TWI267113B - Substrate retaining tool, manufacturing method of electronic device and manufacturing method of mask - Google Patents

Substrate retaining tool, manufacturing method of electronic device and manufacturing method of mask

Info

Publication number
TWI267113B
TWI267113B TW093111095A TW93111095A TWI267113B TW I267113 B TWI267113 B TW I267113B TW 093111095 A TW093111095 A TW 093111095A TW 93111095 A TW93111095 A TW 93111095A TW I267113 B TWI267113 B TW I267113B
Authority
TW
Taiwan
Prior art keywords
substrate
manufacturing
retaining
mask
electronic device
Prior art date
Application number
TW093111095A
Other languages
English (en)
Other versions
TW200425249A (en
Inventor
Go Chiwata
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of TW200425249A publication Critical patent/TW200425249A/zh
Application granted granted Critical
Publication of TWI267113B publication Critical patent/TWI267113B/zh

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01D—CONSTRUCTION OF BRIDGES, ELEVATED ROADWAYS OR VIADUCTS; ASSEMBLY OF BRIDGES
    • E01D19/00—Structural or constructional details of bridges
    • E01D19/06—Arrangement, construction or bridging of expansion joints
    • E01D19/062—Joints having intermediate beams
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01D—CONSTRUCTION OF BRIDGES, ELEVATED ROADWAYS OR VIADUCTS; ASSEMBLY OF BRIDGES
    • E01D19/00—Structural or constructional details of bridges
    • E01D19/06—Arrangement, construction or bridging of expansion joints
    • E01D19/065—Joints having sliding plates
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01D—CONSTRUCTION OF BRIDGES, ELEVATED ROADWAYS OR VIADUCTS; ASSEMBLY OF BRIDGES
    • E01D19/00—Structural or constructional details of bridges
    • E01D19/08—Damp-proof or other insulating layers; Drainage arrangements or devices ; Bridge deck surfacings
    • E01D19/086—Drainage arrangements or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Packaging Frangible Articles (AREA)
TW093111095A 2003-04-21 2004-04-21 Substrate retaining tool, manufacturing method of electronic device and manufacturing method of mask TWI267113B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003115999A JP2004323130A (ja) 2003-04-21 2003-04-21 基板保持具、電子デバイスの製造方法、フォトマスクの製造方法

Publications (2)

Publication Number Publication Date
TW200425249A TW200425249A (en) 2004-11-16
TWI267113B true TWI267113B (en) 2006-11-21

Family

ID=33496386

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111095A TWI267113B (en) 2003-04-21 2004-04-21 Substrate retaining tool, manufacturing method of electronic device and manufacturing method of mask

Country Status (4)

Country Link
JP (1) JP2004323130A (zh)
KR (1) KR100581689B1 (zh)
CN (1) CN100343971C (zh)
TW (1) TWI267113B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008260535A (ja) * 2005-07-29 2008-10-30 Nippon Sheet Glass Co Ltd 板状体搬送具
KR100978261B1 (ko) * 2005-12-29 2010-08-26 엘지디스플레이 주식회사 액정표시소자의 카세트
JP6050038B2 (ja) * 2012-06-29 2016-12-21 Hoya株式会社 ガラス基板ホルダ、及び電子機器用カバーガラスのガラス基板の製造方法
JP7205325B2 (ja) * 2019-03-19 2023-01-17 大日本印刷株式会社 被加工基板、インプリントモールド用基板及びインプリントモールド

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4191295A (en) * 1978-08-14 1980-03-04 Rca Corporation Processing rack
JPH02296351A (ja) * 1989-05-10 1990-12-06 Seiko Epson Corp ワーク整列収納用カセット
JP2868653B2 (ja) * 1991-10-03 1999-03-10 淀川化成株式会社 基板支持棒およびそれを用いた基板用カセット
JP2806853B2 (ja) * 1996-01-23 1998-09-30 九州日本電気株式会社 半導体ウェハキャリア
JP3886180B2 (ja) * 1996-05-10 2007-02-28 株式会社カイジョー 基板受台並びにこれを具備した基板抜出し収容装置及び基板転移装置

Also Published As

Publication number Publication date
TW200425249A (en) 2004-11-16
JP2004323130A (ja) 2004-11-18
KR100581689B1 (ko) 2006-05-22
CN100343971C (zh) 2007-10-17
KR20040091570A (ko) 2004-10-28
CN1540737A (zh) 2004-10-27

Similar Documents

Publication Publication Date Title
TW200618161A (en) Substrate transport device, substrate transport method and exposure device
MY140100A (en) Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks
SE8402705L (sv) Losning for borttagning av lodmetall
TWI263676B (en) Compositions for chemically treating a substrate using foam technology
SG126711A1 (en) Manufacturing method of semiconductor device
EP1748499A3 (en) Light emitting devices and method for fabricating the same
TWI255971B (en) Lithographic apparatus and device manufacturing method
TW200601550A (en) Method of forming high voltage devices with retrograde well
TW200510854A (en) Method for forming film, method for forming wiring pattern, method for manufacturing semiconductor device, electro-optical device, and electronic devic
ATE423227T1 (de) Vorrichtung zum ätzen einer leitfähigen schicht und ätzverfahren
TW200721327A (en) Semiconductor device and method of manufacturing the same
DE602004020344D1 (de) Elektronische vorrichtung, anordnung und verfahren zum herstellen einer elektronischen vorrichtung
WO2007035423A3 (en) Method and apparatus for vertically orienting substrate processing tools in a clean space
MY139113A (en) Methods of etching photoresist on substrates
ATE509732T1 (de) Verfahren zur oberflächendotierung
MY146228A (en) Film sticking method and film sticking device
EP2019572A3 (en) Assembly substrate and method of manufacturing the same
TW200616074A (en) Cleaning process for semiconductor substrates
HK1084233A1 (en) Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
SG113456A1 (en) Method and apparatus for manufacturing a display, such as, for instance, a polymer oled display, a display and a substrate for use in the method
TWI267113B (en) Substrate retaining tool, manufacturing method of electronic device and manufacturing method of mask
DE10394251D2 (de) Vorrichtung zum Erzeugen einer vorbestimmten Orientierung
EP1544319A3 (en) Deposition mask
TW200641167A (en) Nanofabrication based on sam growth
EP1388890A4 (en) METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT