GB1295775A - - Google Patents

Info

Publication number
GB1295775A
GB1295775A GB1295775DA GB1295775A GB 1295775 A GB1295775 A GB 1295775A GB 1295775D A GB1295775D A GB 1295775DA GB 1295775 A GB1295775 A GB 1295775A
Authority
GB
United Kingdom
Prior art keywords
heat pipe
vessel
chip
april
close proximity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1295775A publication Critical patent/GB1295775A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/042—Arrangements for thermal management for solid state lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/041—Arrangements for thermal management for gas lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/0222—Gas-filled housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC

Abstract

1295775 Cooling apparatus RCA CORPORATION 1 April 1970 [1 April 1969] 15379/70 Heading F4U [Also in Division H1] A device to be cooled, e.g. a gas, liquid or crystal laser, an I.C. engine, nuclear reactors, semi-conductor pellets, or chips for dicde junction lasers, silicon rectifiers or transistors, has an external surface forming at least a portion of a wall of a heat pipe, the working fluid in which is in direct contact with the surface by means of the capillary material of the heat pipe which is disposed either in contact with or in close proximity to the surface. As shown, a semiconductor chip 16 with a single P-N junction closes a discontinuity in the envelope portion 14 of a hermetically sealed, self-contained heat pipe vessel 12 of heat conducting material, e.g. copper. The surface 18 of the chip is bonded to the vessel 12 and has the capillary structure 20 of the heat pipe disposed in close proximity thereto so as to retain at least a portion of the vapourizable working medium, e.g. acetone, freon or water, in direct contact with the surface 18 for cooling purposes. Sealing means 30 which may include an hermetically sealed region 38 protects the exposed portion of the chip 16 and comprises metal portions 32, 36 separated by insulation 34. Cooling fins 46 are attached to the vessel 12. In a modification a single electrical device (52), Fig. 3, is mounted between two heat pipes and in a further embodiment a laser (106), Fig. 5, is centrally mounted within a heat pipe.
GB1295775D 1969-04-01 1970-04-01 Expired GB1295775A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81206469A 1969-04-01 1969-04-01

Publications (1)

Publication Number Publication Date
GB1295775A true GB1295775A (en) 1972-11-08

Family

ID=25208380

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1295775D Expired GB1295775A (en) 1969-04-01 1970-04-01

Country Status (5)

Country Link
JP (1) JPS4822017B1 (en)
CA (1) CA926033A (en)
DE (1) DE2015518A1 (en)
FR (1) FR2042243A5 (en)
GB (1) GB1295775A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003107440A2 (en) * 2002-06-13 2003-12-24 Enfis, Limited Opteolectronic devices
EP1523041A1 (en) * 2004-12-08 2005-04-13 Jeffrey Chen Light emitting diode assembly having high-performance heat dissipation means
CN106701314A (en) * 2017-02-17 2017-05-24 无锡市新耀生物工程技术有限公司 Fish oil winterizing, fractioning, crystallizing and growing reaction tank
RU2796324C1 (en) * 2023-02-03 2023-05-22 Василий Васильевич Лещенко Power semiconductor housing

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CS159563B1 (en) * 1972-12-28 1975-01-31
JPS5518279Y2 (en) * 1975-08-28 1980-04-26
DE2737345C2 (en) * 1976-08-20 1991-07-25 Canon K.K., Tokio/Tokyo Semiconductor laser device with a Peltier element
DE3642723A1 (en) * 1986-12-13 1988-06-23 Grundfos Int STATIC FREQUENCY INVERTER, ESPECIALLY FREQUENCY INVERTER FOR CONTROLLING AND / OR REGULATING THE PERFORMANCE SIZE OF AN ELECTRIC MOTOR
DE19814896A1 (en) * 1998-04-02 1999-07-08 Vacuumschmelze Gmbh Electrical power transformer for high current of at least 1 kHz
DE19814897C2 (en) * 1998-04-02 2000-09-21 Vacuumschmelze Gmbh Inductive component for high performance

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003107440A2 (en) * 2002-06-13 2003-12-24 Enfis, Limited Opteolectronic devices
WO2003107440A3 (en) * 2002-06-13 2004-08-05 Enfis Ltd Opteolectronic devices
EP1523041A1 (en) * 2004-12-08 2005-04-13 Jeffrey Chen Light emitting diode assembly having high-performance heat dissipation means
CN106701314A (en) * 2017-02-17 2017-05-24 无锡市新耀生物工程技术有限公司 Fish oil winterizing, fractioning, crystallizing and growing reaction tank
CN106701314B (en) * 2017-02-17 2023-10-27 无锡市新耀生物工程技术有限公司 Crystal growing reaction tank for winterization, fractionation and crystallization of fish oil
RU2796324C1 (en) * 2023-02-03 2023-05-22 Василий Васильевич Лещенко Power semiconductor housing

Also Published As

Publication number Publication date
DE2015518A1 (en) 1970-10-15
CA926033A (en) 1973-05-08
JPS4822017B1 (en) 1973-07-03
FR2042243A5 (en) 1971-02-05

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee