CA2622750C - N-polar aluminum gallium nitride/gallium nitride enhancement-mode field effect transistor - Google Patents
N-polar aluminum gallium nitride/gallium nitride enhancement-mode field effect transistor Download PDFInfo
- Publication number
- CA2622750C CA2622750C CA2622750A CA2622750A CA2622750C CA 2622750 C CA2622750 C CA 2622750C CA 2622750 A CA2622750 A CA 2622750A CA 2622750 A CA2622750 A CA 2622750A CA 2622750 C CA2622750 C CA 2622750C
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- layer
- algan
- gan
- algan layer
- gate
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
- H10D62/405—Orientations of crystalline planes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/472—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having lower bandgap active layer formed on top of wider bandgap layer, e.g. inverted HEMT
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/473—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT
- H10D30/4732—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT using Group III-V semiconductor material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/473—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT
- H10D30/4732—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT using Group III-V semiconductor material
- H10D30/4735—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT using Group III-V semiconductor material having delta-doped or planar-doped donor layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/602—Heterojunction gate electrodes for FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
Landscapes
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US71799605P | 2005-09-16 | 2005-09-16 | |
| US60/717,996 | 2005-09-16 | ||
| PCT/US2006/036377 WO2007136401A2 (en) | 2005-09-16 | 2006-09-18 | N-polar aluminum gallium nitride/gallium nitride enhancement-mode field effect transistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2622750A1 CA2622750A1 (en) | 2007-11-29 |
| CA2622750C true CA2622750C (en) | 2015-11-03 |
Family
ID=38723730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2622750A Active CA2622750C (en) | 2005-09-16 | 2006-09-18 | N-polar aluminum gallium nitride/gallium nitride enhancement-mode field effect transistor |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7948011B2 (enExample) |
| EP (1) | EP1932181A4 (enExample) |
| JP (1) | JP2009509343A (enExample) |
| CA (1) | CA2622750C (enExample) |
| WO (1) | WO2007136401A2 (enExample) |
Families Citing this family (79)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4751150B2 (ja) * | 2005-08-31 | 2011-08-17 | 株式会社東芝 | 窒化物系半導体装置 |
| US7915643B2 (en) | 2007-09-17 | 2011-03-29 | Transphorm Inc. | Enhancement mode gallium nitride power devices |
| US20090072269A1 (en) * | 2007-09-17 | 2009-03-19 | Chang Soo Suh | Gallium nitride diodes and integrated components |
| CN101971308B (zh) * | 2008-03-12 | 2012-12-12 | 日本电气株式会社 | 半导体器件 |
| US8497527B2 (en) * | 2008-03-12 | 2013-07-30 | Sensor Electronic Technology, Inc. | Device having active region with lower electron concentration |
| US8519438B2 (en) | 2008-04-23 | 2013-08-27 | Transphorm Inc. | Enhancement mode III-N HEMTs |
| US8343824B2 (en) * | 2008-04-29 | 2013-01-01 | International Rectifier Corporation | Gallium nitride material processing and related device structures |
| CN101604704B (zh) * | 2008-06-13 | 2012-09-05 | 西安能讯微电子有限公司 | Hemt器件及其制造方法 |
| US8309987B2 (en) * | 2008-07-15 | 2012-11-13 | Imec | Enhancement mode semiconductor device |
| US8289065B2 (en) | 2008-09-23 | 2012-10-16 | Transphorm Inc. | Inductive load power switching circuits |
| JP5684574B2 (ja) * | 2008-12-04 | 2015-03-11 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US7898004B2 (en) | 2008-12-10 | 2011-03-01 | Transphorm Inc. | Semiconductor heterostructure diodes |
| US8823012B2 (en) * | 2009-04-08 | 2014-09-02 | Efficient Power Conversion Corporation | Enhancement mode GaN HEMT device with gate spacer and method for fabricating the same |
| US8742459B2 (en) * | 2009-05-14 | 2014-06-03 | Transphorm Inc. | High voltage III-nitride semiconductor devices |
| JP5587564B2 (ja) * | 2009-06-19 | 2014-09-10 | ルネサスエレクトロニクス株式会社 | 電界効果トランジスタおよび電界効果トランジスタの製造方法 |
| US8390000B2 (en) | 2009-08-28 | 2013-03-05 | Transphorm Inc. | Semiconductor devices with field plates |
| JP5625336B2 (ja) * | 2009-11-30 | 2014-11-19 | サンケン電気株式会社 | 半導体装置 |
| US8389977B2 (en) | 2009-12-10 | 2013-03-05 | Transphorm Inc. | Reverse side engineered III-nitride devices |
| KR101774933B1 (ko) * | 2010-03-02 | 2017-09-06 | 삼성전자 주식회사 | 듀얼 디플리션을 나타내는 고 전자 이동도 트랜지스터 및 그 제조방법 |
| KR20120027988A (ko) | 2010-09-14 | 2012-03-22 | 삼성엘이디 주식회사 | 질화갈륨계 반도체소자 및 그 제조방법 |
| JP5742159B2 (ja) * | 2010-10-05 | 2015-07-01 | サンケン電気株式会社 | 半導体装置 |
| KR101720589B1 (ko) * | 2010-10-11 | 2017-03-30 | 삼성전자주식회사 | 이 모드(E-mode) 고 전자 이동도 트랜지스터 및 그 제조방법 |
| KR102065115B1 (ko) * | 2010-11-05 | 2020-01-13 | 삼성전자주식회사 | E-모드를 갖는 고 전자 이동도 트랜지스터 및 그 제조방법 |
| US8742460B2 (en) | 2010-12-15 | 2014-06-03 | Transphorm Inc. | Transistors with isolation regions |
| JP2012156332A (ja) * | 2011-01-26 | 2012-08-16 | Toshiba Corp | 半導体素子 |
| US8643062B2 (en) | 2011-02-02 | 2014-02-04 | Transphorm Inc. | III-N device structures and methods |
| US8772842B2 (en) | 2011-03-04 | 2014-07-08 | Transphorm, Inc. | Semiconductor diodes with low reverse bias currents |
| US8716141B2 (en) | 2011-03-04 | 2014-05-06 | Transphorm Inc. | Electrode configurations for semiconductor devices |
| KR101205872B1 (ko) | 2011-05-09 | 2012-11-28 | 삼성전자주식회사 | 질화갈륨계 반도체 소자 및 그 제조 방법 |
| US8710511B2 (en) * | 2011-07-29 | 2014-04-29 | Northrop Grumman Systems Corporation | AIN buffer N-polar GaN HEMT profile |
| US8674372B2 (en) * | 2011-08-19 | 2014-03-18 | Infineon Technologies Austria Ag | HEMT with integrated low forward bias diode |
| US8901604B2 (en) | 2011-09-06 | 2014-12-02 | Transphorm Inc. | Semiconductor devices with guard rings |
| US9257547B2 (en) | 2011-09-13 | 2016-02-09 | Transphorm Inc. | III-N device structures having a non-insulating substrate |
| JP6017125B2 (ja) * | 2011-09-16 | 2016-10-26 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
| US8598937B2 (en) | 2011-10-07 | 2013-12-03 | Transphorm Inc. | High power semiconductor electronic components with increased reliability |
| US9543391B2 (en) * | 2011-10-19 | 2017-01-10 | Samsung Electronics Co., Ltd. | High electron mobility transistor having reduced threshold voltage variation and method of manufacturing the same |
| KR101955337B1 (ko) * | 2011-10-19 | 2019-03-07 | 삼성전자주식회사 | 문턱전압 변동을 줄인 고 전자 이동도 트랜지스터 및 그 제조방법 |
| US8723226B2 (en) * | 2011-11-22 | 2014-05-13 | Texas Instruments Incorporated | Manufacturable enhancement-mode group III-N HEMT with a reverse polarization cap |
| US8624667B2 (en) | 2011-12-05 | 2014-01-07 | Mitsubishi Electric Research Laboratories, Inc. | High electron mobility transistors with multiple channels |
| US9165766B2 (en) | 2012-02-03 | 2015-10-20 | Transphorm Inc. | Buffer layer structures suited for III-nitride devices with foreign substrates |
| KR20130097116A (ko) * | 2012-02-23 | 2013-09-02 | 이피션트 파워 컨버젼 코퍼레이션 | 게이트 스페이서를 포함하는 증가형 갈륨 나이트라이드 고전자이동 트랜지스터 소자 및 이를 제조하는 방법 |
| JP6054620B2 (ja) * | 2012-03-29 | 2016-12-27 | トランスフォーム・ジャパン株式会社 | 化合物半導体装置及びその製造方法 |
| WO2013155108A1 (en) | 2012-04-09 | 2013-10-17 | Transphorm Inc. | N-polar iii-nitride transistors |
| US8878249B2 (en) | 2012-04-12 | 2014-11-04 | The Regents Of The University Of California | Method for heteroepitaxial growth of high channel conductivity and high breakdown voltage nitrogen polar high electron mobility transistors |
| US9184275B2 (en) | 2012-06-27 | 2015-11-10 | Transphorm Inc. | Semiconductor devices with integrated hole collectors |
| US8803246B2 (en) | 2012-07-16 | 2014-08-12 | Transphorm Inc. | Semiconductor electronic components with integrated current limiters |
| US20140021934A1 (en) * | 2012-07-17 | 2014-01-23 | Transphorm, Inc. | Devices and components for power conversion circuits |
| JP6064483B2 (ja) * | 2012-09-21 | 2017-01-25 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
| JP6087552B2 (ja) * | 2012-09-21 | 2017-03-01 | トランスフォーム・ジャパン株式会社 | 化合物半導体装置及びその製造方法 |
| US9048174B2 (en) * | 2013-01-18 | 2015-06-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Compound semiconductor device having gallium nitride gate structures |
| US9171730B2 (en) | 2013-02-15 | 2015-10-27 | Transphorm Inc. | Electrodes for semiconductor devices and methods of forming the same |
| US8796082B1 (en) * | 2013-02-22 | 2014-08-05 | The United States Of America As Represented By The Scretary Of The Army | Method of optimizing a GA—nitride device material structure for a frequency multiplication device |
| US9087718B2 (en) | 2013-03-13 | 2015-07-21 | Transphorm Inc. | Enhancement-mode III-nitride devices |
| US9245993B2 (en) | 2013-03-15 | 2016-01-26 | Transphorm Inc. | Carbon doping semiconductor devices |
| US9138455B2 (en) * | 2013-03-15 | 2015-09-22 | Mead Johnson Nutrition Company | Activating adiponectin by casein hydrolysate |
| WO2015009249A1 (en) | 2013-07-17 | 2015-01-22 | Elektrotechnicky Ustav Sav | Enhancement-mode iii-n transistor with n-polarity and method of fabricating the same |
| US9443938B2 (en) | 2013-07-19 | 2016-09-13 | Transphorm Inc. | III-nitride transistor including a p-type depleting layer |
| WO2015156875A2 (en) * | 2014-01-15 | 2015-10-15 | The Regents Of The University Of California | Metalorganic chemical vapor deposition of oxide dielectrics on n-polar iii-nitride semiconductors with high interface quality and tunable fixed interface charge |
| WO2015176002A1 (en) * | 2014-05-15 | 2015-11-19 | The Regents Of The University Of California | Doping in iii-nitride devices |
| US9893174B2 (en) | 2014-05-21 | 2018-02-13 | Arizona Board Of Regents On Behalf Of Arizona State University | III-nitride based N polar vertical tunnel transistor |
| US9318593B2 (en) | 2014-07-21 | 2016-04-19 | Transphorm Inc. | Forming enhancement mode III-nitride devices |
| US9536966B2 (en) | 2014-12-16 | 2017-01-03 | Transphorm Inc. | Gate structures for III-N devices |
| US9536967B2 (en) | 2014-12-16 | 2017-01-03 | Transphorm Inc. | Recessed ohmic contacts in a III-N device |
| US9536984B2 (en) | 2015-04-10 | 2017-01-03 | Cambridge Electronics, Inc. | Semiconductor structure with a spacer layer |
| US9614069B1 (en) | 2015-04-10 | 2017-04-04 | Cambridge Electronics, Inc. | III-Nitride semiconductors with recess regions and methods of manufacture |
| US9871067B2 (en) * | 2015-11-17 | 2018-01-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Infrared image sensor component |
| CN108604597B (zh) | 2016-01-15 | 2021-09-17 | 创世舫电子有限公司 | 具有al(1-x)sixo栅极绝缘体的增强模式iii-氮化物器件 |
| WO2017210323A1 (en) | 2016-05-31 | 2017-12-07 | Transphorm Inc. | Iii-nitride devices including a graded depleting layer |
| JP7028547B2 (ja) * | 2016-06-20 | 2022-03-02 | 株式会社アドバンテスト | 化合物半導体装置の製造方法 |
| JP6940762B2 (ja) * | 2017-09-07 | 2021-09-29 | 富士通株式会社 | 半導体装置及びその製造方法 |
| TWI656640B (zh) * | 2017-09-08 | 2019-04-11 | 黃知澍 | N-face AlGaN/GaN磊晶結構及其主動元件與其積體化之極性反轉製作方法 |
| CN110931550A (zh) * | 2018-09-20 | 2020-03-27 | 黄知澍 | N-face AlGaN/GaN磊晶结构及其主动组件与其积体化的极性反转制作方法 |
| US10756207B2 (en) * | 2018-10-12 | 2020-08-25 | Transphorm Technology, Inc. | Lateral III-nitride devices including a vertical gate module |
| CN111834439B (zh) * | 2019-04-22 | 2025-11-04 | 珠海格力电器股份有限公司 | 一种高电子迁移率晶体管、其制备方法及电子装置 |
| CN110429132B (zh) * | 2019-08-16 | 2023-05-09 | 广东省半导体产业技术研究院 | 栅极结构、栅极结构的制造方法和增强型半导体器件 |
| US20220069114A1 (en) * | 2020-08-28 | 2022-03-03 | Hrl Laboratories, Llc | Self-passivated nitrogen-polar iii-nitride transistor |
| JP7640022B2 (ja) | 2021-04-07 | 2025-03-05 | 日清紡マイクロデバイス株式会社 | 半導体装置 |
| WO2022257111A1 (zh) * | 2021-06-11 | 2022-12-15 | 华为技术有限公司 | 场效应管、其制备方法、功率放大器及电子电路 |
| CN114725019B (zh) * | 2022-01-06 | 2025-07-11 | 西安电子科技大学 | 一种N面GaN基p、n沟道器件集成结构及其制备方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5290393A (en) * | 1991-01-31 | 1994-03-01 | Nichia Kagaku Kogyo K.K. | Crystal growth method for gallium nitride-based compound semiconductor |
| US6849866B2 (en) * | 1996-10-16 | 2005-02-01 | The University Of Connecticut | High performance optoelectronic and electronic inversion channel quantum well devices suitable for monolithic integration |
| JPH10335637A (ja) | 1997-05-30 | 1998-12-18 | Sony Corp | ヘテロ接合電界効果トランジスタ |
| JP3149910B2 (ja) * | 1997-06-05 | 2001-03-26 | 日本電気株式会社 | 半導体装置の製造方法 |
| JP3439111B2 (ja) * | 1998-03-09 | 2003-08-25 | 古河電気工業株式会社 | 高移動度トランジスタ |
| JP4260276B2 (ja) * | 1998-03-27 | 2009-04-30 | シャープ株式会社 | 半導体素子及びその製造方法 |
| JP4577460B2 (ja) * | 1999-04-01 | 2010-11-10 | ソニー株式会社 | 半導体素子およびその製造方法 |
| US6133593A (en) | 1999-07-23 | 2000-10-17 | The United States Of America As Represented By The Secretary Of The Navy | Channel design to reduce impact ionization in heterostructure field-effect transistors |
| JP3393602B2 (ja) | 2000-01-13 | 2003-04-07 | 松下電器産業株式会社 | 半導体装置 |
| US20010015437A1 (en) | 2000-01-25 | 2001-08-23 | Hirotatsu Ishii | GaN field-effect transistor, inverter device, and production processes therefor |
| US6624452B2 (en) * | 2000-07-28 | 2003-09-23 | The Regents Of The University Of California | Gallium nitride-based HFET and a method for fabricating a gallium nitride-based HFET |
| US6649287B2 (en) * | 2000-12-14 | 2003-11-18 | Nitronex Corporation | Gallium nitride materials and methods |
| US6956239B2 (en) * | 2002-11-26 | 2005-10-18 | Cree, Inc. | Transistors having buried p-type layers beneath the source region |
| US7501669B2 (en) * | 2003-09-09 | 2009-03-10 | Cree, Inc. | Wide bandgap transistor devices with field plates |
| JP4041075B2 (ja) * | 2004-02-27 | 2008-01-30 | 株式会社東芝 | 半導体装置 |
| JP2006269534A (ja) * | 2005-03-22 | 2006-10-05 | Eudyna Devices Inc | 半導体装置及びその製造方法、その半導体装置製造用基板及びその製造方法並びにその半導体成長用基板 |
-
2006
- 2006-09-18 US US11/523,286 patent/US7948011B2/en active Active
- 2006-09-18 JP JP2008531424A patent/JP2009509343A/ja active Pending
- 2006-09-18 WO PCT/US2006/036377 patent/WO2007136401A2/en not_active Ceased
- 2006-09-18 CA CA2622750A patent/CA2622750C/en active Active
- 2006-09-18 EP EP06851277A patent/EP1932181A4/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| EP1932181A4 (en) | 2009-06-17 |
| WO2007136401A2 (en) | 2007-11-29 |
| EP1932181A2 (en) | 2008-06-18 |
| JP2009509343A (ja) | 2009-03-05 |
| CA2622750A1 (en) | 2007-11-29 |
| US7948011B2 (en) | 2011-05-24 |
| US20100264461A1 (en) | 2010-10-21 |
| WO2007136401A3 (en) | 2008-07-24 |
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