器の冷却構造 |
US6560107B1 (en) * | 2002-07-08 | 2003-05-06 | Paul J. Beck | Cooling device for computer hard drive |
US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
US6775137B2 (en) * | 2002-11-25 | 2004-08-10 | International Business Machines Corporation | Method and apparatus for combined air and liquid cooling of stacked electronics components |
JP4311538B2 (ja) * | 2003-06-27 | 2009-08-12 | 株式会社日立製作所 | ディスク記憶装置の冷却構造 |
US7012807B2 (en) * | 2003-09-30 | 2006-03-14 | International Business Machines Corporation | Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack |
JP2007066480A (ja) * | 2005-09-02 | 2007-03-15 | Hitachi Ltd | ディスクアレイ装置 |
-
2004
- 2004-09-02 JP JP2004255518A patent/JP4321413B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-28 US US11/043,994 patent/US7675748B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006073099A (ja) | 2006-03-16 |
US7675748B2 (en) | 2010-03-09 |
US20060077776A1 (en) | 2006-04-13 |
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