CN100407397C - 静电吸附电极、基板处理装置和静电吸附电极的制造方法 - Google Patents
静电吸附电极、基板处理装置和静电吸附电极的制造方法 Download PDFInfo
- Publication number
- CN100407397C CN100407397C CN2006100879052A CN200610087905A CN100407397C CN 100407397 C CN100407397 C CN 100407397C CN 2006100879052 A CN2006100879052 A CN 2006100879052A CN 200610087905 A CN200610087905 A CN 200610087905A CN 100407397 C CN100407397 C CN 100407397C
- Authority
- CN
- China
- Prior art keywords
- insulating barrier
- film
- electrode
- spraying
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005205716A JP4542959B2 (ja) | 2005-07-14 | 2005-07-14 | 静電吸着電極、基板処理装置および静電吸着電極の製造方法 |
JP2005205716 | 2005-07-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1897243A CN1897243A (zh) | 2007-01-17 |
CN100407397C true CN100407397C (zh) | 2008-07-30 |
Family
ID=37609704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100879052A Expired - Fee Related CN100407397C (zh) | 2005-07-14 | 2006-06-06 | 静电吸附电极、基板处理装置和静电吸附电极的制造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4542959B2 (ko) |
KR (1) | KR20070009448A (ko) |
CN (1) | CN100407397C (ko) |
TW (1) | TW200710269A (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008035395A1 (fr) * | 2006-09-19 | 2008-03-27 | Creative Technology Corporation | Structure d'alimentation d'un mandrin électrostatique, procédé de fabrication et procédé de regénération de la structure d'alimentation du mandrin électrostatique |
JP2008235735A (ja) * | 2007-03-23 | 2008-10-02 | Sumitomo Precision Prod Co Ltd | 静電チャック及びこれを備えたプラズマ処理装置 |
KR101286724B1 (ko) * | 2011-10-17 | 2013-07-18 | (주)제니스월드 | 분할 엠보싱 구조 정전척 |
CN104241181B (zh) * | 2013-06-08 | 2018-05-29 | 中微半导体设备(上海)有限公司 | 静电吸盘的制造方法,静电吸盘及等离子体处理装置 |
JP6230477B2 (ja) * | 2014-04-25 | 2017-11-15 | 株式会社ディスコ | 切削装置 |
JP6560150B2 (ja) * | 2016-03-28 | 2019-08-14 | 日本碍子株式会社 | ウエハ載置装置 |
JP7038497B2 (ja) * | 2017-07-07 | 2022-03-18 | 東京エレクトロン株式会社 | 静電チャックの製造方法 |
JP7224096B2 (ja) * | 2017-07-13 | 2023-02-17 | 東京エレクトロン株式会社 | プラズマ処理装置用部品の溶射方法及びプラズマ処理装置用部品 |
JP7401266B2 (ja) * | 2018-12-27 | 2023-12-19 | 東京エレクトロン株式会社 | 基板載置台、及び、基板処理装置 |
TWI813840B (zh) * | 2018-12-27 | 2023-09-01 | 日商巴川製紙所股份有限公司 | 靜電夾頭裝置 |
WO2020172785A1 (en) | 2019-02-26 | 2020-09-03 | Yangtze Memory Technologies Co., Ltd. | Method and device for wafer taping |
JP7324677B2 (ja) | 2019-10-02 | 2023-08-10 | 株式会社巴川製紙所 | 静電チャック装置およびその製造方法 |
CN111455355A (zh) * | 2020-04-13 | 2020-07-28 | 艾华(无锡)半导体科技有限公司 | 一种静电辅助外延生长的方法 |
EP4213183A1 (en) * | 2020-09-08 | 2023-07-19 | NHK Spring Co., Ltd. | Stage and method for manufacturing same |
WO2024014528A1 (ja) * | 2022-07-15 | 2024-01-18 | 大日本印刷株式会社 | 電子デバイスの製造方法、導電性フィルム、第1積層体及び第2積層体 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6023405A (en) * | 1994-02-22 | 2000-02-08 | Applied Materials, Inc. | Electrostatic chuck with improved erosion resistance |
JP2003163146A (ja) * | 1999-06-09 | 2003-06-06 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板 |
JP2004031479A (ja) * | 2002-06-24 | 2004-01-29 | Taiheiyo Cement Corp | 静電チャック |
JP2004241668A (ja) * | 2003-02-07 | 2004-08-26 | Taiheiyo Cement Corp | 静電チャック及びその製造方法 |
CN1581460A (zh) * | 2003-08-08 | 2005-02-16 | 株式会社巴川制纸所 | 静电卡盘装置用电极片、静电卡盘装置及吸附方法 |
CN1612314A (zh) * | 2003-10-31 | 2005-05-04 | 东京毅力科创株式会社 | 静电吸附装置、等离子体处理装置及等离子体处理方法 |
CN2708497Y (zh) * | 2003-04-03 | 2005-07-06 | 应用材料公司 | 用于静电吸盘的防护装置 |
CN1638084A (zh) * | 2003-11-14 | 2005-07-13 | 爱德牌工程有限公司 | 静电卡盘、基片支持、夹具和电极结构及其制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07335732A (ja) * | 1994-06-14 | 1995-12-22 | Tokyo Electron Ltd | 静電チャック、これを用いたプラズマ処理装置及びこの製造方法 |
JP2001284328A (ja) * | 2000-03-31 | 2001-10-12 | Taiheiyo Cement Corp | セラミック部品 |
JP4272373B2 (ja) * | 2001-12-11 | 2009-06-03 | 太平洋セメント株式会社 | 静電チャック |
JP4326874B2 (ja) * | 2003-08-07 | 2009-09-09 | 太平洋セメント株式会社 | 静電チャック及びその製造方法 |
-
2005
- 2005-07-14 JP JP2005205716A patent/JP4542959B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-06 CN CN2006100879052A patent/CN100407397C/zh not_active Expired - Fee Related
- 2006-07-13 KR KR1020060065963A patent/KR20070009448A/ko not_active Application Discontinuation
- 2006-07-13 TW TW095125704A patent/TW200710269A/zh unknown
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6023405A (en) * | 1994-02-22 | 2000-02-08 | Applied Materials, Inc. | Electrostatic chuck with improved erosion resistance |
JP2003163146A (ja) * | 1999-06-09 | 2003-06-06 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板 |
JP2004031479A (ja) * | 2002-06-24 | 2004-01-29 | Taiheiyo Cement Corp | 静電チャック |
JP2004241668A (ja) * | 2003-02-07 | 2004-08-26 | Taiheiyo Cement Corp | 静電チャック及びその製造方法 |
CN2708497Y (zh) * | 2003-04-03 | 2005-07-06 | 应用材料公司 | 用于静电吸盘的防护装置 |
CN1581460A (zh) * | 2003-08-08 | 2005-02-16 | 株式会社巴川制纸所 | 静电卡盘装置用电极片、静电卡盘装置及吸附方法 |
CN1612314A (zh) * | 2003-10-31 | 2005-05-04 | 东京毅力科创株式会社 | 静电吸附装置、等离子体处理装置及等离子体处理方法 |
CN1638084A (zh) * | 2003-11-14 | 2005-07-13 | 爱德牌工程有限公司 | 静电卡盘、基片支持、夹具和电极结构及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20070009448A (ko) | 2007-01-18 |
JP2007027315A (ja) | 2007-02-01 |
TW200710269A (en) | 2007-03-16 |
JP4542959B2 (ja) | 2010-09-15 |
CN1897243A (zh) | 2007-01-17 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080730 Termination date: 20120606 |