CA2532451A1 - Device and method for electrolytically treating electrically insulated structures - Google Patents

Device and method for electrolytically treating electrically insulated structures Download PDF

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Publication number
CA2532451A1
CA2532451A1 CA002532451A CA2532451A CA2532451A1 CA 2532451 A1 CA2532451 A1 CA 2532451A1 CA 002532451 A CA002532451 A CA 002532451A CA 2532451 A CA2532451 A CA 2532451A CA 2532451 A1 CA2532451 A1 CA 2532451A1
Authority
CA
Canada
Prior art keywords
work pieces
contacting
electrode
processing liquid
electrolysis region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002532451A
Other languages
English (en)
French (fr)
Inventor
Michael Guggemos
Franz Kohnle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2532451A1 publication Critical patent/CA2532451A1/en
Abandoned legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0621In horizontal cells
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005Contacting devices
CA002532451A 2003-09-12 2004-08-19 Device and method for electrolytically treating electrically insulated structures Abandoned CA2532451A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10342512A DE10342512B3 (de) 2003-09-12 2003-09-12 Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
DE10342512.8 2003-09-12
PCT/EP2004/009436 WO2005026415A1 (en) 2003-09-12 2004-08-19 Device and method for electrolytically treating electrically insulated structures

Publications (1)

Publication Number Publication Date
CA2532451A1 true CA2532451A1 (en) 2005-03-24

Family

ID=33039358

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002532451A Abandoned CA2532451A1 (en) 2003-09-12 2004-08-19 Device and method for electrolytically treating electrically insulated structures

Country Status (13)

Country Link
US (1) US20060201817A1 (de)
EP (1) EP1664390B1 (de)
JP (1) JP4474414B2 (de)
KR (1) KR101076947B1 (de)
CN (1) CN1849415A (de)
AT (1) ATE350514T1 (de)
BR (1) BRPI0413715B1 (de)
CA (1) CA2532451A1 (de)
DE (2) DE10342512B3 (de)
HK (1) HK1084423A1 (de)
MX (1) MXPA06002649A (de)
TW (1) TWI336358B (de)
WO (1) WO2005026415A1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4862513B2 (ja) * 2005-06-23 2012-01-25 東レ株式会社 給電用ローラならびに電解めっき被膜付きフィルムの製造装置および方法
DE102005031948B3 (de) * 2005-07-08 2006-06-14 Höllmüller Maschinenbau GmbH Vorrichtungen und Verfahren zur elektrolytischen Behandlung von Folien von Rolle zu Rolle
EP2381015B1 (de) 2005-08-12 2019-01-16 Modumetal, Inc. Kompositionell modulierte Verbundmaterialien
KR20090009876A (ko) * 2006-04-18 2009-01-23 바스프 에스이 전해 도금 장치 및 방법
JP2009534525A (ja) * 2006-04-18 2009-09-24 ビーエーエスエフ ソシエタス・ヨーロピア 電解コーティング装置及び電解コーティング方法
DE102006033353B4 (de) * 2006-07-19 2010-11-18 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
DE102008004592A1 (de) 2008-01-16 2009-07-23 Danziger, Manfred, Dr. Bandgalvanikanlage zur elektrochemischen Verstärkung einer elektrisch leitfähigen äußeren Schicht eines Bandes
JP2009249659A (ja) * 2008-04-02 2009-10-29 Nippon Mektron Ltd 電気めっき装置及び電気めっき方法
US20100264035A1 (en) * 2009-04-15 2010-10-21 Solopower, Inc. Reel-to-reel plating of conductive grids for flexible thin film solar cells
DE102009022337A1 (de) * 2009-05-13 2010-11-18 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Behandlung eines Substrats
BR122013014464B1 (pt) 2009-06-08 2020-10-20 Modumetal, Inc revestimento de multicamadas resistente à corrosão em um substrato e método de eletrodepósito para produção de um revestimento
US8377267B2 (en) * 2009-09-30 2013-02-19 National Semiconductor Corporation Foil plating for semiconductor packaging
CN102383159A (zh) * 2011-08-09 2012-03-21 长春一汽富维高新汽车饰件有限公司 粗化生产与三价铬电解工艺合并的装置及方法
EP2626144A1 (de) * 2012-02-07 2013-08-14 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Herstellungssystem für Endlosprodukte mit einer Reinraum-Auftragszone und einem getrennten Behandlungsraum
US10472727B2 (en) 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
BR112015022078B1 (pt) * 2013-03-15 2022-05-17 Modumetal, Inc Aparelho e método para eletrodepositar um revestimento nanolaminado
CN110273167A (zh) 2013-03-15 2019-09-24 莫杜美拓有限公司 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金
EP2971265A4 (de) 2013-03-15 2016-12-14 Modumetal Inc Nickel-chrom-nanolaminatbeschichtung mit hoher härte
BR112015022235A2 (pt) 2013-03-15 2017-07-18 Modumetal Inc revestimentos nanolaminados
CN104195611B (zh) * 2014-08-15 2016-09-14 洛阳弘洋机械有限公司 一种棒料连续镀铬生产线
CA2961507C (en) 2014-09-18 2024-04-09 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
EP3194642A4 (de) 2014-09-18 2018-07-04 Modumetal, Inc. Verfahren und vorrichtung zum kontinuierlichen auftragen von nanolaminierten metallbeschichtungen
CN104928738B (zh) * 2015-05-21 2017-04-19 中国科学院山西煤炭化学研究所 一种碳纤维丝束的连续电镀金属方法及装置
CN105177660B (zh) * 2015-10-09 2017-11-21 华晶精密制造股份有限公司 一种金刚石切割线生产用水平上砂装置
CN109952391B (zh) 2016-09-08 2022-11-01 莫杜美拓有限公司 在工件上提供层压涂层的方法,及由其制备的制品
EP3601641A1 (de) 2017-03-24 2020-02-05 Modumetal, Inc. Hubkolben mit galvanischen beschichtungen und systeme und verfahren zur produktion derselben
CA3060619A1 (en) 2017-04-21 2018-10-25 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
US11214884B2 (en) 2017-07-11 2022-01-04 University Of South Florida Electrochemical three-dimensional printing and soldering
CN107523831B (zh) * 2017-09-30 2019-01-18 江阴康强电子有限公司 粗化浸镀子槽
US11519093B2 (en) 2018-04-27 2022-12-06 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN108950622B (zh) * 2018-08-28 2020-07-21 温州杰锐电子科技有限公司 一种电刷镀装置
US10807823B2 (en) * 2019-02-01 2020-10-20 Assa Abloy Ab Card stacker
CN112249702A (zh) * 2019-07-22 2021-01-22 艾里亚设计股分有限公司 导引辊装置
US11713514B2 (en) * 2019-08-08 2023-08-01 Hutchinson Technology Incorporated Systems for electroplating and methods of use thereof
CN112111775B (zh) * 2020-08-15 2023-02-03 智兴(上海)五金有限公司 一种导线快速氧化处理系统

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3535222A (en) * 1964-02-04 1970-10-20 Aluminium Lab Ltd Apparatus for continuous electrolytic treatment
NL129563C (de) * 1964-02-04
US4282073A (en) * 1979-08-22 1981-08-04 Thomas Steel Strip Corporation Electro-co-deposition of corrosion resistant nickel/zinc alloys onto steel substrates
US4324633A (en) * 1980-10-20 1982-04-13 Lovejoy Curtis N Electrolytic apparatus for treating continuous strip material
US4401523A (en) * 1980-12-18 1983-08-30 Republic Steel Corporation Apparatus and method for plating metallic strip
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
US4560445A (en) * 1984-12-24 1985-12-24 Polyonics Corporation Continuous process for fabricating metallic patterns on a thin film substrate
FR2653787B1 (fr) * 1989-10-27 1992-02-14 Lorraine Laminage Installation et procede de revetement electrolytique d'une bande metallique.
DE4229403C2 (de) * 1992-09-03 1995-04-13 Hoellmueller Maschbau H Vorrichtung zum Galvanisieren dünner, ein- oder beidseits mit einer leitfähigen Beschichtung versehener Kunststoffolien
DE19612555C2 (de) * 1996-03-29 1998-03-19 Atotech Deutschland Gmbh Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens
DE19717512C3 (de) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
DE19951325C2 (de) * 1999-10-20 2003-06-26 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens
DE10043814C1 (de) * 2000-09-06 2002-04-11 Egon Huebel Verfahren und Vorrichtungen zum elektrochemischen Behandeln von Gut
DE10065649C2 (de) * 2000-12-29 2003-03-20 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von elektrisch leitfähigen Bändern
DE10065643C2 (de) * 2000-12-29 2003-03-20 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen

Also Published As

Publication number Publication date
JP2007505213A (ja) 2007-03-08
BRPI0413715A (pt) 2006-10-17
KR20060058116A (ko) 2006-05-29
MXPA06002649A (es) 2006-06-06
KR101076947B1 (ko) 2011-10-26
US20060201817A1 (en) 2006-09-14
CN1849415A (zh) 2006-10-18
ATE350514T1 (de) 2007-01-15
BRPI0413715B1 (pt) 2013-09-17
WO2005026415A1 (en) 2005-03-24
EP1664390B1 (de) 2007-01-03
DE602004004164T2 (de) 2007-10-11
JP4474414B2 (ja) 2010-06-02
DE602004004164D1 (de) 2007-02-15
TWI336358B (en) 2011-01-21
HK1084423A1 (en) 2006-07-28
EP1664390A1 (de) 2006-06-07
TW200510577A (en) 2005-03-16
DE10342512B3 (de) 2004-10-28

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FZDE Discontinued