CH629853A5 - Verfahren zum stromlosen metallisieren. - Google Patents
Verfahren zum stromlosen metallisieren. Download PDFInfo
- Publication number
- CH629853A5 CH629853A5 CH458677A CH458677A CH629853A5 CH 629853 A5 CH629853 A5 CH 629853A5 CH 458677 A CH458677 A CH 458677A CH 458677 A CH458677 A CH 458677A CH 629853 A5 CH629853 A5 CH 629853A5
- Authority
- CH
- Switzerland
- Prior art keywords
- copper
- ions
- solution
- source
- water
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 32
- 230000005611 electricity Effects 0.000 title 1
- -1 copper (I) ions Chemical class 0.000 claims description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 40
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 39
- 239000003054 catalyst Substances 0.000 claims description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- 229910052802 copper Inorganic materials 0.000 claims description 31
- 239000010949 copper Substances 0.000 claims description 31
- 239000003638 chemical reducing agent Substances 0.000 claims description 21
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims description 16
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims description 15
- 239000003960 organic solvent Substances 0.000 claims description 14
- 238000001465 metallisation Methods 0.000 claims description 13
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 12
- 229910052736 halogen Inorganic materials 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 150000003839 salts Chemical class 0.000 claims description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 claims description 5
- 230000001603 reducing effect Effects 0.000 claims description 5
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 3
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- 235000011150 stannous chloride Nutrition 0.000 claims description 3
- 235000002906 tartaric acid Nutrition 0.000 claims description 3
- 239000011975 tartaric acid Substances 0.000 claims description 3
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 claims description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 2
- 150000007513 acids Chemical class 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 239000011575 calcium Substances 0.000 claims description 2
- 238000006555 catalytic reaction Methods 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 claims 1
- 150000007522 mineralic acids Chemical class 0.000 claims 1
- 229910017604 nitric acid Inorganic materials 0.000 claims 1
- 150000007524 organic acids Chemical class 0.000 claims 1
- 229910052712 strontium Inorganic materials 0.000 claims 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims 1
- 239000000243 solution Substances 0.000 description 59
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 24
- 230000003197 catalytic effect Effects 0.000 description 15
- 239000010410 layer Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 8
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 8
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 8
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 7
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 229910000510 noble metal Inorganic materials 0.000 description 5
- 239000012279 sodium borohydride Substances 0.000 description 5
- 229910000033 sodium borohydride Inorganic materials 0.000 description 5
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000000454 electroless metal deposition Methods 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical class [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 101150084548 Cubn gene Proteins 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- 101150050048 SNCB gene Proteins 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical class B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- DKAGJZJALZXOOV-UHFFFAOYSA-N hydrate;hydrochloride Chemical compound O.Cl DKAGJZJALZXOOV-UHFFFAOYSA-N 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- IFSIGZHEDOYNJM-UHFFFAOYSA-N n,n-dimethylformamide;ethane-1,2-diol Chemical compound OCCO.CN(C)C=O IFSIGZHEDOYNJM-UHFFFAOYSA-N 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- ZMLDXWLZKKZVSS-UHFFFAOYSA-N palladium tin Chemical compound [Pd].[Sn] ZMLDXWLZKKZVSS-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- 229910001631 strontium chloride Inorganic materials 0.000 description 1
- AHBGXTDRMVNFER-UHFFFAOYSA-L strontium dichloride Chemical compound [Cl-].[Cl-].[Sr+2] AHBGXTDRMVNFER-UHFFFAOYSA-L 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US67652776A | 1976-04-13 | 1976-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH629853A5 true CH629853A5 (de) | 1982-05-14 |
Family
ID=24714893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH458677A CH629853A5 (de) | 1976-04-13 | 1977-04-13 | Verfahren zum stromlosen metallisieren. |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US4160050A (en, 2012) |
| JP (1) | JPS52134825A (en, 2012) |
| AT (1) | AT351334B (en, 2012) |
| AU (1) | AU505928B2 (en, 2012) |
| CA (1) | CA1093540A (en, 2012) |
| CH (1) | CH629853A5 (en, 2012) |
| DE (1) | DE2716729C3 (en, 2012) |
| DK (1) | DK147377C (en, 2012) |
| FR (1) | FR2348279A1 (en, 2012) |
| GB (1) | GB1523426A (en, 2012) |
| IL (1) | IL51786A (en, 2012) |
| IT (1) | IT1115853B (en, 2012) |
| NL (1) | NL7704031A (en, 2012) |
| SE (1) | SE7704185L (en, 2012) |
| ZA (1) | ZA77897B (en, 2012) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4327125A (en) * | 1974-10-04 | 1982-04-27 | Nathan Feldstein | Colloidal compositions for electroless deposition comprising colloidal copper-stannic oxide product |
| US4239538A (en) * | 1976-03-30 | 1980-12-16 | Surface Technology, Inc. | Catalytic primer |
| US4259376A (en) * | 1977-09-16 | 1981-03-31 | Nathan Feldstein | Catalytic promoters in electroless plating catalysts applied as an emulsion |
| US4233344A (en) * | 1978-07-20 | 1980-11-11 | Learonal, Inc. | Method of improving the adhesion of electroless metal deposits employing colloidal copper activator |
| SU921124A1 (ru) * | 1979-06-19 | 1982-04-15 | Институт Физико-Химических Основ Переработки Минерального Сырья Со Ан Ссср | Способ металлизации отверстий печатных плат |
| US4574094A (en) * | 1983-06-09 | 1986-03-04 | Kollmorgen Technologies Corporation | Metallization of ceramics |
| US4604299A (en) * | 1983-06-09 | 1986-08-05 | Kollmorgen Technologies Corporation | Metallization of ceramics |
| DE3574270D1 (en) * | 1984-06-29 | 1989-12-21 | Hitachi Chemical Co Ltd | Sensitizing agent for electroless plating and method for sensitizing substrate with the agent |
| EP0309243B1 (en) * | 1987-09-25 | 1993-08-18 | Engelhard Technologies Limited | Pre-etch treatment of a plastics substrate |
| US4775557A (en) * | 1987-11-09 | 1988-10-04 | Enthone, Incorporated | Composition and process for conditioning the surface of polycarbonate resins prior to metal plating |
| JPH01136056U (en, 2012) * | 1987-11-26 | 1989-09-18 | ||
| JPH01104850U (en, 2012) * | 1987-12-29 | 1989-07-14 | ||
| US5108786A (en) * | 1989-05-01 | 1992-04-28 | Enthone-Omi, Inc. | Method of making printed circuit boards |
| FR2646583B1 (fr) * | 1989-05-01 | 1992-01-24 | Enthone Corp | Procede pour fabriquer des plaquettes a circuits imprimes |
| JP2002309376A (ja) * | 2001-04-10 | 2002-10-23 | Okuno Chem Ind Co Ltd | 無電解銅めっき用触媒付与方法 |
| US8172627B2 (en) * | 2008-12-03 | 2012-05-08 | Tyco Electronics Corporation | Electrical connector with plated plug and receptacle |
| JP5570285B2 (ja) * | 2010-04-19 | 2014-08-13 | 株式会社日本表面処理研究所 | 無電解めっき法で用いる触媒水溶液、その触媒水溶液の調製方法及びその触媒水溶液を用いた無電解めっき法並びにその無電解めっき法を用いて形成した金属皮膜を備える金属層付被めっき物 |
| JP6171189B2 (ja) * | 2012-02-02 | 2017-08-02 | ナノ−ヌーヴェル プロプライエタリー リミテッドＮａｎｏ−Ｎｏｕｖｅｌｌｅ Ｐｔｙ Ｌｔｄ． | 材料上の薄いコーティング |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
| US3347724A (en) * | 1964-08-19 | 1967-10-17 | Photocircuits Corp | Metallizing flexible substrata |
| AT310285B (de) * | 1966-02-22 | 1973-09-25 | Photocircuits Corp | Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen |
| US3425946A (en) * | 1966-08-26 | 1969-02-04 | William M Emons Jr | Electroless plating composition |
| US3524754A (en) * | 1967-04-28 | 1970-08-18 | Shell Oil Co | Metal plating of plastics |
| US3672938A (en) * | 1969-02-20 | 1972-06-27 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
| US3682671A (en) * | 1970-02-05 | 1972-08-08 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
| US3672923A (en) * | 1970-06-29 | 1972-06-27 | Kollmorgen Corp | Solid precious metal sensitizing compositions |
| US3772078A (en) * | 1971-07-29 | 1973-11-13 | Kollmorgen Photocircuits | Process for the formation of real images and products produced thereby |
| US3772056A (en) * | 1971-07-29 | 1973-11-13 | Kollmorgen Photocircuits | Sensitized substrates for chemical metallization |
| CA1000453A (en) * | 1972-07-11 | 1976-11-30 | Francis J. Nuzzi | Process and composition for sensitizing articles for metallization |
| CA1058457A (en) * | 1973-10-18 | 1979-07-17 | Francis J. Nuzzi | Process for sensitizing surface of nonmetallic article for electroless deposition |
| JPS50113423A (en, 2012) * | 1973-12-07 | 1975-09-05 | Surface Technology Corp | |
| US3993491A (en) * | 1973-12-07 | 1976-11-23 | Surface Technology, Inc. | Electroless plating |
| ZA75565B (en) * | 1974-10-31 | 1976-01-28 | Kollmorgen Corp | Process for sensitizing articles for metallization and resulting articles |
-
1977
- 1977-02-15 ZA ZA770897A patent/ZA77897B/xx unknown
- 1977-02-18 US US05/770,063 patent/US4160050A/en not_active Expired - Lifetime
- 1977-03-29 CA CA275,033A patent/CA1093540A/en not_active Expired
- 1977-03-30 IL IL51786A patent/IL51786A/xx unknown
- 1977-03-30 AU AU23783/77A patent/AU505928B2/en not_active Expired
- 1977-04-07 GB GB14750/77A patent/GB1523426A/en not_active Expired
- 1977-04-12 SE SE7704185A patent/SE7704185L/ unknown
- 1977-04-12 AT AT253977A patent/AT351334B/de not_active IP Right Cessation
- 1977-04-12 DK DK161777A patent/DK147377C/da not_active IP Right Cessation
- 1977-04-13 JP JP4311077A patent/JPS52134825A/ja active Granted
- 1977-04-13 FR FR7711045A patent/FR2348279A1/fr active Granted
- 1977-04-13 IT IT48937/77A patent/IT1115853B/it active
- 1977-04-13 DE DE2716729A patent/DE2716729C3/de not_active Expired
- 1977-04-13 NL NL7704031A patent/NL7704031A/xx not_active Application Discontinuation
- 1977-04-13 CH CH458677A patent/CH629853A5/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| IT1115853B (it) | 1986-02-10 |
| US4160050A (en) | 1979-07-03 |
| NL7704031A (nl) | 1977-10-17 |
| FR2348279A1 (fr) | 1977-11-10 |
| AT351334B (de) | 1979-07-25 |
| DK147377B (da) | 1984-07-09 |
| AU2378377A (en) | 1978-10-05 |
| CA1093540A (en) | 1981-01-13 |
| ATA253977A (de) | 1978-12-15 |
| DK147377C (da) | 1985-01-28 |
| IL51786A0 (en) | 1977-05-31 |
| DE2716729A1 (de) | 1977-10-20 |
| JPS5710950B2 (en, 2012) | 1982-03-01 |
| GB1523426A (en) | 1978-08-31 |
| DK161777A (da) | 1977-10-14 |
| SE7704185L (sv) | 1977-10-14 |
| AU505928B2 (en) | 1979-12-06 |
| IL51786A (en) | 1981-10-30 |
| FR2348279B1 (en, 2012) | 1978-11-03 |
| JPS52134825A (en) | 1977-11-11 |
| DE2716729C3 (de) | 1979-10-25 |
| DE2716729B2 (de) | 1979-03-08 |
| ZA77897B (en) | 1977-12-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased | ||
| PL | Patent ceased |