CA2532451A1 - Device and method for electrolytically treating electrically insulated structures - Google Patents
Device and method for electrolytically treating electrically insulated structures Download PDFInfo
- Publication number
- CA2532451A1 CA2532451A1 CA002532451A CA2532451A CA2532451A1 CA 2532451 A1 CA2532451 A1 CA 2532451A1 CA 002532451 A CA002532451 A CA 002532451A CA 2532451 A CA2532451 A CA 2532451A CA 2532451 A1 CA2532451 A1 CA 2532451A1
- Authority
- CA
- Canada
- Prior art keywords
- work pieces
- contacting
- electrode
- processing liquid
- electrolysis region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10342512A DE10342512B3 (de) | 2003-09-12 | 2003-09-12 | Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut |
DE10342512.8 | 2003-09-12 | ||
PCT/EP2004/009436 WO2005026415A1 (en) | 2003-09-12 | 2004-08-19 | Device and method for electrolytically treating electrically insulated structures |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2532451A1 true CA2532451A1 (en) | 2005-03-24 |
Family
ID=33039358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002532451A Abandoned CA2532451A1 (en) | 2003-09-12 | 2004-08-19 | Device and method for electrolytically treating electrically insulated structures |
Country Status (13)
Country | Link |
---|---|
US (1) | US20060201817A1 (de) |
EP (1) | EP1664390B1 (de) |
JP (1) | JP4474414B2 (de) |
KR (1) | KR101076947B1 (de) |
CN (1) | CN1849415A (de) |
AT (1) | ATE350514T1 (de) |
BR (1) | BRPI0413715B1 (de) |
CA (1) | CA2532451A1 (de) |
DE (2) | DE10342512B3 (de) |
HK (1) | HK1084423A1 (de) |
MX (1) | MXPA06002649A (de) |
TW (1) | TWI336358B (de) |
WO (1) | WO2005026415A1 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4862513B2 (ja) * | 2005-06-23 | 2012-01-25 | 東レ株式会社 | 給電用ローラならびに電解めっき被膜付きフィルムの製造装置および方法 |
DE102005031948B3 (de) * | 2005-07-08 | 2006-06-14 | Höllmüller Maschinenbau GmbH | Vorrichtungen und Verfahren zur elektrolytischen Behandlung von Folien von Rolle zu Rolle |
EP2381015B1 (de) | 2005-08-12 | 2019-01-16 | Modumetal, Inc. | Kompositionell modulierte Verbundmaterialien |
KR20090009876A (ko) * | 2006-04-18 | 2009-01-23 | 바스프 에스이 | 전해 도금 장치 및 방법 |
JP2009534525A (ja) * | 2006-04-18 | 2009-09-24 | ビーエーエスエフ ソシエタス・ヨーロピア | 電解コーティング装置及び電解コーティング方法 |
DE102006033353B4 (de) * | 2006-07-19 | 2010-11-18 | Höllmüller Maschinenbau GmbH | Verfahren und Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten |
TW200829726A (en) * | 2006-11-28 | 2008-07-16 | Basf Ag | Method and device for electrolytic coating |
DE102008004592A1 (de) | 2008-01-16 | 2009-07-23 | Danziger, Manfred, Dr. | Bandgalvanikanlage zur elektrochemischen Verstärkung einer elektrisch leitfähigen äußeren Schicht eines Bandes |
JP2009249659A (ja) * | 2008-04-02 | 2009-10-29 | Nippon Mektron Ltd | 電気めっき装置及び電気めっき方法 |
US20100264035A1 (en) * | 2009-04-15 | 2010-10-21 | Solopower, Inc. | Reel-to-reel plating of conductive grids for flexible thin film solar cells |
DE102009022337A1 (de) * | 2009-05-13 | 2010-11-18 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Behandlung eines Substrats |
BR122013014464B1 (pt) | 2009-06-08 | 2020-10-20 | Modumetal, Inc | revestimento de multicamadas resistente à corrosão em um substrato e método de eletrodepósito para produção de um revestimento |
US8377267B2 (en) * | 2009-09-30 | 2013-02-19 | National Semiconductor Corporation | Foil plating for semiconductor packaging |
CN102383159A (zh) * | 2011-08-09 | 2012-03-21 | 长春一汽富维高新汽车饰件有限公司 | 粗化生产与三价铬电解工艺合并的装置及方法 |
EP2626144A1 (de) * | 2012-02-07 | 2013-08-14 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Herstellungssystem für Endlosprodukte mit einer Reinraum-Auftragszone und einem getrennten Behandlungsraum |
US10472727B2 (en) | 2013-03-15 | 2019-11-12 | Modumetal, Inc. | Method and apparatus for continuously applying nanolaminate metal coatings |
BR112015022078B1 (pt) * | 2013-03-15 | 2022-05-17 | Modumetal, Inc | Aparelho e método para eletrodepositar um revestimento nanolaminado |
CN110273167A (zh) | 2013-03-15 | 2019-09-24 | 莫杜美拓有限公司 | 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金 |
EP2971265A4 (de) | 2013-03-15 | 2016-12-14 | Modumetal Inc | Nickel-chrom-nanolaminatbeschichtung mit hoher härte |
BR112015022235A2 (pt) | 2013-03-15 | 2017-07-18 | Modumetal Inc | revestimentos nanolaminados |
CN104195611B (zh) * | 2014-08-15 | 2016-09-14 | 洛阳弘洋机械有限公司 | 一种棒料连续镀铬生产线 |
CA2961507C (en) | 2014-09-18 | 2024-04-09 | Modumetal, Inc. | Methods of preparing articles by electrodeposition and additive manufacturing processes |
EP3194642A4 (de) | 2014-09-18 | 2018-07-04 | Modumetal, Inc. | Verfahren und vorrichtung zum kontinuierlichen auftragen von nanolaminierten metallbeschichtungen |
CN104928738B (zh) * | 2015-05-21 | 2017-04-19 | 中国科学院山西煤炭化学研究所 | 一种碳纤维丝束的连续电镀金属方法及装置 |
CN105177660B (zh) * | 2015-10-09 | 2017-11-21 | 华晶精密制造股份有限公司 | 一种金刚石切割线生产用水平上砂装置 |
CN109952391B (zh) | 2016-09-08 | 2022-11-01 | 莫杜美拓有限公司 | 在工件上提供层压涂层的方法,及由其制备的制品 |
EP3601641A1 (de) | 2017-03-24 | 2020-02-05 | Modumetal, Inc. | Hubkolben mit galvanischen beschichtungen und systeme und verfahren zur produktion derselben |
CA3060619A1 (en) | 2017-04-21 | 2018-10-25 | Modumetal, Inc. | Tubular articles with electrodeposited coatings, and systems and methods for producing the same |
US11214884B2 (en) | 2017-07-11 | 2022-01-04 | University Of South Florida | Electrochemical three-dimensional printing and soldering |
CN107523831B (zh) * | 2017-09-30 | 2019-01-18 | 江阴康强电子有限公司 | 粗化浸镀子槽 |
US11519093B2 (en) | 2018-04-27 | 2022-12-06 | Modumetal, Inc. | Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation |
CN108950622B (zh) * | 2018-08-28 | 2020-07-21 | 温州杰锐电子科技有限公司 | 一种电刷镀装置 |
US10807823B2 (en) * | 2019-02-01 | 2020-10-20 | Assa Abloy Ab | Card stacker |
CN112249702A (zh) * | 2019-07-22 | 2021-01-22 | 艾里亚设计股分有限公司 | 导引辊装置 |
US11713514B2 (en) * | 2019-08-08 | 2023-08-01 | Hutchinson Technology Incorporated | Systems for electroplating and methods of use thereof |
CN112111775B (zh) * | 2020-08-15 | 2023-02-03 | 智兴(上海)五金有限公司 | 一种导线快速氧化处理系统 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3535222A (en) * | 1964-02-04 | 1970-10-20 | Aluminium Lab Ltd | Apparatus for continuous electrolytic treatment |
NL129563C (de) * | 1964-02-04 | |||
US4282073A (en) * | 1979-08-22 | 1981-08-04 | Thomas Steel Strip Corporation | Electro-co-deposition of corrosion resistant nickel/zinc alloys onto steel substrates |
US4324633A (en) * | 1980-10-20 | 1982-04-13 | Lovejoy Curtis N | Electrolytic apparatus for treating continuous strip material |
US4401523A (en) * | 1980-12-18 | 1983-08-30 | Republic Steel Corporation | Apparatus and method for plating metallic strip |
US4469564A (en) * | 1982-08-11 | 1984-09-04 | At&T Bell Laboratories | Copper electroplating process |
US4560445A (en) * | 1984-12-24 | 1985-12-24 | Polyonics Corporation | Continuous process for fabricating metallic patterns on a thin film substrate |
FR2653787B1 (fr) * | 1989-10-27 | 1992-02-14 | Lorraine Laminage | Installation et procede de revetement electrolytique d'une bande metallique. |
DE4229403C2 (de) * | 1992-09-03 | 1995-04-13 | Hoellmueller Maschbau H | Vorrichtung zum Galvanisieren dünner, ein- oder beidseits mit einer leitfähigen Beschichtung versehener Kunststoffolien |
DE19612555C2 (de) * | 1996-03-29 | 1998-03-19 | Atotech Deutschland Gmbh | Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens |
DE19717512C3 (de) * | 1997-04-25 | 2003-06-18 | Atotech Deutschland Gmbh | Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen |
US6153064A (en) * | 1998-11-25 | 2000-11-28 | Oliver Sales Company | Apparatus for in line plating |
DE19951325C2 (de) * | 1999-10-20 | 2003-06-26 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens |
DE10043814C1 (de) * | 2000-09-06 | 2002-04-11 | Egon Huebel | Verfahren und Vorrichtungen zum elektrochemischen Behandeln von Gut |
DE10065649C2 (de) * | 2000-12-29 | 2003-03-20 | Egon Huebel | Vorrichtung und Verfahren zum elektrochemischen Behandeln von elektrisch leitfähigen Bändern |
DE10065643C2 (de) * | 2000-12-29 | 2003-03-20 | Egon Huebel | Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut |
WO2003038158A2 (de) * | 2001-10-25 | 2003-05-08 | Infineon Technologies Ag | Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen |
-
2003
- 2003-09-12 DE DE10342512A patent/DE10342512B3/de not_active Expired - Fee Related
-
2004
- 2004-08-19 WO PCT/EP2004/009436 patent/WO2005026415A1/en active IP Right Grant
- 2004-08-19 US US10/566,227 patent/US20060201817A1/en not_active Abandoned
- 2004-08-19 CN CNA2004800260338A patent/CN1849415A/zh active Pending
- 2004-08-19 MX MXPA06002649A patent/MXPA06002649A/es active IP Right Grant
- 2004-08-19 AT AT04764415T patent/ATE350514T1/de not_active IP Right Cessation
- 2004-08-19 BR BRPI0413715-9B1A patent/BRPI0413715B1/pt not_active IP Right Cessation
- 2004-08-19 KR KR1020067003313A patent/KR101076947B1/ko not_active IP Right Cessation
- 2004-08-19 DE DE602004004164T patent/DE602004004164T2/de active Active
- 2004-08-19 CA CA002532451A patent/CA2532451A1/en not_active Abandoned
- 2004-08-19 EP EP04764415A patent/EP1664390B1/de not_active Not-in-force
- 2004-08-19 JP JP2006525683A patent/JP4474414B2/ja not_active Expired - Fee Related
- 2004-08-31 TW TW093126281A patent/TWI336358B/zh not_active IP Right Cessation
-
2006
- 2006-06-14 HK HK06106798A patent/HK1084423A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2007505213A (ja) | 2007-03-08 |
BRPI0413715A (pt) | 2006-10-17 |
KR20060058116A (ko) | 2006-05-29 |
MXPA06002649A (es) | 2006-06-06 |
KR101076947B1 (ko) | 2011-10-26 |
US20060201817A1 (en) | 2006-09-14 |
CN1849415A (zh) | 2006-10-18 |
ATE350514T1 (de) | 2007-01-15 |
BRPI0413715B1 (pt) | 2013-09-17 |
WO2005026415A1 (en) | 2005-03-24 |
EP1664390B1 (de) | 2007-01-03 |
DE602004004164T2 (de) | 2007-10-11 |
JP4474414B2 (ja) | 2010-06-02 |
DE602004004164D1 (de) | 2007-02-15 |
TWI336358B (en) | 2011-01-21 |
HK1084423A1 (en) | 2006-07-28 |
EP1664390A1 (de) | 2006-06-07 |
TW200510577A (en) | 2005-03-16 |
DE10342512B3 (de) | 2004-10-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FZDE | Discontinued |