CN100343971C - 基板保持工具、电子仪器制造方法、光掩膜的制造方法 - Google Patents

基板保持工具、电子仪器制造方法、光掩膜的制造方法 Download PDF

Info

Publication number
CN100343971C
CN100343971C CNB2004100327749A CN200410032774A CN100343971C CN 100343971 C CN100343971 C CN 100343971C CN B2004100327749 A CNB2004100327749 A CN B2004100327749A CN 200410032774 A CN200410032774 A CN 200410032774A CN 100343971 C CN100343971 C CN 100343971C
Authority
CN
China
Prior art keywords
substrate
instrument
keeps
keep
supporting zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100327749A
Other languages
English (en)
Chinese (zh)
Other versions
CN1540737A (zh
Inventor
千绵刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Corp
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of CN1540737A publication Critical patent/CN1540737A/zh
Application granted granted Critical
Publication of CN100343971C publication Critical patent/CN100343971C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01D—CONSTRUCTION OF BRIDGES, ELEVATED ROADWAYS OR VIADUCTS; ASSEMBLY OF BRIDGES
    • E01D19/00—Structural or constructional details of bridges
    • E01D19/06—Arrangement, construction or bridging of expansion joints
    • E01D19/062—Joints having intermediate beams
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01D—CONSTRUCTION OF BRIDGES, ELEVATED ROADWAYS OR VIADUCTS; ASSEMBLY OF BRIDGES
    • E01D19/00—Structural or constructional details of bridges
    • E01D19/06—Arrangement, construction or bridging of expansion joints
    • E01D19/065—Joints having sliding plates
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01D—CONSTRUCTION OF BRIDGES, ELEVATED ROADWAYS OR VIADUCTS; ASSEMBLY OF BRIDGES
    • E01D19/00—Structural or constructional details of bridges
    • E01D19/08—Damp-proof or other insulating layers; Drainage arrangements or devices ; Bridge deck surfacings
    • E01D19/086—Drainage arrangements or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Packaging Frangible Articles (AREA)
CNB2004100327749A 2003-04-21 2004-04-21 基板保持工具、电子仪器制造方法、光掩膜的制造方法 Expired - Fee Related CN100343971C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003115999A JP2004323130A (ja) 2003-04-21 2003-04-21 基板保持具、電子デバイスの製造方法、フォトマスクの製造方法
JP115999/2003 2003-04-21

Publications (2)

Publication Number Publication Date
CN1540737A CN1540737A (zh) 2004-10-27
CN100343971C true CN100343971C (zh) 2007-10-17

Family

ID=33496386

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100327749A Expired - Fee Related CN100343971C (zh) 2003-04-21 2004-04-21 基板保持工具、电子仪器制造方法、光掩膜的制造方法

Country Status (4)

Country Link
JP (1) JP2004323130A (ko)
KR (1) KR100581689B1 (ko)
CN (1) CN100343971C (ko)
TW (1) TWI267113B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008260535A (ja) * 2005-07-29 2008-10-30 Nippon Sheet Glass Co Ltd 板状体搬送具
KR100978261B1 (ko) * 2005-12-29 2010-08-26 엘지디스플레이 주식회사 액정표시소자의 카세트
JP6050038B2 (ja) * 2012-06-29 2016-12-21 Hoya株式会社 ガラス基板ホルダ、及び電子機器用カバーガラスのガラス基板の製造方法
JP7205325B2 (ja) * 2019-03-19 2023-01-17 大日本印刷株式会社 被加工基板、インプリントモールド用基板及びインプリントモールド

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4191295A (en) * 1978-08-14 1980-03-04 Rca Corporation Processing rack
JPH02296351A (ja) * 1989-05-10 1990-12-06 Seiko Epson Corp ワーク整列収納用カセット
JPH0597172A (ja) * 1991-10-03 1993-04-20 Yodogawa Kasei Kk 基板支持棒およびそれを用いた基板用カセツト
JPH09306983A (ja) * 1996-05-10 1997-11-28 Kaijo Corp 基板受台並びにこれを具備した基板抜出し収容装置及び基板転移装置
CN1181621A (zh) * 1996-01-23 1998-05-13 日本电气株式会社 具有减少空间尘粒附着功效的半导体晶片容器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4191295A (en) * 1978-08-14 1980-03-04 Rca Corporation Processing rack
JPH02296351A (ja) * 1989-05-10 1990-12-06 Seiko Epson Corp ワーク整列収納用カセット
JPH0597172A (ja) * 1991-10-03 1993-04-20 Yodogawa Kasei Kk 基板支持棒およびそれを用いた基板用カセツト
CN1181621A (zh) * 1996-01-23 1998-05-13 日本电气株式会社 具有减少空间尘粒附着功效的半导体晶片容器
JPH09306983A (ja) * 1996-05-10 1997-11-28 Kaijo Corp 基板受台並びにこれを具備した基板抜出し収容装置及び基板転移装置

Also Published As

Publication number Publication date
CN1540737A (zh) 2004-10-27
TW200425249A (en) 2004-11-16
TWI267113B (en) 2006-11-21
JP2004323130A (ja) 2004-11-18
KR20040091570A (ko) 2004-10-28
KR100581689B1 (ko) 2006-05-22

Similar Documents

Publication Publication Date Title
TWI316503B (en) Substrate transferring apparatus
CN1284710C (zh) 在水平和垂直方向输送衬底的装置
CN1274567C (zh) 基片传送装置、取出基片的方法和容纳基片的方法
TWI408774B (zh) 基板夾持構件、具有此構件之基板處理設備、以及使用此構件處理基板之方法
CN1769981A (zh) 光取向用偏振光照射装置
WO2011126028A1 (ja) ガラス板の製造方法及び製造装置
CN1491144A (zh) 脆性材料基片的倒角方法以及倒角装置
CN100343971C (zh) 基板保持工具、电子仪器制造方法、光掩膜的制造方法
CN1787954A (zh) 薄板支撑体
CN1991490A (zh) 用于制造平板显示器的设备及制造该平板显示器的方法
JP2006140380A (ja) 基板処理装置
CN1912697A (zh) 基板的旋转处理装置
JP5774078B2 (ja) 積層ガラスブロックの保持具
CN1296145C (zh) 基板处理装置、涂敷装置及涂敷方法
CN101033037A (zh) 堆垛机
CN219131727U (zh) 用于边皮硅块的加工设备
CN206064971U (zh) 一种除胶工作台
CN1600658A (zh) 衬底搬进搬出装置和方法及衬底搬送装置和方法
CN116141112A (zh) 用于边皮硅块的加工设备及其加工方法
JP5938297B2 (ja) 研削装置
JP6147974B2 (ja) 研削装置
CN211516413U (zh) 单晶电池片裂片设备
CN211867537U (zh) 一种大型面板顶升接收台
CN202097622U (zh) 工作台
KR101068114B1 (ko) 유리기판 에칭장치

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20071017

Termination date: 20130421