CA2957587C - Copper-tin alloy plating bath - Google Patents

Copper-tin alloy plating bath Download PDF

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Publication number
CA2957587C
CA2957587C CA2957587A CA2957587A CA2957587C CA 2957587 C CA2957587 C CA 2957587C CA 2957587 A CA2957587 A CA 2957587A CA 2957587 A CA2957587 A CA 2957587A CA 2957587 C CA2957587 C CA 2957587C
Authority
CA
Canada
Prior art keywords
copper
compound
tin alloy
amount
alloy plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2957587A
Other languages
English (en)
French (fr)
Other versions
CA2957587A1 (en
Inventor
Takamitsu TSUJIMOTO
Toshimitsu Nagao
Kenji Hara
Junichi Katayama
Kuniaki Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okuno Chemical Industries Co Ltd
Original Assignee
Okuno Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okuno Chemical Industries Co Ltd filed Critical Okuno Chemical Industries Co Ltd
Publication of CA2957587A1 publication Critical patent/CA2957587A1/en
Application granted granted Critical
Publication of CA2957587C publication Critical patent/CA2957587C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CA2957587A 2014-08-08 2015-07-28 Copper-tin alloy plating bath Active CA2957587C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014162294 2014-08-08
JP2014-162294 2014-08-08
PCT/JP2015/071330 WO2016021439A1 (ja) 2014-08-08 2015-07-28 銅－スズ合金めっき浴

Publications (2)

Publication Number Publication Date
CA2957587A1 CA2957587A1 (en) 2016-02-11
CA2957587C true CA2957587C (en) 2019-03-05

Family

ID=55263710

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2957587A Active CA2957587C (en) 2014-08-08 2015-07-28 Copper-tin alloy plating bath

Country Status (8)

Country Link
US (1) US20170204528A1 (ja)
EP (1) EP3178969B1 (ja)
JP (1) JP6048712B2 (ja)
CN (1) CN106661752B (ja)
CA (1) CA2957587C (ja)
HK (1) HK1232261A1 (ja)
TW (1) TWI641729B (ja)
WO (1) WO2016021439A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019052355A (ja) * 2017-09-15 2019-04-04 上村工業株式会社 電解Ｓｎ又はＳｎ合金めっき液及びＳｎ又はＳｎ合金めっき物の製造方法
JP6645609B2 (ja) * 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
CN110205659B (zh) * 2019-07-17 2020-06-16 广州三孚新材料科技股份有限公司 一种电镀锡添加剂及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3871013B2 (ja) * 1998-11-05 2007-01-24 上村工業株式会社 錫−銅合金電気めっき浴及びそれを使用するめっき方法
US7179362B2 (en) * 2000-09-20 2007-02-20 Dr.-Ing. Max Schlotter Gmbh & Co.Kg Electrolyte and method for depositing tin-copper alloy layers
ES2531163T3 (es) * 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
JP5419021B2 (ja) * 2008-11-11 2014-02-19 ユケン工業株式会社 ジンケート型亜鉛めっき浴
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
JP5313773B2 (ja) * 2009-06-04 2013-10-09 三菱伸銅株式会社 めっき付き銅条材及びその製造方法
JP6133056B2 (ja) * 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 スズまたはスズ合金めっき液

Also Published As

Publication number Publication date
WO2016021439A1 (ja) 2016-02-11
CN106661752B (zh) 2021-08-10
CA2957587A1 (en) 2016-02-11
EP3178969A1 (en) 2017-06-14
TWI641729B (zh) 2018-11-21
JP6048712B2 (ja) 2016-12-21
EP3178969B1 (en) 2020-01-01
US20170204528A1 (en) 2017-07-20
HK1232261A1 (zh) 2018-01-05
TW201612362A (en) 2016-04-01
EP3178969A4 (en) 2017-12-27
JPWO2016021439A1 (ja) 2017-04-27
CN106661752A (zh) 2017-05-10

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Effective date: 20170207