CN100347845C - 制造半导体器件的方法 - Google Patents
制造半导体器件的方法 Download PDFInfo
- Publication number
- CN100347845C CN100347845C CNB2004100319047A CN200410031904A CN100347845C CN 100347845 C CN100347845 C CN 100347845C CN B2004100319047 A CNB2004100319047 A CN B2004100319047A CN 200410031904 A CN200410031904 A CN 200410031904A CN 100347845 C CN100347845 C CN 100347845C
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- Prior art keywords
- adhesive tape
- chip
- semiconductor
- semiconductor chip
- vibrator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims description 46
- 239000002390 adhesive tape Substances 0.000 claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 claims abstract description 21
- 238000005520 cutting process Methods 0.000 claims description 99
- 239000000853 adhesive Substances 0.000 claims description 10
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- 238000003199 nucleic acid amplification method Methods 0.000 description 2
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- 229920000098 polyolefin Polymers 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
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- 230000000644 propagated effect Effects 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP097223/2003 | 2003-03-31 | ||
JP2003097223A JP2004304066A (ja) | 2003-03-31 | 2003-03-31 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1534762A CN1534762A (zh) | 2004-10-06 |
CN100347845C true CN100347845C (zh) | 2007-11-07 |
Family
ID=33409070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100319047A Expired - Fee Related CN100347845C (zh) | 2003-03-31 | 2004-03-31 | 制造半导体器件的方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7015071B2 (zh) |
JP (1) | JP2004304066A (zh) |
KR (1) | KR20040086577A (zh) |
CN (1) | CN100347845C (zh) |
TW (1) | TW200503125A (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005166925A (ja) * | 2003-12-02 | 2005-06-23 | Tokyo Seimitsu Co Ltd | ウェーハ加工方法およびウェーハ加工装置 |
CN1975995B (zh) * | 2005-11-30 | 2010-09-29 | 嘉盛马来西亚公司 | 用于将单切单元传输到收集器中的设备和方法 |
JP5054933B2 (ja) | 2006-05-23 | 2012-10-24 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP4927484B2 (ja) * | 2006-09-13 | 2012-05-09 | 株式会社ディスコ | 積層用デバイスの製造方法 |
US7811904B2 (en) * | 2007-01-31 | 2010-10-12 | Alpha And Omega Semiconductor Incorporated | Method of fabricating a semiconductor device employing electroless plating |
SG148884A1 (en) * | 2007-06-15 | 2009-01-29 | Micron Technology Inc | Method and system for removing tape from substrates |
US7757742B2 (en) * | 2007-07-31 | 2010-07-20 | Asm Assembly Automation Ltd | Vibration-induced die detachment system |
WO2009109447A2 (de) * | 2008-02-29 | 2009-09-11 | Oerlikon Assembly Equipment Ag, Steinhausen | Chip-auswerfer |
WO2010061470A1 (ja) * | 2008-11-28 | 2010-06-03 | セイコーインスツル株式会社 | ウエハおよびパッケージ製品の製造方法 |
JPWO2010070753A1 (ja) * | 2008-12-18 | 2012-05-24 | セイコーインスツル株式会社 | ウエハおよびパッケージ製品の製造方法 |
TWI513668B (zh) * | 2009-02-23 | 2015-12-21 | Seiko Instr Inc | 玻璃密封型封裝的製造方法及玻璃基板 |
KR100934012B1 (ko) * | 2009-07-15 | 2009-12-28 | 주식회사 인아텍 | 웨이퍼 다이싱 방법 |
JP2012186532A (ja) | 2011-03-03 | 2012-09-27 | Seiko Instruments Inc | ウエハ、パッケージの製造方法、及び圧電振動子 |
JP2013065628A (ja) * | 2011-09-15 | 2013-04-11 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ並びにダイピックアップ装置及びダイピックアップ方法 |
JP2014076528A (ja) * | 2012-10-12 | 2014-05-01 | Murata Mfg Co Ltd | 電子部品の製造方法 |
JP2014093420A (ja) * | 2012-11-02 | 2014-05-19 | Toyota Motor Corp | ウェハを支持ディスクに接着する治具、および、それを用いた半導体装置の製造方法 |
JP6301203B2 (ja) * | 2014-06-02 | 2018-03-28 | 株式会社ディスコ | チップの製造方法 |
TWI546934B (zh) * | 2014-10-20 | 2016-08-21 | Playnitride Inc | Led陣列擴張方法及led陣列單元 |
TWI685046B (zh) * | 2017-03-24 | 2020-02-11 | 日商新川股份有限公司 | 拾取裝置以及拾取方法 |
JP7015668B2 (ja) * | 2017-10-11 | 2022-02-03 | 株式会社ディスコ | 板状物の分割装置 |
JP2019169516A (ja) * | 2018-03-22 | 2019-10-03 | 東芝メモリ株式会社 | 半導体装置の突き上げ装置及び突き上げ方法 |
KR102366826B1 (ko) * | 2020-03-06 | 2022-02-24 | 세메스 주식회사 | 다이 이젝터 및 이를 포함하는 다이 본딩 장치 |
CN112435922A (zh) * | 2020-11-11 | 2021-03-02 | 武汉大学 | 一种在csoi上刻蚀悬臂梁的方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1246433A (zh) * | 1998-08-18 | 2000-03-08 | 琳得科株式会社 | 晶片转移装置 |
JP2000150426A (ja) * | 1998-11-05 | 2000-05-30 | Seiko Epson Corp | 圧電振動素子の製造方法 |
JP2000243727A (ja) * | 1999-02-22 | 2000-09-08 | Toyota Motor Corp | 半導体素子の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56100433A (en) * | 1980-01-14 | 1981-08-12 | Toshiba Corp | Manufacture of semiconductor device |
JPH02230754A (ja) * | 1989-03-03 | 1990-09-13 | Furukawa Electric Co Ltd:The | 粘着シートからの薄膜チップの剥離方法 |
JPH053242A (ja) * | 1991-06-25 | 1993-01-08 | Fujitsu Ltd | チツプ剥離装置 |
JPH06295930A (ja) | 1993-04-08 | 1994-10-21 | Fujitsu Ltd | 半導体チップ剥離装置及び剥離方法 |
TWI228956B (en) * | 1999-12-17 | 2005-03-01 | Matsushita Electric Ind Co Ltd | Cleaning apparatus for substrate material |
JP3906962B2 (ja) * | 2000-08-31 | 2007-04-18 | リンテック株式会社 | 半導体装置の製造方法 |
JP3706573B2 (ja) * | 2001-11-22 | 2005-10-12 | 株式会社ルネサステクノロジ | 半導体パッケージ及び半導体パッケージの製造方法 |
JP2003264203A (ja) | 2002-03-11 | 2003-09-19 | Hitachi Ltd | 半導体装置の製造方法 |
-
2003
- 2003-03-31 JP JP2003097223A patent/JP2004304066A/ja active Pending
-
2004
- 2004-03-26 KR KR1020040020816A patent/KR20040086577A/ko not_active Application Discontinuation
- 2004-03-30 TW TW093108734A patent/TW200503125A/zh unknown
- 2004-03-31 US US10/812,869 patent/US7015071B2/en active Active
- 2004-03-31 CN CNB2004100319047A patent/CN100347845C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1246433A (zh) * | 1998-08-18 | 2000-03-08 | 琳得科株式会社 | 晶片转移装置 |
JP2000150426A (ja) * | 1998-11-05 | 2000-05-30 | Seiko Epson Corp | 圧電振動素子の製造方法 |
JP2000243727A (ja) * | 1999-02-22 | 2000-09-08 | Toyota Motor Corp | 半導体素子の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US7015071B2 (en) | 2006-03-21 |
CN1534762A (zh) | 2004-10-06 |
JP2004304066A (ja) | 2004-10-28 |
US20050009299A1 (en) | 2005-01-13 |
TW200503125A (en) | 2005-01-16 |
KR20040086577A (ko) | 2004-10-11 |
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Address after: Tokyo, Japan Co-patentee after: Renesas semiconductor packaging and testing solutions Limited by Share Ltd. Patentee after: Renesas Electronics Corp. Address before: Tokyo, Japan Co-patentee before: Renesas semiconductor Kyushu pass Patentee before: Renesas Electronics Corp. |
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Effective date of registration: 20170706 Address after: Tokyo, Japan Co-patentee after: Renesas semiconductor Kyushu pass Patentee after: Renesas Electronics Corp. Address before: Tokyo, Japan Co-patentee before: RENESAS KITA NIPON SEMICONDUCT Patentee before: Renesas Electronics Corp. Effective date of registration: 20170706 Address after: Tokyo, Japan Co-patentee after: RENESAS KITA NIPON SEMICONDUCT Patentee after: Renesas Electronics Corp. Address before: Tokyo, Japan Co-patentee before: Renesas Japan Semiconductor, Inc. Patentee before: Renesas Electronics Corp. Effective date of registration: 20170706 Address after: Tokyo, Japan Co-patentee after: Renesas Japan Semiconductor, Inc. Patentee after: Renesas Electronics Corp. Address before: Kanagawa, Japan Co-patentee before: Renesas Japan Semiconductor, Inc. Patentee before: Renesas Electronics Corp. |
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Address after: Tokyo, Japan Co-patentee after: Renesas semiconductor packaging and testing solutions Limited by Share Ltd. Patentee after: Renesas Electronics Corp. Address before: Tokyo, Japan Co-patentee before: Renesas semiconductor Kyushu pass Patentee before: Renesas Electronics Corp. |
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Address after: Tokyo, Japan Co-patentee after: Renesas Japan Semiconductor, Inc. Patentee after: Renesas Electronics Corp. Address before: Kanagawa, Japan Co-patentee before: Renesas Japan Semiconductor, Inc. Patentee before: Renesas Electronics Corp. |
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Effective date of registration: 20170720 Address after: Tokyo, Japan Co-patentee after: Renesas semiconductor Kyushu pass Patentee after: Renesas Electronics Corp. Address before: Tokyo, Japan Co-patentee before: RENESAS KITA NIPON SEMICONDUCT Patentee before: Renesas Electronics Corp. Effective date of registration: 20170720 Address after: Tokyo, Japan Co-patentee after: RENESAS KITA NIPON SEMICONDUCT Patentee after: Renesas Electronics Corp. Address before: Tokyo, Japan Co-patentee before: Renesas Japan Semiconductor, Inc. Patentee before: Renesas Electronics Corp. |
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Granted publication date: 20071107 Termination date: 20190331 |
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CF01 | Termination of patent right due to non-payment of annual fee |