CH660551GA3 - - Google Patents

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Publication number
CH660551GA3
CH660551GA3 CH694183A CH694183A CH660551GA3 CH 660551G A3 CH660551G A3 CH 660551GA3 CH 694183 A CH694183 A CH 694183A CH 694183 A CH694183 A CH 694183A CH 660551G A3 CH660551G A3 CH 660551GA3
Authority
CH
Switzerland
Prior art keywords
integrated circuit
circuit
substrate
chip
hole
Prior art date
Application number
CH694183A
Other languages
English (en)
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP57228953A external-priority patent/JPS59120884A/ja
Priority claimed from JP58179845A external-priority patent/JPS6071980A/ja
Application filed filed Critical
Publication of CH660551GA3 publication Critical patent/CH660551GA3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W74/012—
    • H10W74/15—
    • H10W70/681—
    • H10W72/07236—
    • H10W72/856—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Clocks (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CH694183A 1982-12-27 1983-12-27 CH660551GA3 (index.php)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP57228953A JPS59120884A (ja) 1982-12-27 1982-12-27 回路ブロツクの樹脂封止構造
JP58179845A JPS6071980A (ja) 1983-09-28 1983-09-28 回路実装構造

Publications (1)

Publication Number Publication Date
CH660551GA3 true CH660551GA3 (index.php) 1987-05-15

Family

ID=26499576

Family Applications (1)

Application Number Title Priority Date Filing Date
CH694183A CH660551GA3 (index.php) 1982-12-27 1983-12-27

Country Status (2)

Country Link
US (1) US4644445A (index.php)
CH (1) CH660551GA3 (index.php)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
US5220726A (en) * 1991-06-26 1993-06-22 Xerox Corporation Method for manufacturing an electrically connectable module
US5469333A (en) * 1993-05-05 1995-11-21 International Business Machines Corporation Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads
DE69220333D1 (de) * 1991-12-11 1997-07-17 Ibm Elektronische Baugruppe mit schützendem Verkapselungsmaterial
DE69225896T2 (de) * 1992-12-15 1998-10-15 Sgs Thomson Microelectronics Träger für Halbleitergehäuse
US5386624A (en) * 1993-07-06 1995-02-07 Motorola, Inc. Method for underencapsulating components on circuit supporting substrates
JP3186925B2 (ja) * 1994-08-04 2001-07-11 シャープ株式会社 パネルの実装構造並びに集積回路搭載テープおよびその製造方法
DE19810060B4 (de) * 1997-05-07 2005-10-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Verbindung eines Bauelements mit einem Substrat und eine damit hergestellte elektrische Schaltung
DE19729073A1 (de) * 1997-07-08 1999-01-14 Bosch Gmbh Robert Verfahren zur Herstellung einer Klebeverbindung zwischen einem elektronischen Bauelement und einem Trägersubstrat
US6324069B1 (en) * 1997-10-29 2001-11-27 Hestia Technologies, Inc. Chip package with molded underfill
US6495083B2 (en) 1997-10-29 2002-12-17 Hestia Technologies, Inc. Method of underfilling an integrated circuit chip
EP1014776B1 (de) * 1998-12-24 2003-09-10 Nokia Corporation Verfahren zum mechanischen Befestigen von elektrischen Bauteilen auf einer Platine sowie eine Vorrichtung hergestellt nach diesem Verfahren
DE19954888C2 (de) * 1999-11-15 2002-01-10 Infineon Technologies Ag Verpackung für einen Halbleiterchip
DE10016135A1 (de) * 2000-03-31 2001-10-18 Infineon Technologies Ag Gehäusebaugruppe für ein elektronisches Bauteil
DE102005054985A1 (de) * 2005-11-16 2007-05-24 Marker Völkl International GmbH Schneegleitbrett sowie Schalenbauteil für ein Schneegleitbrett
DE102017204842A1 (de) 2017-03-22 2018-09-27 Robert Bosch Gmbh Kontaktanordnung
CN109152211B (zh) * 2018-08-22 2020-04-28 惠州市华星光电技术有限公司 倒装式发光二极管封装模块及其制造方法
KR20230023834A (ko) * 2020-12-09 2023-02-20 주식회사 솔루엠 에어포켓 방지 기판, 에어포켓 방지 기판 모듈, 이를 포함하는 전기기기 및 이를 포함하는 전기기기의 제조 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4048438A (en) * 1974-10-23 1977-09-13 Amp Incorporated Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips
US4065850A (en) * 1975-08-13 1978-01-03 Kollmorgen Technologies Corporation Method of making multi-wire electrical interconnecting member having a multi-wire matrix of insulated wires mechanically terminated thereon
US4143456A (en) * 1976-06-28 1979-03-13 Citizen Watch Commpany Ltd. Semiconductor device insulation method
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
GB2097998B (en) * 1981-05-06 1985-05-30 Standard Telephones Cables Ltd Mounting of integrated circuits
JPS5850572A (ja) * 1981-09-22 1983-03-25 株式会社東芝 デイスプレイ装置の製造方法
US4435740A (en) * 1981-10-30 1984-03-06 International Business Machines Corporation Electric circuit packaging member
US4573105A (en) * 1983-02-16 1986-02-25 Rca Corporation Printed circuit board assembly and method for the manufacture thereof

Also Published As

Publication number Publication date
US4644445A (en) 1987-02-17

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PL Patent ceased