JPS57145347A - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
JPS57145347A
JPS57145347A JP3030981A JP3030981A JPS57145347A JP S57145347 A JPS57145347 A JP S57145347A JP 3030981 A JP3030981 A JP 3030981A JP 3030981 A JP3030981 A JP 3030981A JP S57145347 A JPS57145347 A JP S57145347A
Authority
JP
Japan
Prior art keywords
refrigerant
substrate
heat
constitution
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3030981A
Other languages
Japanese (ja)
Inventor
Yuji Matsubara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3030981A priority Critical patent/JPS57145347A/en
Publication of JPS57145347A publication Critical patent/JPS57145347A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To increase the effect of heat radiation and prevent the production of imperfections due to ionic impurities by providing a heat sink containing a refrigerant on the main surface of a substrate on the side where a semiconductor element is not mounted. CONSTITUTION:When a heat sink 26 prepared by injecting a refrigerant 28 into a space in a metal can 27 and by sealing the same hermetically is fitted on the main surface of a substrate 29 on the opposite side to an element 21, the heat of the element 21 is cooled by the latent heat of vaporization of the refrigerant through the intermediary of the substrate 29. For the refrigerant, a liquid having the boiling point of 30-150 deg.C is suited, water is effective in particular, and alcohol or fluorocarbon is also used. By this constitution, a small-sized resin- sealed device being highly effective in radiation is obtained. In this device, the refrigerant does not contact directly with the surface of the semiconductor element and therefore aluminum wirings are not corroded by the ionic impurities contained in the refrigerant, whereby high reliability of the device is attained. This structure can be applied also to a metal case.
JP3030981A 1981-03-03 1981-03-03 Semiconductor package Pending JPS57145347A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3030981A JPS57145347A (en) 1981-03-03 1981-03-03 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3030981A JPS57145347A (en) 1981-03-03 1981-03-03 Semiconductor package

Publications (1)

Publication Number Publication Date
JPS57145347A true JPS57145347A (en) 1982-09-08

Family

ID=12300168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3030981A Pending JPS57145347A (en) 1981-03-03 1981-03-03 Semiconductor package

Country Status (1)

Country Link
JP (1) JPS57145347A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999026286A1 (en) * 1997-11-13 1999-05-27 Bp Amoco Corporation Heat pipe thermal management apparatus
KR100778913B1 (en) * 2001-05-21 2007-11-22 앰코 테크놀로지 코리아 주식회사 Semiconductor Package with Heat Spreader using Cooling Material
JP2008288456A (en) * 2007-05-18 2008-11-27 Panasonic Electric Works Co Ltd Light source device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999026286A1 (en) * 1997-11-13 1999-05-27 Bp Amoco Corporation Heat pipe thermal management apparatus
KR100778913B1 (en) * 2001-05-21 2007-11-22 앰코 테크놀로지 코리아 주식회사 Semiconductor Package with Heat Spreader using Cooling Material
JP2008288456A (en) * 2007-05-18 2008-11-27 Panasonic Electric Works Co Ltd Light source device

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