CA2309630A1 - Appareil de gestion thermique a caloduc - Google Patents

Appareil de gestion thermique a caloduc Download PDF

Info

Publication number
CA2309630A1
CA2309630A1 CA002309630A CA2309630A CA2309630A1 CA 2309630 A1 CA2309630 A1 CA 2309630A1 CA 002309630 A CA002309630 A CA 002309630A CA 2309630 A CA2309630 A CA 2309630A CA 2309630 A1 CA2309630 A1 CA 2309630A1
Authority
CA
Canada
Prior art keywords
resin
thermal
resins
carbon fiber
thermal management
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002309630A
Other languages
English (en)
Inventor
James D. Miller
Kevin J. Levesque
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BP Corp North America Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2309630A1 publication Critical patent/CA2309630A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Appareil de gestion thermique qui comporte un caloduc en communication thermique avec un puits de chaleur moulé. Dans un mode de réalisation préféré, le puits de chaleur comporte un polymère à cristaux liquides ou une résine thermodurcie thermiquement conducteurs comportant une charge. De préférence, ledit appareil est formé en tant que structure d'une seule pièce par une opération de surmoulage.
CA002309630A 1997-11-13 1998-11-09 Appareil de gestion thermique a caloduc Abandoned CA2309630A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6541897P 1997-11-13 1997-11-13
US60/065,418 1997-11-13
PCT/US1998/023711 WO1999026286A1 (fr) 1997-11-13 1998-11-09 Appareil de gestion thermique a caloduc

Publications (1)

Publication Number Publication Date
CA2309630A1 true CA2309630A1 (fr) 1999-05-27

Family

ID=22062582

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002309630A Abandoned CA2309630A1 (fr) 1997-11-13 1998-11-09 Appareil de gestion thermique a caloduc

Country Status (4)

Country Link
EP (1) EP1029352A1 (fr)
JP (1) JP2001523892A (fr)
CA (1) CA2309630A1 (fr)
WO (1) WO1999026286A1 (fr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6215661B1 (en) * 1999-08-11 2001-04-10 Motorola, Inc. Heat spreader
US6585039B2 (en) * 2000-02-01 2003-07-01 Cool Options, Inc. Composite overmolded heat pipe construction
US6408935B1 (en) * 2000-08-16 2002-06-25 Thermal Corp. Heat sink assembly with over-molded cooling fins
WO2003017365A2 (fr) * 2001-08-17 2003-02-27 Honeywell International Inc. Dispositifs de transfert thermique
US6986435B2 (en) * 2001-08-23 2006-01-17 Cool Options, Inc. Self-heating food and beverage container made from a thermally conductive polymer composition
JP3834528B2 (ja) 2002-07-11 2006-10-18 ポリマテック株式会社 熱伝導性高分子成形体の製造方法
JP2004051852A (ja) 2002-07-22 2004-02-19 Polymatech Co Ltd 熱伝導性高分子成形体及びその製造方法
JP2004149722A (ja) 2002-10-31 2004-05-27 Polymatech Co Ltd 熱伝導性高分子成形体
US6976769B2 (en) 2003-06-11 2005-12-20 Cool Options, Inc. Light-emitting diode reflector assembly having a heat pipe
US7781063B2 (en) 2003-07-11 2010-08-24 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
US7033670B2 (en) 2003-07-11 2006-04-25 Siemens Power Generation, Inc. LCT-epoxy polymers with HTC-oligomers and method for making the same
WO2005034236A1 (fr) * 2003-09-29 2005-04-14 Siemens Aktiengesellschaft Corps de refroidissement a deformation plastique destine a des composants electriques et/ou electroniques
EP1766636B1 (fr) * 2004-06-15 2017-09-13 Siemens Energy, Inc. Materiaux a conductivite thermique elevee alignes avec des resines
US7553781B2 (en) 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
US8216672B2 (en) 2004-06-15 2012-07-10 Siemens Energy, Inc. Structured resin systems with high thermal conductivity fillers
US7776392B2 (en) 2005-04-15 2010-08-17 Siemens Energy, Inc. Composite insulation tape with loaded HTC materials
US8030818B2 (en) 2004-06-15 2011-10-04 Siemens Energy, Inc. Stator coil with improved heat dissipation
US20050277721A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
US20050274774A1 (en) 2004-06-15 2005-12-15 Smith James D Insulation paper with high thermal conductivity materials
JP2006113126A (ja) * 2004-10-12 2006-04-27 Sony Corp 液晶表示パネルの枠体及び液晶表示装置
US7846853B2 (en) 2005-04-15 2010-12-07 Siemens Energy, Inc. Multi-layered platelet structure
US7651963B2 (en) 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
CN101180370B (zh) * 2005-05-20 2011-12-07 住友化学株式会社 聚合物组合物和使用该聚合物组合物的高分子发光器件
US8357433B2 (en) 2005-06-14 2013-01-22 Siemens Energy, Inc. Polymer brushes
US7955661B2 (en) 2005-06-14 2011-06-07 Siemens Energy, Inc. Treatment of micropores in mica materials
US7781057B2 (en) 2005-06-14 2010-08-24 Siemens Energy, Inc. Seeding resins for enhancing the crystallinity of polymeric substructures
US7655295B2 (en) 2005-06-14 2010-02-02 Siemens Energy, Inc. Mix of grafted and non-grafted particles in a resin
JP6133012B2 (ja) * 2009-09-16 2017-05-24 株式会社カネカ 有機熱伝導性添加剤、樹脂組成物および硬化物
EP3499119A1 (fr) 2017-12-18 2019-06-19 Covestro Deutschland AG Dispositif de dissipation de la chaleur d'une source de chaleur et utilisation dudit dispositif

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US65418A (en) 1867-06-04 Improvement in boiler-feeders
JPS57145347A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor package
JPS58140593A (ja) * 1982-02-15 1983-08-20 Mitsubishi Electric Corp ヒ−トパイプ
US4888247A (en) * 1986-08-27 1989-12-19 General Electric Company Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
US4867235A (en) * 1986-10-20 1989-09-19 Westinghouse Electric Corp. Composite heat transfer means
EP0309982A3 (fr) * 1987-09-30 1990-09-12 E.I. Du Pont De Nemours And Company Plaques composite polymère-céramique
CA2000087A1 (fr) * 1988-10-03 1990-04-03 M. Lana Sheer Article manufacture
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
US5598632A (en) 1994-10-06 1997-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing micro heat panels
US5598320A (en) 1995-03-06 1997-01-28 Ast Research, Inc. Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices
US5621613A (en) 1995-05-16 1997-04-15 Intel Corporation Apparatus for dissipating heat in a hinged computing device

Also Published As

Publication number Publication date
JP2001523892A (ja) 2001-11-27
EP1029352A1 (fr) 2000-08-23
WO1999026286A1 (fr) 1999-05-27

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Legal Events

Date Code Title Description
FZDE Discontinued