FR2333024B1 - - Google Patents

Info

Publication number
FR2333024B1
FR2333024B1 FR7622745A FR7622745A FR2333024B1 FR 2333024 B1 FR2333024 B1 FR 2333024B1 FR 7622745 A FR7622745 A FR 7622745A FR 7622745 A FR7622745 A FR 7622745A FR 2333024 B1 FR2333024 B1 FR 2333024B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7622745A
Other languages
French (fr)
Other versions
FR2333024A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of FR2333024A1 publication Critical patent/FR2333024A1/fr
Application granted granted Critical
Publication of FR2333024B1 publication Critical patent/FR2333024B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L13/00—Compositions of rubbers containing carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
FR7622745A 1975-07-25 1976-07-26 Substrats polymeres pour le depot de metaux par voie chimique Granted FR2333024A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59877075A 1975-07-25 1975-07-25

Publications (2)

Publication Number Publication Date
FR2333024A1 FR2333024A1 (fr) 1977-06-24
FR2333024B1 true FR2333024B1 (nl) 1979-05-25

Family

ID=24396845

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7622745A Granted FR2333024A1 (fr) 1975-07-25 1976-07-26 Substrats polymeres pour le depot de metaux par voie chimique

Country Status (13)

Country Link
JP (1) JPS5953295B2 (nl)
AT (1) AT362008B (nl)
AU (1) AU503695B2 (nl)
CA (1) CA1077643A (nl)
CH (1) CH636631A5 (nl)
DE (1) DE2633094B2 (nl)
FR (1) FR2333024A1 (nl)
GB (1) GB1531826A (nl)
IL (1) IL50093A (nl)
IT (1) IT1066020B (nl)
NL (1) NL185935C (nl)
SE (1) SE7608413L (nl)
ZA (1) ZA763010B (nl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2809917B1 (de) * 1978-03-08 1979-07-26 Dynamit Nobel Ag Basismaterial zum Herstellen gedruckter Schaltungen nach Additivverfahren und Verfahren zum Herstellen desselben
DE2828288C2 (de) * 1978-06-28 1982-04-15 Dynamit Nobel Ag, 5210 Troisdorf Verfahren zur Herstellung von Basismaterial für gedruckte Schaltungen
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
CA1318416C (en) * 1987-01-14 1993-05-25 Kollmorgen Corporation Bonding compositions for the manufacture of additive printed wiring boards and articles made with the bonding composition
JPH02117948A (ja) * 1988-08-30 1990-05-02 Japan Synthetic Rubber Co Ltd 変性エポキシ組成物
JP4722954B2 (ja) * 2008-03-17 2011-07-13 イビデン株式会社 プリント配線板用接着剤および、プリント配線板用接着剤層の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT310285B (de) * 1966-02-22 1973-09-25 Photocircuits Corp Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen
DE1665314C2 (de) * 1966-02-22 1978-05-24 Kollmorgen Tech Corp Basismaterial zur Herstellung gedruckter Schaltungen

Also Published As

Publication number Publication date
IT1066020B (it) 1985-03-04
DE2633094A1 (de) 1977-01-27
ZA763010B (en) 1977-04-27
IL50093A0 (en) 1976-09-30
CH636631A5 (en) 1983-06-15
IL50093A (en) 1980-01-31
NL185935B (nl) 1990-03-16
DE2633094C3 (nl) 1987-02-12
AU503695B2 (en) 1979-09-13
NL185935C (nl) 1990-08-16
CA1077643A (en) 1980-05-13
DE2633094B2 (de) 1979-08-30
FR2333024A1 (fr) 1977-06-24
AT362008B (de) 1981-04-27
ATA545376A (de) 1980-09-15
AU1525576A (en) 1978-01-05
NL7608242A (nl) 1977-01-27
JPS5215569A (en) 1977-02-05
SE7608413L (sv) 1977-01-26
JPS5953295B2 (ja) 1984-12-24
GB1531826A (en) 1978-11-08

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse