CH659727A5 - Verfahren zum isolieren einer elektrischen vorrichtung. - Google Patents
Verfahren zum isolieren einer elektrischen vorrichtung. Download PDFInfo
- Publication number
- CH659727A5 CH659727A5 CH5517/82A CH551782A CH659727A5 CH 659727 A5 CH659727 A5 CH 659727A5 CH 5517/82 A CH5517/82 A CH 5517/82A CH 551782 A CH551782 A CH 551782A CH 659727 A5 CH659727 A5 CH 659727A5
- Authority
- CH
- Switzerland
- Prior art keywords
- electrical device
- resin
- maleimide
- composition
- anhydride
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 17
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 239000000203 mixture Substances 0.000 claims description 27
- 229920001187 thermosetting polymer Polymers 0.000 claims description 21
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 9
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical group O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 8
- 239000000428 dust Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims 25
- 239000003822 epoxy resin Substances 0.000 claims 24
- 239000011342 resin composition Substances 0.000 claims 24
- 150000003923 2,5-pyrrolediones Chemical class 0.000 claims 18
- 238000006243 chemical reaction Methods 0.000 claims 12
- 150000008065 acid anhydrides Chemical class 0.000 claims 10
- 239000011521 glass Substances 0.000 claims 9
- 238000005470 impregnation Methods 0.000 claims 9
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 8
- 150000008064 anhydrides Chemical class 0.000 claims 8
- 238000009413 insulation Methods 0.000 claims 8
- 150000001412 amines Chemical class 0.000 claims 7
- 238000004804 winding Methods 0.000 claims 7
- 239000003795 chemical substances by application Substances 0.000 claims 6
- 230000000694 effects Effects 0.000 claims 5
- 239000004760 aramid Substances 0.000 claims 4
- 229920003235 aromatic polyamide Polymers 0.000 claims 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 4
- -1 p-xylene-bismaleimide Chemical compound 0.000 claims 4
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 claims 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 3
- 229920001721 polyimide Polymers 0.000 claims 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 claims 2
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 claims 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 claims 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 claims 2
- 238000007605 air drying Methods 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 238000001879 gelation Methods 0.000 claims 2
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 claims 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 claims 1
- QDEQBRUNBFJJPW-UHFFFAOYSA-N 1-(3-chlorophenyl)pyrrole-2,5-dione Chemical compound ClC1=CC=CC(N2C(C=CC2=O)=O)=C1 QDEQBRUNBFJJPW-UHFFFAOYSA-N 0.000 claims 1
- CVKDEEISKBRPEQ-UHFFFAOYSA-N 1-(4-nitrophenyl)pyrrole-2,5-dione Chemical compound C1=CC([N+](=O)[O-])=CC=C1N1C(=O)C=CC1=O CVKDEEISKBRPEQ-UHFFFAOYSA-N 0.000 claims 1
- PUKLCKVOVCZYKF-UHFFFAOYSA-N 1-[2-(2,5-dioxopyrrol-1-yl)ethyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCN1C(=O)C=CC1=O PUKLCKVOVCZYKF-UHFFFAOYSA-N 0.000 claims 1
- QCOLXFOZKYRROA-UHFFFAOYSA-N 1-methoxy-3-phenylpyrrole-2,5-dione Chemical compound O=C1N(OC)C(=O)C=C1C1=CC=CC=C1 QCOLXFOZKYRROA-UHFFFAOYSA-N 0.000 claims 1
- VCFJLCCBKJNFKQ-UHFFFAOYSA-N 3-[4-(2,5-dioxopyrrol-3-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC(=CC=2)C=2C(NC(=O)C=2)=O)=C1 VCFJLCCBKJNFKQ-UHFFFAOYSA-N 0.000 claims 1
- SLJJEYCPTRKHFI-UHFFFAOYSA-N 3-[6-(2,5-dioxopyrrol-3-yl)hexyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(CCCCCCC=2C(NC(=O)C=2)=O)=C1 SLJJEYCPTRKHFI-UHFFFAOYSA-N 0.000 claims 1
- YAXXOCZAXKLLCV-UHFFFAOYSA-N 3-dodecyloxolane-2,5-dione Chemical compound CCCCCCCCCCCCC1CC(=O)OC1=O YAXXOCZAXKLLCV-UHFFFAOYSA-N 0.000 claims 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 claims 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 claims 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 230000032683 aging Effects 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 238000009835 boiling Methods 0.000 claims 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical class FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims 1
- 230000015556 catabolic process Effects 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 230000001010 compromised effect Effects 0.000 claims 1
- 230000007423 decrease Effects 0.000 claims 1
- 239000003085 diluting agent Substances 0.000 claims 1
- 235000019441 ethanol Nutrition 0.000 claims 1
- 238000000605 extraction Methods 0.000 claims 1
- 125000000623 heterocyclic group Chemical group 0.000 claims 1
- 150000002460 imidazoles Chemical class 0.000 claims 1
- 238000002955 isolation Methods 0.000 claims 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000010445 mica Substances 0.000 claims 1
- 229910052618 mica group Inorganic materials 0.000 claims 1
- 229920003986 novolac Polymers 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 150000002978 peroxides Chemical class 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims 1
- 230000009257 reactivity Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
- 150000003512 tertiary amines Chemical class 0.000 claims 1
- 239000002966 varnish Substances 0.000 claims 1
- 238000013007 heat curing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Organic Insulating Materials (AREA)
- Insulating Of Coils (AREA)
- Manufacture Of Motors, Generators (AREA)
- Epoxy Resins (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56147005A JPS5850716A (ja) | 1981-09-19 | 1981-09-19 | 電気機器の絶縁処理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH659727A5 true CH659727A5 (de) | 1987-02-13 |
Family
ID=15420402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH5517/82A CH659727A5 (de) | 1981-09-19 | 1982-09-17 | Verfahren zum isolieren einer elektrischen vorrichtung. |
Country Status (5)
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6016408A (ja) * | 1983-07-08 | 1985-01-28 | Toshiba Corp | 樹脂モ−ルドコイルの製造方法 |
| JP4854626B2 (ja) * | 2007-08-27 | 2012-01-18 | オンセミコンダクター・トレーディング・リミテッド | 低コンダクタアンプ |
| CN109831078A (zh) * | 2019-02-25 | 2019-05-31 | 重庆金康动力新能源有限公司 | 真空压力浸渍装置及浸漆衬套 |
| CN111816435B (zh) * | 2020-07-01 | 2021-11-23 | 海盐伟佳电器科技有限公司 | 一体式电流互感器生产线及其生产工艺 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH416771A (de) * | 1963-03-14 | 1966-07-15 | Schweizerische Isolawerke | Schmiegsames Wickelband |
-
1981
- 1981-09-19 JP JP56147005A patent/JPS5850716A/ja active Granted
-
1982
- 1982-09-16 AU AU88480/82A patent/AU537362B2/en not_active Ceased
- 1982-09-17 CH CH5517/82A patent/CH659727A5/de not_active IP Right Cessation
- 1982-09-17 KR KR8204220A patent/KR870001454B1/ko not_active Expired
- 1982-09-17 DE DE3234544A patent/DE3234544C2/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE3234544A1 (de) | 1983-04-07 |
| AU537362B2 (en) | 1984-06-21 |
| JPS5850716A (ja) | 1983-03-25 |
| KR870001454B1 (ko) | 1987-08-06 |
| KR840001761A (ko) | 1984-05-16 |
| DE3234544C2 (de) | 1983-12-15 |
| AU8848082A (en) | 1983-05-12 |
| JPH0330244B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-04-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |