JP4014481B2 - ボンディング方法およびその装置 - Google Patents

ボンディング方法およびその装置 Download PDF

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Publication number
JP4014481B2
JP4014481B2 JP2002292580A JP2002292580A JP4014481B2 JP 4014481 B2 JP4014481 B2 JP 4014481B2 JP 2002292580 A JP2002292580 A JP 2002292580A JP 2002292580 A JP2002292580 A JP 2002292580A JP 4014481 B2 JP4014481 B2 JP 4014481B2
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JP
Japan
Prior art keywords
substrate
resin
temperature
mounting member
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002292580A
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English (en)
Japanese (ja)
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JP2004031885A (ja
JP2004031885A5 (https=
Inventor
朗 山内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Priority to JP2002292580A priority Critical patent/JP4014481B2/ja
Priority to PCT/JP2003/005491 priority patent/WO2003094222A1/ja
Priority to CNB038098040A priority patent/CN100375256C/zh
Priority to KR1020047016361A priority patent/KR100978697B1/ko
Priority to TW092110035A priority patent/TWI237335B/zh
Publication of JP2004031885A publication Critical patent/JP2004031885A/ja
Publication of JP2004031885A5 publication Critical patent/JP2004031885A5/ja
Application granted granted Critical
Publication of JP4014481B2 publication Critical patent/JP4014481B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2002292580A 2002-04-30 2002-10-04 ボンディング方法およびその装置 Expired - Fee Related JP4014481B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2002292580A JP4014481B2 (ja) 2002-04-30 2002-10-04 ボンディング方法およびその装置
PCT/JP2003/005491 WO2003094222A1 (en) 2002-04-30 2003-04-28 Bonding method and bonding device
CNB038098040A CN100375256C (zh) 2002-04-30 2003-04-28 粘附方法及其装置
KR1020047016361A KR100978697B1 (ko) 2002-04-30 2003-04-28 본딩방법 및 그 장치
TW092110035A TWI237335B (en) 2002-04-30 2003-04-29 Bonding method and apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002128468 2002-04-30
JP2002292580A JP4014481B2 (ja) 2002-04-30 2002-10-04 ボンディング方法およびその装置

Publications (3)

Publication Number Publication Date
JP2004031885A JP2004031885A (ja) 2004-01-29
JP2004031885A5 JP2004031885A5 (https=) 2005-06-02
JP4014481B2 true JP4014481B2 (ja) 2007-11-28

Family

ID=29405300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002292580A Expired - Fee Related JP4014481B2 (ja) 2002-04-30 2002-10-04 ボンディング方法およびその装置

Country Status (5)

Country Link
JP (1) JP4014481B2 (https=)
KR (1) KR100978697B1 (https=)
CN (1) CN100375256C (https=)
TW (1) TWI237335B (https=)
WO (1) WO2003094222A1 (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005347303A (ja) * 2004-05-31 2005-12-15 Canon Inc 熱圧着装置
JP4687273B2 (ja) * 2005-06-23 2011-05-25 住友電気工業株式会社 電子部品の実装方法
JP4628234B2 (ja) * 2005-09-30 2011-02-09 オプトレックス株式会社 圧着装置および圧着方法
KR100825799B1 (ko) * 2007-01-03 2008-04-29 삼성전자주식회사 다이 접착 공정의 보이드 형성을 억제하는 반도체 칩 및이를 포함하는 반도체 패키지
JP4340703B2 (ja) * 2007-11-01 2009-10-07 シャープ株式会社 半導体実装装置および半導体実装方法
KR20090066593A (ko) * 2007-12-20 2009-06-24 삼성전자주식회사 플립칩 본딩장치 및 플립칩 본딩방법
KR101119541B1 (ko) * 2009-11-30 2012-02-22 (주)멜파스 Ａｃｆ본딩을 위한 압착 장치 및 상기 압착 장치의 동작 방법
JP5496141B2 (ja) * 2011-03-30 2014-05-21 富士フイルム株式会社 電子部品の製造方法
KR101331590B1 (ko) * 2011-04-06 2013-11-20 주식회사 휴템 전자기파 가열을 이용한 웨이퍼 본더
CN102520221B (zh) * 2011-12-21 2014-02-19 中微光电子(潍坊)有限公司 一种电致发光测试电极的制作方法
TWI501828B (zh) * 2012-03-13 2015-10-01 印能科技股份有限公司 晶片壓合裝置及方法
CH707480B1 (de) * 2013-01-21 2016-08-31 Besi Switzerland Ag Bondkopf mit einem heiz- und kühlbaren Saugorgan.
US9093549B2 (en) * 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9659902B2 (en) * 2014-02-28 2017-05-23 Kulicke And Soffa Industries, Inc. Thermocompression bonding systems and methods of operating the same
KR102158822B1 (ko) * 2014-06-10 2020-09-22 세메스 주식회사 본딩 헤드 및 이를 포함하는 다이 본딩 장치
KR102295986B1 (ko) 2014-12-01 2021-08-31 삼성디스플레이 주식회사 칩 본딩 장치 및 칩 본딩 방법
JP6752722B2 (ja) * 2015-02-03 2020-09-09 東レエンジニアリング株式会社 実装装置および実装方法
JP6680699B2 (ja) * 2015-02-03 2020-04-15 東レエンジニアリング株式会社 実装装置および実装方法
KR20220025929A (ko) 2016-02-16 2022-03-03 에베 그룹 에. 탈너 게엠베하 기판 결합 방법
TWI607884B (zh) * 2016-06-04 2017-12-11 Usun Technology Co Ltd Pressing method of thin film display and flexible circuit board and pressing device thereof
KR102439617B1 (ko) * 2017-06-27 2022-09-05 주식회사 미코세라믹스 본딩 헤드 및 이를 갖는 본딩 장치
CN109429438B (zh) * 2017-08-25 2020-08-14 阳程科技股份有限公司 薄膜显示器与软性电路板的压合方法及其压合装置
CN108822749B (zh) * 2018-08-20 2023-10-20 江苏省特种设备安全监督检验研究院 一种环氧树脂加热加压装置
KR101959215B1 (ko) * 2018-11-16 2019-03-19 (주)제이스텍 디스플레이 패널 또는 터치패널의 저추력 본딩장치
CN110491802B (zh) * 2019-07-16 2022-03-01 盐城瑾诚科技有限公司 用于集成电路封装过程中的散热设备
KR102604789B1 (ko) * 2020-11-30 2023-11-21 세메스 주식회사 히터 조립체 및 이를 포함하는 본딩 헤드
CN119901573B (zh) * 2025-01-21 2025-09-23 马鞍山钢铁股份有限公司 一种大直径圆柱钢铁试样的自动热顶锻试验装置及方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187429A (ja) * 1997-05-09 1999-03-30 Citizen Watch Co Ltd 半導体チップの実装方法
US6077382A (en) * 1997-05-09 2000-06-20 Citizen Watch Co., Ltd Mounting method of semiconductor chip
JPH11186300A (ja) * 1997-12-19 1999-07-09 Sony Corp 半導体装置の封止方法
JP3937270B2 (ja) * 1998-08-31 2007-06-27 日立化成工業株式会社 半導体装置の製造方法
JP3376968B2 (ja) * 1999-08-30 2003-02-17 ソニーケミカル株式会社 実装方法
JP3815149B2 (ja) * 1999-11-04 2006-08-30 セイコーエプソン株式会社 部品実装方法および電気光学装置の製造方法
JP2002057186A (ja) * 2000-05-31 2002-02-22 Nippon Avionics Co Ltd フリップチップ実装方法およびプリント配線板
JP3646056B2 (ja) * 2000-11-06 2005-05-11 日本アビオニクス株式会社 フリップチップ実装方法
JP4626839B2 (ja) * 2001-05-21 2011-02-09 日本電気株式会社 半導体装置の実装方法

Also Published As

Publication number Publication date
JP2004031885A (ja) 2004-01-29
KR20050000499A (ko) 2005-01-05
CN1650415A (zh) 2005-08-03
KR100978697B1 (ko) 2010-08-30
TWI237335B (en) 2005-08-01
CN100375256C (zh) 2008-03-12
TW200401381A (en) 2004-01-16
WO2003094222A1 (en) 2003-11-13

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