AU503695B2 - Diphase polymeric substrate for electroless deposition - Google Patents

Diphase polymeric substrate for electroless deposition

Info

Publication number
AU503695B2
AU503695B2 AU15255/76A AU1525576A AU503695B2 AU 503695 B2 AU503695 B2 AU 503695B2 AU 15255/76 A AU15255/76 A AU 15255/76A AU 1525576 A AU1525576 A AU 1525576A AU 503695 B2 AU503695 B2 AU 503695B2
Authority
AU
Australia
Prior art keywords
diphase
polymeric substrate
electroless deposition
electroless
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU15255/76A
Other versions
AU1525576A (en
Inventor
E. J Leech
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of AU1525576A publication Critical patent/AU1525576A/en
Application granted granted Critical
Publication of AU503695B2 publication Critical patent/AU503695B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L13/00—Compositions of rubbers containing carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
AU15255/76A 1975-07-25 1976-06-24 Diphase polymeric substrate for electroless deposition Expired AU503695B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59877075A 1975-07-25 1975-07-25
USUS598770 1975-07-25

Publications (2)

Publication Number Publication Date
AU1525576A AU1525576A (en) 1978-01-05
AU503695B2 true AU503695B2 (en) 1979-09-13

Family

ID=24396845

Family Applications (1)

Application Number Title Priority Date Filing Date
AU15255/76A Expired AU503695B2 (en) 1975-07-25 1976-06-24 Diphase polymeric substrate for electroless deposition

Country Status (13)

Country Link
JP (1) JPS5953295B2 (en)
AT (1) AT362008B (en)
AU (1) AU503695B2 (en)
CA (1) CA1077643A (en)
CH (1) CH636631A5 (en)
DE (1) DE2633094B2 (en)
FR (1) FR2333024A1 (en)
GB (1) GB1531826A (en)
IL (1) IL50093A (en)
IT (1) IT1066020B (en)
NL (1) NL185935C (en)
SE (1) SE7608413L (en)
ZA (1) ZA763010B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2809917B1 (en) * 1978-03-08 1979-07-26 Dynamit Nobel Ag Base material for producing printed circuits by additive processes and processes for producing the same
DE2828288C2 (en) * 1978-06-28 1982-04-15 Dynamit Nobel Ag, 5210 Troisdorf Process for the production of base material for printed circuits
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
CA1318416C (en) * 1987-01-14 1993-05-25 Kollmorgen Corporation Bonding compositions for the manufacture of additive printed wiring boards and articles made with the bonding composition
JPH02117948A (en) * 1988-08-30 1990-05-02 Japan Synthetic Rubber Co Ltd Modified epoxy composition
JP4722954B2 (en) * 2008-03-17 2011-07-13 イビデン株式会社 Adhesive for printed wiring board and method for producing adhesive layer for printed wiring board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1790293B2 (en) * 1966-02-22 1973-12-13 Photocircuits Corp., Glen Cove, N.Y. (V.St.A.) Process for the production of printed circuits excretion from 1665314
AT310285B (en) * 1966-02-22 1973-09-25 Photocircuits Corp Process for the production of a laminated body for printed circuits

Also Published As

Publication number Publication date
CA1077643A (en) 1980-05-13
NL7608242A (en) 1977-01-27
IL50093A0 (en) 1976-09-30
IL50093A (en) 1980-01-31
IT1066020B (en) 1985-03-04
DE2633094C3 (en) 1987-02-12
SE7608413L (en) 1977-01-26
JPS5215569A (en) 1977-02-05
DE2633094A1 (en) 1977-01-27
NL185935B (en) 1990-03-16
JPS5953295B2 (en) 1984-12-24
AU1525576A (en) 1978-01-05
FR2333024A1 (en) 1977-06-24
DE2633094B2 (en) 1979-08-30
GB1531826A (en) 1978-11-08
FR2333024B1 (en) 1979-05-25
AT362008B (en) 1981-04-27
ATA545376A (en) 1980-09-15
ZA763010B (en) 1977-04-27
CH636631A5 (en) 1983-06-15
NL185935C (en) 1990-08-16

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