CN100405574C - 对线路和通孔导体使用不同材料的双重镶嵌互连结构 - Google Patents
对线路和通孔导体使用不同材料的双重镶嵌互连结构 Download PDFInfo
- Publication number
- CN100405574C CN100405574C CNB2004800149580A CN200480014958A CN100405574C CN 100405574 C CN100405574 C CN 100405574C CN B2004800149580 A CNB2004800149580 A CN B2004800149580A CN 200480014958 A CN200480014958 A CN 200480014958A CN 100405574 C CN100405574 C CN 100405574C
- Authority
- CN
- China
- Prior art keywords
- electric conducting
- conducting material
- lining
- layer
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 179
- 239000000463 material Substances 0.000 title claims abstract description 47
- 230000009977 dual effect Effects 0.000 title abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 73
- 239000003989 dielectric material Substances 0.000 claims description 63
- 238000000151 deposition Methods 0.000 claims description 42
- 230000008021 deposition Effects 0.000 claims description 42
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 21
- 238000005229 chemical vapour deposition Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 229910052721 tungsten Inorganic materials 0.000 claims description 15
- 239000010937 tungsten Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 12
- 238000005240 physical vapour deposition Methods 0.000 claims description 11
- 238000001020 plasma etching Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 11
- 229910052715 tantalum Inorganic materials 0.000 claims description 11
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 11
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 11
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 10
- 229910052731 fluorine Inorganic materials 0.000 claims description 10
- 239000011737 fluorine Substances 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 238000000866 electrolytic etching Methods 0.000 claims description 5
- 238000001259 photo etching Methods 0.000 claims description 5
- 238000001039 wet etching Methods 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 3
- 239000003870 refractory metal Substances 0.000 abstract description 24
- 238000005260 corrosion Methods 0.000 description 16
- 230000007797 corrosion Effects 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- FQNHWXHRAUXLFU-UHFFFAOYSA-N carbon monoxide;tungsten Chemical group [W].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-] FQNHWXHRAUXLFU-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- -1 Siloxanes Chemical class 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 208000035126 Facies Diseases 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000008378 aryl ethers Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
- H01L21/76811—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures involving multiple stacked pre-patterned masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
- H01L21/76808—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures involving intermediate temporary filling with material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
- H01L21/76813—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures involving a partial via etch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
- H01L21/76846—Layer combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
- H01L21/76865—Selective removal of parts of the layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
- H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
- H01L23/53295—Stacked insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/604,026 | 2003-06-23 | ||
US10/604,026 US6958540B2 (en) | 2003-06-23 | 2003-06-23 | Dual damascene interconnect structures having different materials for line and via conductors |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1799137A CN1799137A (zh) | 2006-07-05 |
CN100405574C true CN100405574C (zh) | 2008-07-23 |
Family
ID=33539856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800149580A Expired - Fee Related CN100405574C (zh) | 2003-06-23 | 2004-06-14 | 对线路和通孔导体使用不同材料的双重镶嵌互连结构 |
Country Status (7)
Country | Link |
---|---|
US (3) | US6958540B2 (zh) |
EP (1) | EP1649510A2 (zh) |
JP (1) | JP2009514186A (zh) |
KR (1) | KR100772602B1 (zh) |
CN (1) | CN100405574C (zh) |
TW (2) | TW200931593A (zh) |
WO (1) | WO2004114395A2 (zh) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI242835B (en) * | 2003-08-29 | 2005-11-01 | Nanya Technology Corp | Structure of interconnects and fabricating method thereof |
US7169698B2 (en) * | 2004-01-14 | 2007-01-30 | International Business Machines Corporation | Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner |
KR100621630B1 (ko) * | 2004-08-25 | 2006-09-19 | 삼성전자주식회사 | 이종 금속을 이용하는 다마신 공정 |
US7352064B2 (en) * | 2004-11-04 | 2008-04-01 | International Business Machines Corporation | Multiple layer resist scheme implementing etch recipe particular to each layer |
US7651942B2 (en) * | 2005-08-15 | 2010-01-26 | Infineon Technologies Ag | Metal interconnect structure and method |
US7488679B2 (en) * | 2006-07-31 | 2009-02-10 | International Business Machines Corporation | Interconnect structure and process of making the same |
US7749894B2 (en) * | 2006-11-09 | 2010-07-06 | Chartered Semiconductor Manufacturing Ltd. | Integrated circuit processing system |
JP4506767B2 (ja) * | 2007-02-28 | 2010-07-21 | カシオ計算機株式会社 | 半導体装置の製造方法 |
US20080230907A1 (en) * | 2007-03-22 | 2008-09-25 | Chartered Semiconductor Manufacturing Ltd. | Integrated circuit system with carbon enhancement |
US7812461B2 (en) | 2007-03-27 | 2010-10-12 | Micron Technology, Inc. | Method and apparatus providing integrated circuit having redistribution layer with recessed connectors |
US7615484B2 (en) * | 2007-04-24 | 2009-11-10 | Chartered Semiconductor Manufacturing Ltd. | Integrated circuit manufacturing method using hard mask |
US7951414B2 (en) * | 2008-03-20 | 2011-05-31 | Micron Technology, Inc. | Methods of forming electrically conductive structures |
DE102011002769B4 (de) * | 2011-01-17 | 2013-03-21 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Halbleiterbauelement und Verfahren zur Herstellung einer Hybridkontaktstruktur mit Kontakten mit kleinem Aspektverhältnis in einem Halbleiterbauelement |
CN102437098A (zh) * | 2011-09-08 | 2012-05-02 | 上海华力微电子有限公司 | 一种降低接触孔电阻的接触孔形成方法 |
CN102437097A (zh) * | 2011-09-08 | 2012-05-02 | 上海华力微电子有限公司 | 一种新的接触孔的制造方法 |
CN102437099A (zh) * | 2011-09-08 | 2012-05-02 | 上海华力微电子有限公司 | 一种降低接触孔电阻的接触孔结构形成方法 |
US9252050B2 (en) | 2012-09-11 | 2016-02-02 | International Business Machines Corporation | Method to improve semiconductor surfaces and polishing |
US9312203B2 (en) | 2013-01-02 | 2016-04-12 | Globalfoundries Inc. | Dual damascene structure with liner |
US9716035B2 (en) | 2014-06-20 | 2017-07-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Combination interconnect structure and methods of forming same |
US10727122B2 (en) | 2014-12-08 | 2020-07-28 | International Business Machines Corporation | Self-aligned via interconnect structures |
US9837309B2 (en) | 2015-11-19 | 2017-12-05 | International Business Machines Corporation | Semiconductor via structure with lower electrical resistance |
US9735051B2 (en) * | 2015-12-14 | 2017-08-15 | International Business Machines Corporation | Semiconductor device interconnect structures formed by metal reflow process |
US9837314B2 (en) * | 2016-02-02 | 2017-12-05 | Tokyo Electron Limited | Self-alignment of metal and via using selective deposition |
KR20170110332A (ko) * | 2016-03-23 | 2017-10-11 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
US10211153B2 (en) | 2016-08-30 | 2019-02-19 | International Business Machines Corporation | Low aspect ratio interconnect |
TWI625991B (zh) * | 2016-10-17 | 2018-06-01 | 南亞電路板股份有限公司 | 電路板結構與其製造方法 |
US10236206B2 (en) * | 2017-07-03 | 2019-03-19 | Globalfoundries Inc. | Interconnects with hybrid metallization |
CN107946332B (zh) * | 2017-11-22 | 2021-07-23 | 德淮半导体有限公司 | 半导体结构、cmos图像传感器及其制备方法 |
US10395986B1 (en) | 2018-05-30 | 2019-08-27 | International Business Machines Corporation | Fully aligned via employing selective metal deposition |
US11652044B2 (en) * | 2021-02-26 | 2023-05-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Contact structure and method of making |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5897369A (en) * | 1996-05-16 | 1999-04-27 | Lg Semicon Co., Ltd. | Method for forming interconnection of a semiconductor device |
US6383821B1 (en) * | 1999-10-29 | 2002-05-07 | Conexant Systems, Inc. | Semiconductor device and process |
US6403456B1 (en) * | 2000-08-22 | 2002-06-11 | Advanced Micro Devices, Inc. | T or T/Y gate formation using trim etch processing |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04162452A (ja) * | 1990-10-24 | 1992-06-05 | Nec Kyushu Ltd | 半導体装置の製造方法 |
US5739579A (en) * | 1992-06-29 | 1998-04-14 | Intel Corporation | Method for forming interconnections for semiconductor fabrication and semiconductor device having such interconnections |
US5453575A (en) | 1993-02-01 | 1995-09-26 | Endosonics Corporation | Apparatus and method for detecting blood flow in intravascular ultrasonic imaging |
US6285082B1 (en) | 1995-01-03 | 2001-09-04 | International Business Machines Corporation | Soft metal conductor |
US5614765A (en) | 1995-06-07 | 1997-03-25 | Advanced Micro Devices, Inc. | Self aligned via dual damascene |
JP3228181B2 (ja) * | 1997-05-12 | 2001-11-12 | ヤマハ株式会社 | 平坦配線形成法 |
US6069068A (en) * | 1997-05-30 | 2000-05-30 | International Business Machines Corporation | Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity |
US5821168A (en) * | 1997-07-16 | 1998-10-13 | Motorola, Inc. | Process for forming a semiconductor device |
US6127258A (en) | 1998-06-25 | 2000-10-03 | Motorola Inc. | Method for forming a semiconductor device |
JP2001007200A (ja) * | 1999-06-21 | 2001-01-12 | Matsushita Electronics Industry Corp | 配線の形成方法 |
JP2001015510A (ja) * | 1999-06-28 | 2001-01-19 | Hitachi Ltd | 半導体装置およびその製造方法 |
US6297149B1 (en) * | 1999-10-05 | 2001-10-02 | International Business Machines Corporation | Methods for forming metal interconnects |
JP2001319928A (ja) | 2000-05-08 | 2001-11-16 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
US20020086519A1 (en) * | 2000-12-29 | 2002-07-04 | Houston Theodore W. | Stacked vias and method |
JP2002368081A (ja) * | 2001-06-06 | 2002-12-20 | Sony Corp | 半導体装置の製造方法 |
US6537913B2 (en) * | 2001-06-29 | 2003-03-25 | Intel Corporation | Method of making a semiconductor device with aluminum capped copper interconnect pads |
TW522479B (en) | 2001-12-07 | 2003-03-01 | Taiwan Semiconductor Mfg | Method of forming dual-damascene |
US20040108217A1 (en) * | 2002-12-05 | 2004-06-10 | Dubin Valery M. | Methods for forming copper interconnect structures by co-plating of noble metals and structures formed thereby |
US7060619B2 (en) * | 2003-03-04 | 2006-06-13 | Infineon Technologies Ag | Reduction of the shear stress in copper via's in organic interlayer dielectric material |
US20040222527A1 (en) * | 2003-05-06 | 2004-11-11 | Dostalik William W. | Dual damascene pattern liner |
-
2003
- 2003-06-23 US US10/604,026 patent/US6958540B2/en not_active Expired - Lifetime
-
2004
- 2004-06-14 EP EP04741743A patent/EP1649510A2/en not_active Ceased
- 2004-06-14 WO PCT/EP2004/051046 patent/WO2004114395A2/en active Search and Examination
- 2004-06-14 JP JP2006516136A patent/JP2009514186A/ja active Pending
- 2004-06-14 KR KR1020057022397A patent/KR100772602B1/ko not_active IP Right Cessation
- 2004-06-14 CN CNB2004800149580A patent/CN100405574C/zh not_active Expired - Fee Related
- 2004-06-18 TW TW098105172A patent/TW200931593A/zh unknown
- 2004-06-18 TW TW093117825A patent/TWI345818B/zh not_active IP Right Cessation
-
2005
- 2005-07-05 US US11/174,985 patent/US7300867B2/en not_active Expired - Fee Related
-
2007
- 2007-08-30 US US11/847,657 patent/US7704876B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5897369A (en) * | 1996-05-16 | 1999-04-27 | Lg Semicon Co., Ltd. | Method for forming interconnection of a semiconductor device |
US6383821B1 (en) * | 1999-10-29 | 2002-05-07 | Conexant Systems, Inc. | Semiconductor device and process |
US6403456B1 (en) * | 2000-08-22 | 2002-06-11 | Advanced Micro Devices, Inc. | T or T/Y gate formation using trim etch processing |
Also Published As
Publication number | Publication date |
---|---|
WO2004114395A3 (en) | 2005-02-10 |
US20080026566A1 (en) | 2008-01-31 |
US7300867B2 (en) | 2007-11-27 |
CN1799137A (zh) | 2006-07-05 |
TW200512874A (en) | 2005-04-01 |
JP2009514186A (ja) | 2009-04-02 |
EP1649510A2 (en) | 2006-04-26 |
US6958540B2 (en) | 2005-10-25 |
TWI345818B (en) | 2011-07-21 |
KR20060025149A (ko) | 2006-03-20 |
WO2004114395A2 (en) | 2004-12-29 |
KR100772602B1 (ko) | 2007-11-02 |
US20050245068A1 (en) | 2005-11-03 |
US20040262764A1 (en) | 2004-12-30 |
US7704876B2 (en) | 2010-04-27 |
TW200931593A (en) | 2009-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100405574C (zh) | 对线路和通孔导体使用不同材料的双重镶嵌互连结构 | |
CN100576494C (zh) | 利用保护性通路盖层形成半导体器件的双镶嵌布线的方法 | |
US6838355B1 (en) | Damascene interconnect structures including etchback for low-k dielectric materials | |
US6680514B1 (en) | Contact capping local interconnect | |
KR100389174B1 (ko) | 금속 캐패시터 및 이의 형성 방법 | |
CN101390203B (zh) | 互连结构及其制造方法 | |
US7393776B2 (en) | Method of forming closed air gap interconnects and structures formed thereby | |
US6917108B2 (en) | Reliable low-k interconnect structure with hybrid dielectric | |
US7449407B2 (en) | Air gap for dual damascene applications | |
US7138329B2 (en) | Air gap for tungsten/aluminum plug applications | |
US7514354B2 (en) | Methods for forming damascene wiring structures having line and plug conductors formed from different materials | |
US6331481B1 (en) | Damascene etchback for low ε dielectric | |
CN100378953C (zh) | 在层间介质互连中形成低电阻和可靠过孔的方法 | |
US20050263896A1 (en) | Air gap formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device | |
US20060205204A1 (en) | Method of making a semiconductor interconnect with a metal cap | |
US20020171147A1 (en) | Structure of a dual damascene via | |
US6756672B1 (en) | Use of sic for preventing copper contamination of low-k dielectric layers | |
US6663787B1 (en) | Use of ta/tan for preventing copper contamination of low-k dielectric layers | |
US6350695B1 (en) | Pillar process for copper interconnect scheme | |
US20230187278A1 (en) | Via alignment in single damascene structure | |
US8048799B2 (en) | Method for forming copper wiring in semiconductor device | |
CN102569167A (zh) | 双镶嵌结构的形成方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170105 Address after: The Cayman Islands (British) Grand Cayman Patentee after: INTERNATIONAL BUSINESS MACHINES Corp. Address before: American New York Patentee before: Globalfoundries second U.S. Semiconductor Co.,Ltd. Effective date of registration: 20170105 Address after: American New York Patentee after: Globalfoundries second U.S. Semiconductor Co.,Ltd. Address before: American New York Patentee before: International Business Machines Corp. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180328 Address after: Ontario, Canada Patentee after: International Business Machines Corp. Address before: The Cayman Islands (British) Grand Cayman Patentee before: INTERNATIONAL BUSINESS MACHINES Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080723 Termination date: 20210614 |