CH625096A5 - - Google Patents
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- Publication number
- CH625096A5 CH625096A5 CH309278A CH309278A CH625096A5 CH 625096 A5 CH625096 A5 CH 625096A5 CH 309278 A CH309278 A CH 309278A CH 309278 A CH309278 A CH 309278A CH 625096 A5 CH625096 A5 CH 625096A5
- Authority
- CH
- Switzerland
- Prior art keywords
- layer
- copper
- conductor tracks
- etching
- solution
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 21
- 229910052802 copper Inorganic materials 0.000 claims 21
- 239000010949 copper Substances 0.000 claims 21
- 238000000034 method Methods 0.000 claims 14
- 239000004020 conductor Substances 0.000 claims 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims 12
- 238000005530 etching Methods 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 4
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims 4
- 229960002218 sodium chlorite Drugs 0.000 claims 4
- 235000011121 sodium hydroxide Nutrition 0.000 claims 4
- 239000001488 sodium phosphate Substances 0.000 claims 4
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 3
- 230000008021 deposition Effects 0.000 claims 3
- 229910000406 trisodium phosphate Inorganic materials 0.000 claims 3
- 235000019801 trisodium phosphate Nutrition 0.000 claims 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 2
- 238000010276 construction Methods 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 1
- 229910000978 Pb alloy Inorganic materials 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 239000002318 adhesion promoter Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000012876 carrier material Substances 0.000 claims 1
- 230000007547 defect Effects 0.000 claims 1
- 239000012153 distilled water Substances 0.000 claims 1
- 238000000454 electroless metal deposition Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000001465 metallisation Methods 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000007639 printing Methods 0.000 claims 1
- 239000011241 protective layer Substances 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 229910000162 sodium phosphate Inorganic materials 0.000 claims 1
- 235000011008 sodium phosphates Nutrition 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- -1 tin/lead alloys Chemical class 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Chemical Treatment Of Metals (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2713393A DE2713393C3 (de) | 1977-03-23 | 1977-03-23 | Verfahren zum Herstellen von gedruckten Schaltungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH625096A5 true CH625096A5 (sv) | 1981-08-31 |
Family
ID=6004744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH309278A CH625096A5 (sv) | 1977-03-23 | 1978-03-21 |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US4144118A (sv) |
| JP (1) | JPS53147266A (sv) |
| AT (1) | AT367945B (sv) |
| AU (1) | AU516218B2 (sv) |
| BE (1) | BE865219A (sv) |
| CA (1) | CA1085059A (sv) |
| CH (1) | CH625096A5 (sv) |
| DE (1) | DE2713393C3 (sv) |
| DK (1) | DK147220C (sv) |
| FR (1) | FR2385295A1 (sv) |
| GB (1) | GB1568941A (sv) |
| NL (1) | NL180372C (sv) |
| SE (1) | SE428987B (sv) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4388351A (en) * | 1979-08-20 | 1983-06-14 | Western Electric Company, Inc. | Methods of forming a patterned metal film on a support |
| DE3021896A1 (de) * | 1980-06-06 | 1982-03-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zur herstellung von gedruckten schaltungen |
| US4368281A (en) * | 1980-09-15 | 1983-01-11 | Amp Incorporated | Printed circuits |
| US4358479A (en) * | 1980-12-01 | 1982-11-09 | International Business Machines Corporation | Treatment of copper and use thereof |
| US4496419A (en) * | 1983-02-28 | 1985-01-29 | Cornell Research Foundation, Inc. | Fine line patterning method for submicron devices |
| US4717439A (en) * | 1985-10-24 | 1988-01-05 | Enthone, Incorporated | Process for the treatment of copper oxide in the preparation of printed circuit boards |
| ZA873845B (en) * | 1986-06-18 | 1987-11-24 | Macdermid, Incorporated | Method for manufacture of printed circuit boards |
| US4806200A (en) * | 1986-06-18 | 1989-02-21 | Macdermid, Incorporated | Method for manufacture of printed circuit boards |
| US4732649A (en) * | 1986-06-18 | 1988-03-22 | Macdermid, Incorporated | Method for manufacture of printed circuit boards |
| US5035918A (en) * | 1989-04-26 | 1991-07-30 | Amp Incorporated | Non-flammable and strippable plating resist and method of using same |
| US5106454A (en) * | 1990-11-01 | 1992-04-21 | Shipley Company Inc. | Process for multilayer printed circuit board manufacture |
| US5288377A (en) * | 1991-06-05 | 1994-02-22 | Macdermid, Incorporated | Process for the manufacture of printed circuits using electrophoretically deposited organic resists |
| US5242562A (en) * | 1992-05-27 | 1993-09-07 | Gould Inc. | Method and apparatus for forming printed circuits |
| US5721007A (en) * | 1994-09-08 | 1998-02-24 | The Whitaker Corporation | Process for low density additive flexible circuits and harnesses |
| US6544584B1 (en) * | 1997-03-07 | 2003-04-08 | International Business Machines Corporation | Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate |
| US6162365A (en) * | 1998-03-04 | 2000-12-19 | International Business Machines Corporation | Pd etch mask for copper circuitization |
| US20090102881A1 (en) * | 2007-10-17 | 2009-04-23 | Mvm Technologies, Inc. | Surface Metallization Of Metal Oxide Pre-Ceramic |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3296099A (en) * | 1966-05-16 | 1967-01-03 | Western Electric Co | Method of making printed circuits |
| US3481777A (en) * | 1967-02-17 | 1969-12-02 | Ibm | Electroless coating method for making printed circuits |
| US3764399A (en) * | 1970-07-30 | 1973-10-09 | Olin Corp | Method of producing tarnish resistant copper and copper alloys |
| US3745094A (en) * | 1971-03-26 | 1973-07-10 | Ibm | Two resist method for printed circuit structure |
| JPS491137A (sv) * | 1972-04-18 | 1974-01-08 | ||
| SE404863B (sv) * | 1975-12-17 | 1978-10-30 | Perstorp Ab | Forfarande vid framstellning av ett flerlagerkort |
-
1977
- 1977-03-23 DE DE2713393A patent/DE2713393C3/de not_active Expired
-
1978
- 1978-03-13 US US05/885,648 patent/US4144118A/en not_active Expired - Lifetime
- 1978-03-17 CA CA299,133A patent/CA1085059A/en not_active Expired
- 1978-03-20 SE SE7803187A patent/SE428987B/sv not_active IP Right Cessation
- 1978-03-20 GB GB10852/78A patent/GB1568941A/en not_active Expired
- 1978-03-21 CH CH309278A patent/CH625096A5/de not_active IP Right Cessation
- 1978-03-22 AT AT0205178A patent/AT367945B/de not_active IP Right Cessation
- 1978-03-22 NL NLAANVRAGE7803107,A patent/NL180372C/xx not_active IP Right Cessation
- 1978-03-22 DK DK130978A patent/DK147220C/da not_active IP Right Cessation
- 1978-03-23 BE BE2056787A patent/BE865219A/xx not_active IP Right Cessation
- 1978-03-23 FR FR7808489A patent/FR2385295A1/fr active Granted
- 1978-03-23 JP JP3401578A patent/JPS53147266A/ja active Granted
- 1978-04-03 AU AU34699/78A patent/AU516218B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2713393A1 (de) | 1978-10-05 |
| AU516218B2 (en) | 1981-05-21 |
| NL180372C (nl) | 1987-02-02 |
| NL7803107A (nl) | 1978-09-26 |
| GB1568941A (en) | 1980-06-11 |
| BE865219A (nl) | 1978-09-25 |
| JPS5625791B2 (sv) | 1981-06-15 |
| DE2713393C3 (de) | 1980-02-28 |
| FR2385295A1 (fr) | 1978-10-20 |
| AU3469978A (en) | 1979-10-11 |
| NL180372B (nl) | 1986-09-01 |
| DK147220C (da) | 1984-11-12 |
| SE7803187L (sv) | 1978-09-24 |
| JPS53147266A (en) | 1978-12-21 |
| SE428987B (sv) | 1983-08-01 |
| ATA205178A (de) | 1981-12-15 |
| DK130978A (da) | 1978-09-24 |
| DK147220B (da) | 1984-05-14 |
| CA1085059A (en) | 1980-09-02 |
| DE2713393B2 (de) | 1979-06-21 |
| FR2385295B1 (sv) | 1980-10-17 |
| US4144118A (en) | 1979-03-13 |
| AT367945B (de) | 1982-08-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUE | Assignment |
Owner name: KOLLMORGEN CORPORATION |
|
| PL | Patent ceased |