CA2426124A1 - Utilisation du traitement metallique sur des feuilles de cuivre afin de produire des lignes fines et de remplacer le traitement a l'oxyde dans la fabrication de plaquettes de circuits imprimes - Google Patents

Utilisation du traitement metallique sur des feuilles de cuivre afin de produire des lignes fines et de remplacer le traitement a l'oxyde dans la fabrication de plaquettes de circuits imprimes Download PDF

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Publication number
CA2426124A1
CA2426124A1 CA002426124A CA2426124A CA2426124A1 CA 2426124 A1 CA2426124 A1 CA 2426124A1 CA 002426124 A CA002426124 A CA 002426124A CA 2426124 A CA2426124 A CA 2426124A CA 2426124 A1 CA2426124 A1 CA 2426124A1
Authority
CA
Canada
Prior art keywords
conductive layer
layer
electrically conductive
metal layer
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002426124A
Other languages
English (en)
Inventor
John A. Andresakis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oak Mitsui Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2426124A1 publication Critical patent/CA2426124A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

L'invention concerne la fabrication de plaquettes de circuits imprimés présentant une uniformité et une résolution de gravure améliorées. Le procédé selon l'invention s'affranchit du traitement à l'oxyde noir destiné à améliorer l'adhérence, et facilite l'inspection visuelle des plaquettes de circuits imprimés. Ledit procédé est mis en oeuvre par réalisation des étapes (a) et (b) dans un ordre quelconque, l'étape (a) consistant à déposer une première surface d'une couche électroconductrice sur un substrat, ladite couche électroconductrice présentant une deuxième surface rugueuse opposée à la première, et l'étape (b) consistant à déposer une fine couche métallique sur la deuxième surface rugueuse de la couche électroconductrice, ladite couche métallique contenant un matériau présentant des propriétés de résistance à la gravure différentes de celles de la couche électroconductrice. Ensuite, on dépose une photorésine sur la couche métallique, on expose la photorésine image par image et on développe ladite photorésine, révélant ainsi des parties sous-jacentes de la couche métallique. Puis on retire les parties sous-jacentes révélées de la couche métallique, révélant ainsi des parties sous-jacentes de la couche conductrice, et on retire les parties sous-jacentes révélées de la couche conductrice de manière à produire une couche de circuits imprimés.
CA002426124A 2000-10-26 2001-10-17 Utilisation du traitement metallique sur des feuilles de cuivre afin de produire des lignes fines et de remplacer le traitement a l'oxyde dans la fabrication de plaquettes de circuits imprimes Abandoned CA2426124A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US69761400A 2000-10-26 2000-10-26
US09/697,614 2000-10-26
PCT/US2001/032400 WO2002035897A1 (fr) 2000-10-26 2001-10-17 Utilisation du traitement metallique sur des feuilles de cuivre afin de produire des lignes fines et de remplacer le traitement a l'oxyde dans la fabrication de plaquettes de circuits imprimes

Publications (1)

Publication Number Publication Date
CA2426124A1 true CA2426124A1 (fr) 2002-05-02

Family

ID=24801816

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002426124A Abandoned CA2426124A1 (fr) 2000-10-26 2001-10-17 Utilisation du traitement metallique sur des feuilles de cuivre afin de produire des lignes fines et de remplacer le traitement a l'oxyde dans la fabrication de plaquettes de circuits imprimes

Country Status (9)

Country Link
EP (1) EP1332653A1 (fr)
JP (1) JP2004512698A (fr)
KR (1) KR100899588B1 (fr)
CN (1) CN1299546C (fr)
AU (1) AU2002211790A1 (fr)
CA (1) CA2426124A1 (fr)
MY (1) MY156961A (fr)
TW (1) TW592009B (fr)
WO (1) WO2002035897A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6703252B2 (en) 2002-01-31 2004-03-09 Hewlett-Packard Development Company, L.P. Method of manufacturing an emitter
JP2005285946A (ja) * 2004-03-29 2005-10-13 Nippon Mektron Ltd 回路基板の製造方法
CN100446640C (zh) * 2004-09-09 2008-12-24 广东东硕科技有限公司 一种用于铜面黑氧化的后处理液
CN102265711B (zh) 2008-12-26 2014-11-05 吉坤日矿日石金属株式会社 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法
CN102265710B (zh) * 2008-12-26 2014-04-30 吉坤日矿日石金属株式会社 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法
WO2010074054A1 (fr) * 2008-12-26 2010-07-01 日鉱金属株式会社 Procédé servant à former un circuit électronique
JP5935163B2 (ja) * 2012-03-30 2016-06-15 ナガセケムテックス株式会社 レジスト密着性向上剤及び銅配線製造方法
JP7055049B2 (ja) * 2017-03-31 2022-04-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
CN109693080B (zh) * 2018-12-24 2020-12-29 江苏弘信华印电路科技有限公司 一种刚挠结合板的无毛刺铣切工艺
TWI781818B (zh) * 2021-11-05 2022-10-21 長春石油化學股份有限公司 表面處理銅箔及銅箔基板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2009018B1 (de) * 1970-02-26 1971-04-15 Krause W Verfahren zur Herstellung von gedruck ten Schaltunge
DE2511189C2 (de) * 1975-03-14 1976-10-21 Heinz Bungard Verfahren zur herstellung von oberflaechenplattiertem basismaterial fuer die herstellung von gedruckten schaltungen
US4756795A (en) * 1986-10-31 1988-07-12 International Business Machines Corporation Raw card fabrication process with nickel overplate
US4971894A (en) * 1989-02-13 1990-11-20 International Business Machines Corporation Method and structure for preventing wet etchant penetration at the interface between a resist mask and an underlying metal layer
JPH0728115B2 (ja) * 1989-03-17 1995-03-29 株式会社日立製作所 プリント板及びその製造方法
JPH0787270B2 (ja) * 1992-02-19 1995-09-20 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JPH0681172A (ja) * 1992-09-01 1994-03-22 Hitachi Cable Ltd 微細パターンの形成方法
JP2762386B2 (ja) * 1993-03-19 1998-06-04 三井金属鉱業株式会社 銅張り積層板およびプリント配線板
JPH08222857A (ja) * 1995-02-16 1996-08-30 Mitsui Mining & Smelting Co Ltd 銅箔および該銅箔を内層回路用に用いた高密度多層プリント回路基板
US6132887A (en) * 1995-06-16 2000-10-17 Gould Electronics Inc. High fatigue ductility electrodeposited copper foil
US5679230A (en) * 1995-08-21 1997-10-21 Oak-Mitsui, Inc. Copper foil for printed circuit boards
US6117300A (en) * 1996-05-01 2000-09-12 Honeywell International Inc. Method for forming conductive traces and printed circuits made thereby
US5895581A (en) * 1997-04-03 1999-04-20 J.G. Systems Inc. Laser imaging of printed circuit patterns without using phototools
US5989727A (en) * 1998-03-04 1999-11-23 Circuit Foil U.S.A., Inc. Electrolytic copper foil having a modified shiny side
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions

Also Published As

Publication number Publication date
MY156961A (en) 2016-04-15
CN1299546C (zh) 2007-02-07
KR20030044046A (ko) 2003-06-02
AU2002211790A1 (en) 2002-05-06
WO2002035897A1 (fr) 2002-05-02
CN1483303A (zh) 2004-03-17
WO2002035897A9 (fr) 2003-02-20
TW592009B (en) 2004-06-11
EP1332653A1 (fr) 2003-08-06
KR100899588B1 (ko) 2009-05-27
JP2004512698A (ja) 2004-04-22

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