CH636631A5 - Process for the preparation of an article having a surface which is suitable as a substrate for a strongly adherent metal layer deposited without current - Google Patents
Process for the preparation of an article having a surface which is suitable as a substrate for a strongly adherent metal layer deposited without current Download PDFInfo
- Publication number
- CH636631A5 CH636631A5 CH922376A CH922376A CH636631A5 CH 636631 A5 CH636631 A5 CH 636631A5 CH 922376 A CH922376 A CH 922376A CH 922376 A CH922376 A CH 922376A CH 636631 A5 CH636631 A5 CH 636631A5
- Authority
- CH
- Switzerland
- Prior art keywords
- phase
- solid
- metal layer
- epoxy
- polymerization product
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L13/00—Compositions of rubbers containing carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59877075A | 1975-07-25 | 1975-07-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH636631A5 true CH636631A5 (en) | 1983-06-15 |
Family
ID=24396845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH922376A CH636631A5 (en) | 1975-07-25 | 1976-07-19 | Process for the preparation of an article having a surface which is suitable as a substrate for a strongly adherent metal layer deposited without current |
Country Status (13)
Country | Link |
---|---|
JP (1) | JPS5953295B2 (nl) |
AT (1) | AT362008B (nl) |
AU (1) | AU503695B2 (nl) |
CA (1) | CA1077643A (nl) |
CH (1) | CH636631A5 (nl) |
DE (1) | DE2633094C3 (nl) |
FR (1) | FR2333024A1 (nl) |
GB (1) | GB1531826A (nl) |
IL (1) | IL50093A (nl) |
IT (1) | IT1066020B (nl) |
NL (1) | NL185935C (nl) |
SE (1) | SE7608413L (nl) |
ZA (1) | ZA763010B (nl) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2809917B1 (de) * | 1978-03-08 | 1979-07-26 | Dynamit Nobel Ag | Basismaterial zum Herstellen gedruckter Schaltungen nach Additivverfahren und Verfahren zum Herstellen desselben |
DE2828288C2 (de) * | 1978-06-28 | 1982-04-15 | Dynamit Nobel Ag, 5210 Troisdorf | Verfahren zur Herstellung von Basismaterial für gedruckte Schaltungen |
US4797508A (en) * | 1986-09-19 | 1989-01-10 | Firan Corporation | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby |
CA1318416C (en) * | 1987-01-14 | 1993-05-25 | Kollmorgen Corporation | Bonding compositions for the manufacture of additive printed wiring boards and articles made with the bonding composition |
JPH02117948A (ja) * | 1988-08-30 | 1990-05-02 | Japan Synthetic Rubber Co Ltd | 変性エポキシ組成物 |
JP4722954B2 (ja) * | 2008-03-17 | 2011-07-13 | イビデン株式会社 | プリント配線板用接着剤および、プリント配線板用接着剤層の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1790293B2 (de) * | 1966-02-22 | 1973-12-13 | Photocircuits Corp., Glen Cove, N.Y. (V.St.A.) | Verfahren zur Herstellung von ge druckten Schaltungen Ausscheidung aus 1665314 |
AT310285B (de) * | 1966-02-22 | 1973-09-25 | Photocircuits Corp | Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen |
-
1976
- 1976-05-20 ZA ZA763010A patent/ZA763010B/xx unknown
- 1976-06-23 CA CA255,541A patent/CA1077643A/en not_active Expired
- 1976-06-24 AU AU15255/76A patent/AU503695B2/en not_active Expired
- 1976-07-19 CH CH922376A patent/CH636631A5/de not_active IP Right Cessation
- 1976-07-20 DE DE2633094A patent/DE2633094C3/de not_active Expired
- 1976-07-21 IL IL50093A patent/IL50093A/xx unknown
- 1976-07-23 NL NLAANVRAGE7608242,A patent/NL185935C/nl not_active IP Right Cessation
- 1976-07-23 GB GB30744/76A patent/GB1531826A/en not_active Expired
- 1976-07-23 AT AT545376A patent/AT362008B/de not_active IP Right Cessation
- 1976-07-23 SE SE7608413A patent/SE7608413L/xx unknown
- 1976-07-26 JP JP51089616A patent/JPS5953295B2/ja not_active Expired
- 1976-07-26 IT IT50600/76A patent/IT1066020B/it active
- 1976-07-26 FR FR7622745A patent/FR2333024A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
IT1066020B (it) | 1985-03-04 |
AU503695B2 (en) | 1979-09-13 |
DE2633094C3 (de) | 1987-02-12 |
AU1525576A (en) | 1978-01-05 |
ZA763010B (en) | 1977-04-27 |
IL50093A (en) | 1980-01-31 |
JPS5215569A (en) | 1977-02-05 |
FR2333024B1 (nl) | 1979-05-25 |
JPS5953295B2 (ja) | 1984-12-24 |
ATA545376A (de) | 1980-09-15 |
IL50093A0 (en) | 1976-09-30 |
NL185935B (nl) | 1990-03-16 |
NL7608242A (nl) | 1977-01-27 |
DE2633094B2 (de) | 1979-08-30 |
NL185935C (nl) | 1990-08-16 |
DE2633094A1 (de) | 1977-01-27 |
CA1077643A (en) | 1980-05-13 |
FR2333024A1 (fr) | 1977-06-24 |
GB1531826A (en) | 1978-11-08 |
AT362008B (de) | 1981-04-27 |
SE7608413L (sv) | 1977-01-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUE | Assignment |
Owner name: AMP-AKZO CORPORATION |
|
PL | Patent ceased |