CN100470854C - 具有多孔性碳化硅基层的发光二极管 - Google Patents

具有多孔性碳化硅基层的发光二极管 Download PDF

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Publication number
CN100470854C
CN100470854C CNB2004800279692A CN200480027969A CN100470854C CN 100470854 C CN100470854 C CN 100470854C CN B2004800279692 A CNB2004800279692 A CN B2004800279692A CN 200480027969 A CN200480027969 A CN 200480027969A CN 100470854 C CN100470854 C CN 100470854C
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CN
China
Prior art keywords
basic unit
emitting area
porous layer
light
layer
Prior art date
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Expired - Lifetime
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CNB2004800279692A
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English (en)
Chinese (zh)
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CN1860619A (zh
Inventor
郦挺
J·艾贝森
B·科勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kerui Led Co
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Cree Lighting Co
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Publication of CN1860619A publication Critical patent/CN1860619A/zh
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/817Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/60Wet etching
    • H10P50/61Electrolytic etching
    • H10P50/613Electrolytic etching of Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/70Surface textures, e.g. pyramid structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Weting (AREA)
  • Formation Of Insulating Films (AREA)
CNB2004800279692A 2003-09-30 2004-09-21 具有多孔性碳化硅基层的发光二极管 Expired - Lifetime CN100470854C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/676,953 2003-09-30
US10/676,953 US6972438B2 (en) 2003-09-30 2003-09-30 Light emitting diode with porous SiC substrate and method for fabricating

Publications (2)

Publication Number Publication Date
CN1860619A CN1860619A (zh) 2006-11-08
CN100470854C true CN100470854C (zh) 2009-03-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800279692A Expired - Lifetime CN100470854C (zh) 2003-09-30 2004-09-21 具有多孔性碳化硅基层的发光二极管

Country Status (8)

Country Link
US (1) US6972438B2 (https=)
EP (1) EP1668710B1 (https=)
JP (1) JP5748384B2 (https=)
KR (1) KR20060090813A (https=)
CN (1) CN100470854C (https=)
CA (1) CA2536154A1 (https=)
TW (1) TW200518355A (https=)
WO (1) WO2005034254A1 (https=)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1620903B1 (en) 2003-04-30 2017-08-16 Cree, Inc. High-power solid state light emitter package
US7005679B2 (en) 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US8174037B2 (en) * 2004-09-22 2012-05-08 Cree, Inc. High efficiency group III nitride LED with lenticular surface
JP2006179511A (ja) * 2004-12-20 2006-07-06 Sumitomo Electric Ind Ltd 発光装置
EP1969633B1 (en) 2005-12-22 2018-08-29 Cree, Inc. Lighting device
WO2007081719A2 (en) 2006-01-05 2007-07-19 Illumitex, Inc. Separate optical device for directing light from an led
KR101198763B1 (ko) * 2006-03-23 2012-11-12 엘지이노텍 주식회사 기둥 구조와 이를 이용한 발광 소자 및 그 형성방법
US20070241326A1 (en) * 2006-04-18 2007-10-18 Samsung Electronics Co., Ltd. Organic light emitting diode display and manufacturing method thereof
WO2007139894A2 (en) 2006-05-26 2007-12-06 Cree Led Lighting Solutions, Inc. Solid state light emitting device and method of making same
US8174025B2 (en) * 2006-06-09 2012-05-08 Philips Lumileds Lighting Company, Llc Semiconductor light emitting device including porous layer
US20080025037A1 (en) * 2006-07-28 2008-01-31 Visteon Global Technologies, Inc. LED headlamp
WO2008024385A2 (en) 2006-08-23 2008-02-28 Cree Led Lighting Solutions, Inc. Lighting device and lighting method
US8087960B2 (en) 2006-10-02 2012-01-03 Illumitex, Inc. LED system and method
JP4835377B2 (ja) * 2006-10-20 2011-12-14 日立電線株式会社 半導体発光素子
KR100826412B1 (ko) * 2006-11-03 2008-04-29 삼성전기주식회사 질화물 반도체 발광 소자 및 제조방법
EP2095011A1 (en) 2006-12-04 2009-09-02 Cree Led Lighting Solutions, Inc. Lighting assembly and lighting method
WO2008070604A1 (en) * 2006-12-04 2008-06-12 Cree Led Lighting Solutions, Inc. Lighting device and lighting method
US8021904B2 (en) * 2007-02-01 2011-09-20 Cree, Inc. Ohmic contacts to nitrogen polarity GaN
US7808657B2 (en) * 2007-06-28 2010-10-05 International Business Machines Corporation Wafer and stage alignment using photonic devices
JP5431320B2 (ja) 2007-07-17 2014-03-05 クリー インコーポレイテッド 内部光学機能を備えた光学素子およびその製造方法
US11114594B2 (en) 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
US8368100B2 (en) * 2007-11-14 2013-02-05 Cree, Inc. Semiconductor light emitting diodes having reflective structures and methods of fabricating same
US8536584B2 (en) * 2007-11-14 2013-09-17 Cree, Inc. High voltage wire bond free LEDS
US9634191B2 (en) * 2007-11-14 2017-04-25 Cree, Inc. Wire bond free wafer level LED
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
US8080849B2 (en) * 2008-01-17 2011-12-20 International Business Machines Corporation Characterizing films using optical filter pseudo substrate
JP2011512037A (ja) 2008-02-08 2011-04-14 イルミテックス, インコーポレイテッド エミッタ層成形のためのシステムおよび方法
US8637883B2 (en) * 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
JP5330880B2 (ja) * 2009-03-27 2013-10-30 学校法人 名城大学 発光ダイオード素子及びその製造方法
US9093293B2 (en) 2009-04-06 2015-07-28 Cree, Inc. High voltage low current surface emitting light emitting diode
US8476668B2 (en) 2009-04-06 2013-07-02 Cree, Inc. High voltage low current surface emitting LED
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
WO2011037877A1 (en) 2009-09-25 2011-03-31 Cree, Inc. Lighting device with low glare and high light level uniformity
JP5961557B2 (ja) 2010-01-27 2016-08-02 イェイル ユニヴァーシティ GaNデバイスのための導電率ベースの選択的エッチング及びその用途
US8329482B2 (en) 2010-04-30 2012-12-11 Cree, Inc. White-emitting LED chips and method for making same
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
EP2641279B1 (en) * 2010-11-19 2017-09-27 Koninklijke Philips N.V. Islanded carrier for light emitting device
WO2013158210A2 (en) 2012-02-17 2013-10-24 Yale University Heterogeneous material integration through guided lateral growth
WO2014004261A1 (en) 2012-06-28 2014-01-03 Yale University Lateral electrochemical etching of iii-nitride materials for microfabrication
US20150228414A1 (en) * 2012-08-22 2015-08-13 Sumitomo Osak Cement Co., Ltd. Dye-sensitive solar cell paste, porous light-reflective insulation layer, and dye-sensitive solar cell
WO2014144698A2 (en) 2013-03-15 2014-09-18 Yale University Large-area, laterally-grown epitaxial semiconductor layers
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
US9299899B2 (en) 2013-07-23 2016-03-29 Grote Industries, Llc Flexible lighting device having unobtrusive conductive layers
US11095096B2 (en) 2014-04-16 2021-08-17 Yale University Method for a GaN vertical microcavity surface emitting laser (VCSEL)
WO2015160909A1 (en) 2014-04-16 2015-10-22 Yale University Method of obtaining planar semipolar gallium nitride surfaces
WO2015160903A1 (en) 2014-04-16 2015-10-22 Yale University Nitrogen-polar semipolar gan layers and devices on sapphire substrates
EP3201952B1 (en) 2014-09-30 2023-03-29 Yale University A method for gan vertical microcavity surface emitting laser
US11018231B2 (en) 2014-12-01 2021-05-25 Yale University Method to make buried, highly conductive p-type III-nitride layers
EP3298624B1 (en) 2015-05-19 2023-04-19 Yale University A method and device concerning iii-nitride edge emitting laser diode of high confinement factor with lattice matched cladding layer
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
WO2018031876A1 (en) 2016-08-12 2018-02-15 Yale University Stacking fault-free semipolar and nonpolar gan grown on foreign substrates by eliminating the nitrogen polar facets during the growth
KR102391610B1 (ko) 2017-08-04 2022-04-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지 및 광원 장치
US12588433B2 (en) 2019-10-31 2026-03-24 Yale University Porous III-nitrides and methods of using and making thereof
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device
FR3132593B1 (fr) * 2022-02-08 2025-04-18 Centre Nat Rech Scient Creation d’une fenetre de sortie de rayonnement pour un composant photoemetteur
CN119092616A (zh) * 2024-08-26 2024-12-06 泉州三安半导体科技有限公司 一种发光二极管封装体及发光装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376241A (en) * 1992-10-06 1994-12-27 Kulite Semiconductor Products, Inc. Fabricating porous silicon carbide
US5644156A (en) * 1994-04-14 1997-07-01 Kabushiki Kaisha Toshiba Porous silicon photo-device capable of photoelectric conversion
US6225647B1 (en) * 1998-07-27 2001-05-01 Kulite Semiconductor Products, Inc. Passivation of porous semiconductors for improved optoelectronic device performance and light-emitting diode based on same
US20010010449A1 (en) * 2000-02-02 2001-08-02 Chien-Chia Chiu High efficiency white light emitting diode
US20030057444A1 (en) * 2001-07-24 2003-03-27 Nichia Corporation Semiconductor light emitting device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4056415A (en) * 1975-08-04 1977-11-01 International Telephone And Telegraph Corporation Method for providing electrical isolating material in selected regions of a semiconductive material
US4866005A (en) 1987-10-26 1989-09-12 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
US4946547A (en) 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
US5200022A (en) 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
JPH077179A (ja) 1993-06-16 1995-01-10 Sanyo Electric Co Ltd 発光素子
JPH077180A (ja) * 1993-06-16 1995-01-10 Sanyo Electric Co Ltd 発光素子
DE19548115C2 (de) * 1994-12-27 2002-08-29 Nissan Motor Elektrochemisches Ätzverfahren für ein Halbleitersubstrat sowie Vorrichtung zur Durchführung des Verfahrens
JP3985065B2 (ja) * 1997-05-14 2007-10-03 忠弘 大見 多孔質シリコン基板の形成方法及び多孔質シリコン基板の形成装置
US5939732A (en) * 1997-05-22 1999-08-17 Kulite Semiconductor Products, Inc. Vertical cavity-emitting porous silicon carbide light-emitting diode device and preparation thereof
JP3523197B2 (ja) * 1998-02-12 2004-04-26 エーシーエム リサーチ,インコーポレイティド メッキ設備及び方法
CN1252837C (zh) * 2000-04-26 2006-04-19 奥斯兰姆奥普托半导体股份有限两合公司 在GaN基板上的发光二极管芯片和用GaN基板上的发光二极管芯片制造发光二极管元件的方法
JP3830083B2 (ja) * 2001-03-07 2006-10-04 スタンレー電気株式会社 半導体装置およびその製造方法
JP3802424B2 (ja) * 2002-01-15 2006-07-26 株式会社東芝 半導体発光素子及びその製造方法
JP3782357B2 (ja) * 2002-01-18 2006-06-07 株式会社東芝 半導体発光素子の製造方法
JP4590905B2 (ja) * 2003-10-31 2010-12-01 豊田合成株式会社 発光素子および発光装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376241A (en) * 1992-10-06 1994-12-27 Kulite Semiconductor Products, Inc. Fabricating porous silicon carbide
US5644156A (en) * 1994-04-14 1997-07-01 Kabushiki Kaisha Toshiba Porous silicon photo-device capable of photoelectric conversion
US6225647B1 (en) * 1998-07-27 2001-05-01 Kulite Semiconductor Products, Inc. Passivation of porous semiconductors for improved optoelectronic device performance and light-emitting diode based on same
US20010010449A1 (en) * 2000-02-02 2001-08-02 Chien-Chia Chiu High efficiency white light emitting diode
US20030057444A1 (en) * 2001-07-24 2003-03-27 Nichia Corporation Semiconductor light emitting device

Also Published As

Publication number Publication date
JP5748384B2 (ja) 2015-07-15
KR20060090813A (ko) 2006-08-16
EP1668710A1 (en) 2006-06-14
WO2005034254A1 (en) 2005-04-14
US20050184307A1 (en) 2005-08-25
CN1860619A (zh) 2006-11-08
EP1668710B1 (en) 2014-12-24
CA2536154A1 (en) 2005-04-14
US6972438B2 (en) 2005-12-06
JP2007507895A (ja) 2007-03-29
TW200518355A (en) 2005-06-01

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