CN100363369C - 具有金属缺陷无机构架的层状有机-无机钙钛矿 - Google Patents
具有金属缺陷无机构架的层状有机-无机钙钛矿 Download PDFInfo
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- CN100363369C CN100363369C CNB011030941A CN01103094A CN100363369C CN 100363369 C CN100363369 C CN 100363369C CN B011030941 A CNB011030941 A CN B011030941A CN 01103094 A CN01103094 A CN 01103094A CN 100363369 C CN100363369 C CN 100363369C
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- Prior art keywords
- organic
- inorganic
- metal
- uhligite
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000002184 metal Substances 0.000 title claims abstract description 50
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- 150000002892 organic cations Chemical class 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 35
- 229910001507 metal halide Inorganic materials 0.000 claims abstract description 33
- 150000005309 metal halides Chemical class 0.000 claims abstract description 32
- 150000001449 anionic compounds Chemical class 0.000 claims abstract description 26
- 229910001412 inorganic anion Inorganic materials 0.000 claims abstract description 26
- -1 ammonium cations Chemical class 0.000 claims description 30
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 claims description 26
- 150000004985 diamines Chemical class 0.000 claims description 22
- 238000002360 preparation method Methods 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 16
- 230000026030 halogenation Effects 0.000 claims description 13
- 238000005658 halogenation reaction Methods 0.000 claims description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims description 13
- 239000001257 hydrogen Substances 0.000 claims description 13
- 229930192474 thiophene Natural products 0.000 claims description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 12
- 239000012433 hydrogen halide Substances 0.000 claims description 12
- 229910000039 hydrogen halide Inorganic materials 0.000 claims description 12
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 8
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052736 halogen Inorganic materials 0.000 claims description 7
- 150000002367 halogens Chemical group 0.000 claims description 7
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 6
- 125000003968 arylidene group Chemical group [H]C(c)=* 0.000 claims description 6
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical class CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical group I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims description 6
- 150000002736 metal compounds Chemical class 0.000 claims description 6
- 125000004103 aminoalkyl group Chemical group 0.000 claims description 5
- 229940045100 antimony triiodide Drugs 0.000 claims description 4
- KWQLUUQBTAXYCB-UHFFFAOYSA-K antimony(3+);triiodide Chemical compound I[Sb](I)I KWQLUUQBTAXYCB-UHFFFAOYSA-K 0.000 claims description 4
- 150000002240 furans Chemical class 0.000 claims description 4
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 4
- KOECRLKKXSXCPB-UHFFFAOYSA-K triiodobismuthane Chemical group I[Bi](I)I KOECRLKKXSXCPB-UHFFFAOYSA-K 0.000 claims description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 claims description 2
- BTOQKUYRJNXNGR-UHFFFAOYSA-N I.I.C=1C=CSC=1 Chemical compound I.I.C=1C=CSC=1 BTOQKUYRJNXNGR-UHFFFAOYSA-N 0.000 claims description 2
- 238000011065 in-situ storage Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 230000002950 deficient Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 39
- 239000000463 material Substances 0.000 description 11
- 239000011541 reaction mixture Substances 0.000 description 11
- 239000000243 solution Substances 0.000 description 9
- JTCFNJXQEFODHE-UHFFFAOYSA-N [Ca].[Ti] Chemical compound [Ca].[Ti] JTCFNJXQEFODHE-UHFFFAOYSA-N 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical group [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 5
- 150000001768 cations Chemical class 0.000 description 5
- 230000005669 field effect Effects 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 229910052797 bismuth Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000000010 aprotic solvent Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 150000001767 cationic compounds Chemical class 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 238000005424 photoluminescence Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 239000011877 solvent mixture Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- QIVUCLWGARAQIO-OLIXTKCUSA-N (3s)-n-[(3s,5s,6r)-6-methyl-2-oxo-1-(2,2,2-trifluoroethyl)-5-(2,3,6-trifluorophenyl)piperidin-3-yl]-2-oxospiro[1h-pyrrolo[2,3-b]pyridine-3,6'-5,7-dihydrocyclopenta[b]pyridine]-3'-carboxamide Chemical compound C1([C@H]2[C@H](N(C(=O)[C@@H](NC(=O)C=3C=C4C[C@]5(CC4=NC=3)C3=CC=CN=C3NC5=O)C2)CC(F)(F)F)C)=C(F)C=CC(F)=C1F QIVUCLWGARAQIO-OLIXTKCUSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 229910000043 hydrogen iodide Inorganic materials 0.000 description 1
- 229940071870 hydroiodic acid Drugs 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910001411 inorganic cation Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000009878 intermolecular interaction Effects 0.000 description 1
- 150000008040 ionic compounds Chemical class 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910001511 metal iodide Inorganic materials 0.000 description 1
- 150000001457 metallic cations Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 238000004467 single crystal X-ray diffraction Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012916 structural analysis Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F19/00—Metal compounds according to more than one of main groups C07F1/00 - C07F17/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02197—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides the material having a perovskite structure, e.g. BaTiO3
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/022—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31691—Inorganic layers composed of oxides or glassy oxides or oxide based glass with perovskite structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/50—Organic perovskites; Hybrid organic-inorganic perovskites [HOIP], e.g. CH3NH3PbI3
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Luminescent Compositions (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Heterocyclic Compounds Containing Sulfur Atoms (AREA)
Abstract
Description
Claims (24)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/499,621 US6429318B1 (en) | 2000-02-07 | 2000-02-07 | Layered organic-inorganic perovskites having metal-deficient inorganic frameworks |
US09/499,621 | 2000-02-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1316427A CN1316427A (zh) | 2001-10-10 |
CN100363369C true CN100363369C (zh) | 2008-01-23 |
Family
ID=23986003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011030941A Expired - Lifetime CN100363369C (zh) | 2000-02-07 | 2001-02-06 | 具有金属缺陷无机构架的层状有机-无机钙钛矿 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6429318B1 (zh) |
EP (1) | EP1122291B1 (zh) |
JP (1) | JP3579889B2 (zh) |
KR (1) | KR100416165B1 (zh) |
CN (1) | CN100363369C (zh) |
SG (1) | SG94745A1 (zh) |
TW (1) | TW585896B (zh) |
Cited By (4)
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CN104388089A (zh) * | 2014-11-04 | 2015-03-04 | 北京理工大学 | 一种高荧光量子产率杂化钙钛矿量子点材料及其制备方法 |
CN104737320A (zh) * | 2012-08-03 | 2015-06-24 | 洛桑联邦理工学院 | 有机金属卤化物钙钛矿异质结太阳能电池及其制造 |
CN106716664A (zh) * | 2014-07-11 | 2017-05-24 | 洛桑联邦理工学院 | 模板增强的有机无机钙钛矿异质结光伏器件 |
CN107973817A (zh) * | 2012-05-18 | 2018-05-01 | 牛津大学科技创新有限公司 | 包括具有混合阴离子的有机金属钙钛矿的光电器件 |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
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US6838198B2 (en) * | 2000-12-07 | 2005-01-04 | Industrial Research Limited | Organic/inorganic-oxide multilayer materials |
US7105360B2 (en) * | 2002-03-08 | 2006-09-12 | International Business Machines Corporation | Low temperature melt-processing of organic-inorganic hybrid |
GB2416428A (en) * | 2004-07-19 | 2006-01-25 | Seiko Epson Corp | Method for fabricating a semiconductor element from a dispersion of semiconductor particles |
GB0423506D0 (en) * | 2004-10-22 | 2004-11-24 | Univ Belfast | Light emitting complex salts |
EP3010054B1 (en) | 2012-05-18 | 2019-02-20 | Oxford University Innovation Limited | Optoelectronic device |
EP2850627B1 (en) | 2012-05-18 | 2016-04-06 | Isis Innovation Limited | Optoelectronic device comprising porous scaffold material and perovskites |
ES2707296T3 (es) | 2012-09-18 | 2019-04-03 | Univ Oxford Innovation Ltd | Dispositivo optoelectrónico |
EP2822009A1 (en) * | 2013-07-01 | 2015-01-07 | Ecole Polytechnique Fédérale de Lausanne (EPFL) | Solar cell and process for producing the same |
US10272384B2 (en) * | 2013-09-06 | 2019-04-30 | The Board Of Trustees Of The Leland Stanford Junior University | Reversible and irreversible chemisorption in nonporous, crystalline hybrid structures |
US11746290B2 (en) | 2013-09-26 | 2023-09-05 | Samsung Electronics Co., Ltd. | Nanocrystal particles and processes for synthesizing the same |
WO2015061555A1 (en) * | 2013-10-23 | 2015-04-30 | The Board Of Trustees Of The Leland Stanford Junior University | Two-dimensional perovskite phosphor and method of formation |
US9136408B2 (en) * | 2013-11-26 | 2015-09-15 | Hunt Energy Enterprises, Llc | Perovskite and other solar cell materials |
US11180660B2 (en) | 2013-11-26 | 2021-11-23 | Cubic Perovskite Llc | Mixed cation perovskite material devices |
US20160307704A1 (en) * | 2013-12-03 | 2016-10-20 | University Of Washington Through Its Center For Commercialization | Photovoltaic architectures incorporating organic-inorganic hybrid perovskite absorber |
WO2015099412A1 (ko) * | 2013-12-23 | 2015-07-02 | 한국화학연구원 | 무/유기 하이브리드 페로브스카이트 화합물 전구물질 |
KR101966245B1 (ko) | 2013-12-23 | 2019-04-08 | 한국화학연구원 | 무/유기 하이브리드 페로브스카이트 화합물 전구물질 |
CN103762344B (zh) * | 2014-01-21 | 2016-08-17 | 华中科技大学 | 一种两性分子改性的钙钛矿光电功能材料及其应用 |
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CN104737320B (zh) * | 2012-08-03 | 2018-02-27 | 洛桑联邦理工学院 | 有机金属卤化物钙钛矿异质结太阳能电池及其制造 |
CN106716664A (zh) * | 2014-07-11 | 2017-05-24 | 洛桑联邦理工学院 | 模板增强的有机无机钙钛矿异质结光伏器件 |
CN104388089A (zh) * | 2014-11-04 | 2015-03-04 | 北京理工大学 | 一种高荧光量子产率杂化钙钛矿量子点材料及其制备方法 |
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SG94745A1 (en) | 2003-03-18 |
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US6429318B1 (en) | 2002-08-06 |
JP2001220143A (ja) | 2001-08-14 |
EP1122291B1 (en) | 2012-09-12 |
KR100416165B1 (ko) | 2004-01-24 |
TW585896B (en) | 2004-05-01 |
EP1122291A3 (en) | 2003-07-30 |
EP1122291A2 (en) | 2001-08-08 |
KR20010078173A (ko) | 2001-08-20 |
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