CN100375256C - 粘附方法及其装置 - Google Patents

粘附方法及其装置 Download PDF

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Publication number
CN100375256C
CN100375256C CNB038098040A CN03809804A CN100375256C CN 100375256 C CN100375256 C CN 100375256C CN B038098040 A CNB038098040 A CN B038098040A CN 03809804 A CN03809804 A CN 03809804A CN 100375256 C CN100375256 C CN 100375256C
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CN
China
Prior art keywords
resin
substrate
mentioned
temperature
installation elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB038098040A
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English (en)
Chinese (zh)
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CN1650415A (zh
Inventor
山内朗
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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Publication date
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Publication of CN1650415A publication Critical patent/CN1650415A/zh
Application granted granted Critical
Publication of CN100375256C publication Critical patent/CN100375256C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CNB038098040A 2002-04-30 2003-04-28 粘附方法及其装置 Expired - Fee Related CN100375256C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP128468/2002 2002-04-30
JP2002128468 2002-04-30
JP292580/2002 2002-10-04
JP2002292580A JP4014481B2 (ja) 2002-04-30 2002-10-04 ボンディング方法およびその装置

Publications (2)

Publication Number Publication Date
CN1650415A CN1650415A (zh) 2005-08-03
CN100375256C true CN100375256C (zh) 2008-03-12

Family

ID=29405300

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038098040A Expired - Fee Related CN100375256C (zh) 2002-04-30 2003-04-28 粘附方法及其装置

Country Status (5)

Country Link
JP (1) JP4014481B2 (https=)
KR (1) KR100978697B1 (https=)
CN (1) CN100375256C (https=)
TW (1) TWI237335B (https=)
WO (1) WO2003094222A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109429438A (zh) * 2017-08-25 2019-03-05 阳程科技股份有限公司 薄膜显示器与软性电路板的压合方法及其压合装置
US11251045B2 (en) 2016-02-16 2022-02-15 Ev Group E. Thallner Gmbh Device and method for bonding of substrates

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005347303A (ja) * 2004-05-31 2005-12-15 Canon Inc 熱圧着装置
JP4687273B2 (ja) * 2005-06-23 2011-05-25 住友電気工業株式会社 電子部品の実装方法
JP4628234B2 (ja) * 2005-09-30 2011-02-09 オプトレックス株式会社 圧着装置および圧着方法
KR100825799B1 (ko) * 2007-01-03 2008-04-29 삼성전자주식회사 다이 접착 공정의 보이드 형성을 억제하는 반도체 칩 및이를 포함하는 반도체 패키지
JP4340703B2 (ja) * 2007-11-01 2009-10-07 シャープ株式会社 半導体実装装置および半導体実装方法
KR20090066593A (ko) * 2007-12-20 2009-06-24 삼성전자주식회사 플립칩 본딩장치 및 플립칩 본딩방법
KR101119541B1 (ko) * 2009-11-30 2012-02-22 (주)멜파스 Ａｃｆ본딩을 위한 압착 장치 및 상기 압착 장치의 동작 방법
JP5496141B2 (ja) * 2011-03-30 2014-05-21 富士フイルム株式会社 電子部品の製造方法
KR101331590B1 (ko) * 2011-04-06 2013-11-20 주식회사 휴템 전자기파 가열을 이용한 웨이퍼 본더
CN102520221B (zh) * 2011-12-21 2014-02-19 中微光电子(潍坊)有限公司 一种电致发光测试电极的制作方法
TWI501828B (zh) * 2012-03-13 2015-10-01 印能科技股份有限公司 晶片壓合裝置及方法
CH707480B1 (de) * 2013-01-21 2016-08-31 Besi Switzerland Ag Bondkopf mit einem heiz- und kühlbaren Saugorgan.
US9093549B2 (en) * 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9659902B2 (en) * 2014-02-28 2017-05-23 Kulicke And Soffa Industries, Inc. Thermocompression bonding systems and methods of operating the same
KR102158822B1 (ko) * 2014-06-10 2020-09-22 세메스 주식회사 본딩 헤드 및 이를 포함하는 다이 본딩 장치
KR102295986B1 (ko) 2014-12-01 2021-08-31 삼성디스플레이 주식회사 칩 본딩 장치 및 칩 본딩 방법
JP6752722B2 (ja) * 2015-02-03 2020-09-09 東レエンジニアリング株式会社 実装装置および実装方法
JP6680699B2 (ja) * 2015-02-03 2020-04-15 東レエンジニアリング株式会社 実装装置および実装方法
TWI607884B (zh) * 2016-06-04 2017-12-11 Usun Technology Co Ltd Pressing method of thin film display and flexible circuit board and pressing device thereof
KR102439617B1 (ko) * 2017-06-27 2022-09-05 주식회사 미코세라믹스 본딩 헤드 및 이를 갖는 본딩 장치
CN108822749B (zh) * 2018-08-20 2023-10-20 江苏省特种设备安全监督检验研究院 一种环氧树脂加热加压装置
KR101959215B1 (ko) * 2018-11-16 2019-03-19 (주)제이스텍 디스플레이 패널 또는 터치패널의 저추력 본딩장치
CN110491802B (zh) * 2019-07-16 2022-03-01 盐城瑾诚科技有限公司 用于集成电路封装过程中的散热设备
KR102604789B1 (ko) * 2020-11-30 2023-11-21 세메스 주식회사 히터 조립체 및 이를 포함하는 본딩 헤드
CN119901573B (zh) * 2025-01-21 2025-09-23 马鞍山钢铁股份有限公司 一种大直径圆柱钢铁试样的自动热顶锻试验装置及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186300A (ja) * 1997-12-19 1999-07-09 Sony Corp 半導体装置の封止方法
JP2000077469A (ja) * 1998-08-31 2000-03-14 Hitachi Chem Co Ltd 半導体装置の製造方法
US6077382A (en) * 1997-05-09 2000-06-20 Citizen Watch Co., Ltd Mounting method of semiconductor chip
JP2001068508A (ja) * 1999-08-30 2001-03-16 Sony Chem Corp 実装方法
CN1295265A (zh) * 1999-11-04 2001-05-16 精工爱普生株式会社 部件安装方法和电光装置的制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187429A (ja) * 1997-05-09 1999-03-30 Citizen Watch Co Ltd 半導体チップの実装方法
JP2002057186A (ja) * 2000-05-31 2002-02-22 Nippon Avionics Co Ltd フリップチップ実装方法およびプリント配線板
JP3646056B2 (ja) * 2000-11-06 2005-05-11 日本アビオニクス株式会社 フリップチップ実装方法
JP4626839B2 (ja) * 2001-05-21 2011-02-09 日本電気株式会社 半導体装置の実装方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6077382A (en) * 1997-05-09 2000-06-20 Citizen Watch Co., Ltd Mounting method of semiconductor chip
JPH11186300A (ja) * 1997-12-19 1999-07-09 Sony Corp 半導体装置の封止方法
JP2000077469A (ja) * 1998-08-31 2000-03-14 Hitachi Chem Co Ltd 半導体装置の製造方法
JP2001068508A (ja) * 1999-08-30 2001-03-16 Sony Chem Corp 実装方法
CN1295265A (zh) * 1999-11-04 2001-05-16 精工爱普生株式会社 部件安装方法和电光装置的制造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11251045B2 (en) 2016-02-16 2022-02-15 Ev Group E. Thallner Gmbh Device and method for bonding of substrates
US11527410B2 (en) 2016-02-16 2022-12-13 Ev Group E. Thallner Gmbh Device and method for bonding of substrates
CN109429438A (zh) * 2017-08-25 2019-03-05 阳程科技股份有限公司 薄膜显示器与软性电路板的压合方法及其压合装置
CN109429438B (zh) * 2017-08-25 2020-08-14 阳程科技股份有限公司 薄膜显示器与软性电路板的压合方法及其压合装置

Also Published As

Publication number Publication date
JP2004031885A (ja) 2004-01-29
KR20050000499A (ko) 2005-01-05
CN1650415A (zh) 2005-08-03
KR100978697B1 (ko) 2010-08-30
TWI237335B (en) 2005-08-01
TW200401381A (en) 2004-01-16
JP4014481B2 (ja) 2007-11-28
WO2003094222A1 (en) 2003-11-13

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Granted publication date: 20080312