CH229963A - Verfahren zum Anschluss eines elektrischen Zuführungsleiters an einen Teil eines elektrischen Gerätes, insbesondere eines Sperrschichtgleichrichters. - Google Patents

Verfahren zum Anschluss eines elektrischen Zuführungsleiters an einen Teil eines elektrischen Gerätes, insbesondere eines Sperrschichtgleichrichters.

Info

Publication number
CH229963A
CH229963A CH229963DA CH229963A CH 229963 A CH229963 A CH 229963A CH 229963D A CH229963D A CH 229963DA CH 229963 A CH229963 A CH 229963A
Authority
CH
Switzerland
Prior art keywords
electrical
supply conductor
barrier rectifier
contact
wire
Prior art date
Application number
Other languages
German (de)
English (en)
Inventor
Gloeilampenfabrieken N Philips
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH229963A publication Critical patent/CH229963A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/01—Manufacture or treatment
    • H10D48/04—Manufacture or treatment of devices having bodies comprising selenium or tellurium in uncombined form
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CH229963D 1942-03-27 1942-03-27 Verfahren zum Anschluss eines elektrischen Zuführungsleiters an einen Teil eines elektrischen Gerätes, insbesondere eines Sperrschichtgleichrichters. CH229963A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH229963T 1942-03-27

Publications (1)

Publication Number Publication Date
CH229963A true CH229963A (de) 1943-11-30

Family

ID=4456370

Family Applications (1)

Application Number Title Priority Date Filing Date
CH229963D CH229963A (de) 1942-03-27 1942-03-27 Verfahren zum Anschluss eines elektrischen Zuführungsleiters an einen Teil eines elektrischen Gerätes, insbesondere eines Sperrschichtgleichrichters.

Country Status (2)

Country Link
CH (1) CH229963A (enrdf_load_stackoverflow)
NL (1) NL55489C (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1060055B (de) * 1957-11-15 1959-06-25 Siemens Ag Verfahren zur Herstellung der elektrischen Anschluesse von Halbleiteranordnungen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1060055B (de) * 1957-11-15 1959-06-25 Siemens Ag Verfahren zur Herstellung der elektrischen Anschluesse von Halbleiteranordnungen

Also Published As

Publication number Publication date
NL55489C (enrdf_load_stackoverflow) 1900-01-01

Similar Documents

Publication Publication Date Title
DE1138869B (de) Verfahren zur Herstellung einer Halbleiteranordnung
DE1050449B (enrdf_load_stackoverflow)
DE3141842C2 (enrdf_load_stackoverflow)
CH229963A (de) Verfahren zum Anschluss eines elektrischen Zuführungsleiters an einen Teil eines elektrischen Gerätes, insbesondere eines Sperrschichtgleichrichters.
DE1565421A1 (de) Verfahren und Einrichtung zum Lichtbogenschweissen
DE2256823C3 (de) Zündkerze
DE907316C (de) Verfahren zum Anschweissen eines elektrischen Zufuehrungsleiters an eine Metallflaeche, insbesondere an die Tragplatte eines Sperrschichtgleichrichters
DE715946C (de) Zuendeinrichtung fuer Vakuumentladungsgefaesse mit fluessiger Kathode
DE691990C (de) Elektrische Punktschweissvorrichtung
DE1565536A1 (de) Verfahren zum Aufschweissen von Bolzen
DE911046C (de) Verfahren zur Herstellung elektrischer Kondensatoren mit eingelegten Metallstreifen zur elektrischen Zufuehrung zu den Metallbelaegen
DE930825C (de) Hochfrequenz-Schweisseinrichtung mit in der Naehe der Elektroden angeordneter, von dem gleichen Druckteil wie diese betaetigter Schneidvorrichtung
DE657128C (de) Schweissduese fuer das elektrische Lichtbogenschweissen mit umhuellten Elektroden
DE2254425A1 (de) Elektrostauchmaschine mit ohm'scher widerstandserwaermung des werkstueckes
DE830231C (de) Elektrode fuer Widerstandsschweissmaschine
DE735711C (de) Widerstandsschweissmaschine fuer Stumpfschweissung, insbesondere fuer die Herstellung von Rohren grosser Wandstaerke
DE664132C (de) Vorrichtung zum Schmelzschweissen fuer zahnaerztliche und zahntechnische Zwecke
DE1902124U (de) Stromzufuehrende kontaktduese fuer automatische und halbautomatische schweissgeraet.
DE761478C (de) Verfahren zum Verschweissen von Koerpern verschiedener Waermekapazitaet oder Schmelztemperaturen mit Hilfe eines Schweissgriffels
DE943267C (de) Elektro-Metallspritzpistole
DE760337C (de) Verfahren zum Anschliessen der einzelnen Draehte eines elektrischen Kabels an Kontaktplatten
DE1565158A1 (de) Vorrichtung zum Verschweissen von Werkstuecken
DE904332C (de) Verfahren zur Herstellung von zur Oberflaechenvergroesserung dicht mit stabfoermigen Elementen versehenen Koerpern, wie Waermeaustauschern u. dgl.
DE1639311C2 (de) Verfahren zum Kontaktieren einer Halbleiteranordnung
DE1067529B (de) Verfahren zur Herstellung einer Halbleitervorrichtung des Flaechentyps