CA2536154A1 - Light emitting diode with porous sic substrate and method for fabricating - Google Patents

Light emitting diode with porous sic substrate and method for fabricating Download PDF

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Publication number
CA2536154A1
CA2536154A1 CA002536154A CA2536154A CA2536154A1 CA 2536154 A1 CA2536154 A1 CA 2536154A1 CA 002536154 A CA002536154 A CA 002536154A CA 2536154 A CA2536154 A CA 2536154A CA 2536154 A1 CA2536154 A1 CA 2536154A1
Authority
CA
Canada
Prior art keywords
electrolyte
substrate
porous layer
emission region
emitter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002536154A
Other languages
English (en)
French (fr)
Inventor
Ting Li
James Ibbetson
Bernd Keller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wolfspeed Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2536154A1 publication Critical patent/CA2536154A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/61—Electrolytic etching
    • H10P50/613—Electrolytic etching of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/70—Surface textures, e.g. pyramid structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Weting (AREA)
  • Formation Of Insulating Films (AREA)
CA002536154A 2003-09-30 2004-09-21 Light emitting diode with porous sic substrate and method for fabricating Abandoned CA2536154A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/676,953 2003-09-30
US10/676,953 US6972438B2 (en) 2003-09-30 2003-09-30 Light emitting diode with porous SiC substrate and method for fabricating
PCT/US2004/031050 WO2005034254A1 (en) 2003-09-30 2004-09-21 Light emitting diode with porous sic substrate and method for fabricating

Publications (1)

Publication Number Publication Date
CA2536154A1 true CA2536154A1 (en) 2005-04-14

Family

ID=34422124

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002536154A Abandoned CA2536154A1 (en) 2003-09-30 2004-09-21 Light emitting diode with porous sic substrate and method for fabricating

Country Status (8)

Country Link
US (1) US6972438B2 (https=)
EP (1) EP1668710B1 (https=)
JP (1) JP5748384B2 (https=)
KR (1) KR20060090813A (https=)
CN (1) CN100470854C (https=)
CA (1) CA2536154A1 (https=)
TW (1) TW200518355A (https=)
WO (1) WO2005034254A1 (https=)

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Also Published As

Publication number Publication date
JP5748384B2 (ja) 2015-07-15
KR20060090813A (ko) 2006-08-16
EP1668710A1 (en) 2006-06-14
WO2005034254A1 (en) 2005-04-14
US20050184307A1 (en) 2005-08-25
CN1860619A (zh) 2006-11-08
EP1668710B1 (en) 2014-12-24
CN100470854C (zh) 2009-03-18
US6972438B2 (en) 2005-12-06
JP2007507895A (ja) 2007-03-29
TW200518355A (en) 2005-06-01

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Legal Events

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FZDE Discontinued