WO1999026286A1 - Appareil de gestion thermique a caloduc - Google Patents

Appareil de gestion thermique a caloduc Download PDF

Info

Publication number
WO1999026286A1
WO1999026286A1 PCT/US1998/023711 US9823711W WO9926286A1 WO 1999026286 A1 WO1999026286 A1 WO 1999026286A1 US 9823711 W US9823711 W US 9823711W WO 9926286 A1 WO9926286 A1 WO 9926286A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
thermal
carbon fiber
heat sink
thermal management
Prior art date
Application number
PCT/US1998/023711
Other languages
English (en)
Inventor
Kevin J. Levesque
James D. Miller
Original Assignee
Bp Amoco Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bp Amoco Corporation filed Critical Bp Amoco Corporation
Priority to JP2000521547A priority Critical patent/JP2001523892A/ja
Priority to CA002309630A priority patent/CA2309630A1/fr
Priority to EP98957652A priority patent/EP1029352A1/fr
Publication of WO1999026286A1 publication Critical patent/WO1999026286A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Appareil de gestion thermique qui comporte un caloduc en communication thermique avec un puits de chaleur moulé. Dans un mode de réalisation préféré, le puits de chaleur comporte un polymère à cristaux liquides ou une résine thermodurcie thermiquement conducteurs comportant une charge. De préférence, ledit appareil est formé en tant que structure d'une seule pièce par une opération de surmoulage.
PCT/US1998/023711 1997-11-13 1998-11-09 Appareil de gestion thermique a caloduc WO1999026286A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000521547A JP2001523892A (ja) 1997-11-13 1998-11-09 熱管理デバイス
CA002309630A CA2309630A1 (fr) 1997-11-13 1998-11-09 Appareil de gestion thermique a caloduc
EP98957652A EP1029352A1 (fr) 1997-11-13 1998-11-09 Appareil de gestion thermique a caloduc

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US6541897P 1997-11-13 1997-11-13
US60/065,418 1997-11-13

Publications (1)

Publication Number Publication Date
WO1999026286A1 true WO1999026286A1 (fr) 1999-05-27

Family

ID=22062582

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/023711 WO1999026286A1 (fr) 1997-11-13 1998-11-09 Appareil de gestion thermique a caloduc

Country Status (4)

Country Link
EP (1) EP1029352A1 (fr)
JP (1) JP2001523892A (fr)
CA (1) CA2309630A1 (fr)
WO (1) WO1999026286A1 (fr)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2797556A1 (fr) * 1999-08-11 2001-02-16 Motorola Inc Dissipateur de chaleur et boitier electronique l'utilisant
US6408935B1 (en) * 2000-08-16 2002-06-25 Thermal Corp. Heat sink assembly with over-molded cooling fins
WO2003017365A2 (fr) * 2001-08-17 2003-02-27 Honeywell International Inc. Dispositifs de transfert thermique
US6585039B2 (en) * 2000-02-01 2003-07-01 Cool Options, Inc. Composite overmolded heat pipe construction
EP1416031A1 (fr) * 2002-10-31 2004-05-06 Polymatech Co., Ltd. Articles moulés polymériques conducteurs de la chaleur
WO2005034236A1 (fr) * 2003-09-29 2005-04-14 Siemens Aktiengesellschaft Corps de refroidissement a deformation plastique destine a des composants electriques et/ou electroniques
US6976769B2 (en) 2003-06-11 2005-12-20 Cool Options, Inc. Light-emitting diode reflector assembly having a heat pipe
WO2005124790A2 (fr) * 2004-06-15 2005-12-29 Siemens Power Generation, Inc. Materiaux a conductivite thermique elevee alignes avec des resines
US6986435B2 (en) * 2001-08-23 2006-01-17 Cool Options, Inc. Self-heating food and beverage container made from a thermally conductive polymer composition
WO2006007385A1 (fr) * 2004-06-15 2006-01-19 Siemens Power Generation, Inc. Systemes a base de resine structuree comportant des charges thermoconductrices
EP1894976A4 (fr) * 2005-05-20 2009-05-06 Sumitomo Chemical Co Composition polymerique et dispositif polymerique electroluminescent l'utilisant
US7651963B2 (en) 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
US7655295B2 (en) 2005-06-14 2010-02-02 Siemens Energy, Inc. Mix of grafted and non-grafted particles in a resin
US7776392B2 (en) 2005-04-15 2010-08-17 Siemens Energy, Inc. Composite insulation tape with loaded HTC materials
US7781057B2 (en) 2005-06-14 2010-08-24 Siemens Energy, Inc. Seeding resins for enhancing the crystallinity of polymeric substructures
US7837817B2 (en) 2004-06-15 2010-11-23 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
US7846853B2 (en) 2005-04-15 2010-12-07 Siemens Energy, Inc. Multi-layered platelet structure
US7955661B2 (en) 2005-06-14 2011-06-07 Siemens Energy, Inc. Treatment of micropores in mica materials
US8030818B2 (en) 2004-06-15 2011-10-04 Siemens Energy, Inc. Stator coil with improved heat dissipation
US8039530B2 (en) 2003-07-11 2011-10-18 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
US8216672B2 (en) 2004-06-15 2012-07-10 Siemens Energy, Inc. Structured resin systems with high thermal conductivity fillers
US8313832B2 (en) 2004-06-15 2012-11-20 Siemens Energy, Inc. Insulation paper with high thermal conductivity materials
US8357433B2 (en) 2005-06-14 2013-01-22 Siemens Energy, Inc. Polymer brushes
US8685534B2 (en) 2004-06-15 2014-04-01 Siemens Energy, Inc. High thermal conductivity materials aligned within resins
US20150025188A1 (en) * 2009-09-16 2015-01-22 Kaneka Corporation Thermally-conductive organic additive, resin composition, and cured product
WO2019121197A1 (fr) * 2017-12-18 2019-06-27 Covestro Deutschland Ag Dispositif de dissipation de chaleur provenant d'une source de chaleur et utilisation dudit dispositif

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3834528B2 (ja) 2002-07-11 2006-10-18 ポリマテック株式会社 熱伝導性高分子成形体の製造方法
JP2004051852A (ja) 2002-07-22 2004-02-19 Polymatech Co Ltd 熱伝導性高分子成形体及びその製造方法
JP2006113126A (ja) * 2004-10-12 2006-04-27 Sony Corp 液晶表示パネルの枠体及び液晶表示装置

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US65418A (en) 1867-06-04 Improvement in boiler-feeders
JPS57145347A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor package
JPS58140593A (ja) * 1982-02-15 1983-08-20 Mitsubishi Electric Corp ヒ−トパイプ
EP0257466A2 (fr) * 1986-08-27 1988-03-02 General Electric Company Laminés conducteurs de chaleur, à faible dilatation thermique, comportant des couches de métal et de matière plastique renforcée
EP0309982A2 (fr) * 1987-09-30 1989-04-05 E.I. Du Pont De Nemours And Company Plaques composite polymère-céramique
US4867235A (en) * 1986-10-20 1989-09-19 Westinghouse Electric Corp. Composite heat transfer means
EP0375851A2 (fr) * 1988-10-03 1990-07-04 E.I. Du Pont De Nemours And Company Dispositif électrique ou électronique encapsulé
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
US5598320A (en) 1995-03-06 1997-01-28 Ast Research, Inc. Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices
US5598632A (en) 1994-10-06 1997-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing micro heat panels
US5621613A (en) 1995-05-16 1997-04-15 Intel Corporation Apparatus for dissipating heat in a hinged computing device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US65418A (en) 1867-06-04 Improvement in boiler-feeders
JPS57145347A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor package
JPS58140593A (ja) * 1982-02-15 1983-08-20 Mitsubishi Electric Corp ヒ−トパイプ
EP0257466A2 (fr) * 1986-08-27 1988-03-02 General Electric Company Laminés conducteurs de chaleur, à faible dilatation thermique, comportant des couches de métal et de matière plastique renforcée
US4867235A (en) * 1986-10-20 1989-09-19 Westinghouse Electric Corp. Composite heat transfer means
EP0309982A2 (fr) * 1987-09-30 1989-04-05 E.I. Du Pont De Nemours And Company Plaques composite polymère-céramique
EP0375851A2 (fr) * 1988-10-03 1990-07-04 E.I. Du Pont De Nemours And Company Dispositif électrique ou électronique encapsulé
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
US5598632A (en) 1994-10-06 1997-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing micro heat panels
US5598320A (en) 1995-03-06 1997-01-28 Ast Research, Inc. Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices
US5621613A (en) 1995-05-16 1997-04-15 Intel Corporation Apparatus for dissipating heat in a hinged computing device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 006, no. 247 (E - 146) 7 December 1982 (1982-12-07) *
PATENT ABSTRACTS OF JAPAN vol. 007, no. 257 (M - 256) 16 November 1983 (1983-11-16) *

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2797556A1 (fr) * 1999-08-11 2001-02-16 Motorola Inc Dissipateur de chaleur et boitier electronique l'utilisant
US6585039B2 (en) * 2000-02-01 2003-07-01 Cool Options, Inc. Composite overmolded heat pipe construction
US6408935B1 (en) * 2000-08-16 2002-06-25 Thermal Corp. Heat sink assembly with over-molded cooling fins
WO2003017365A2 (fr) * 2001-08-17 2003-02-27 Honeywell International Inc. Dispositifs de transfert thermique
WO2003017365A3 (fr) * 2001-08-17 2003-09-04 Honeywell Int Inc Dispositifs de transfert thermique
US6986435B2 (en) * 2001-08-23 2006-01-17 Cool Options, Inc. Self-heating food and beverage container made from a thermally conductive polymer composition
EP1416031A1 (fr) * 2002-10-31 2004-05-06 Polymatech Co., Ltd. Articles moulés polymériques conducteurs de la chaleur
US6976769B2 (en) 2003-06-11 2005-12-20 Cool Options, Inc. Light-emitting diode reflector assembly having a heat pipe
US7781063B2 (en) 2003-07-11 2010-08-24 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
US8039530B2 (en) 2003-07-11 2011-10-18 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
WO2005034236A1 (fr) * 2003-09-29 2005-04-14 Siemens Aktiengesellschaft Corps de refroidissement a deformation plastique destine a des composants electriques et/ou electroniques
WO2006007385A1 (fr) * 2004-06-15 2006-01-19 Siemens Power Generation, Inc. Systemes a base de resine structuree comportant des charges thermoconductrices
US8685534B2 (en) 2004-06-15 2014-04-01 Siemens Energy, Inc. High thermal conductivity materials aligned within resins
US8313832B2 (en) 2004-06-15 2012-11-20 Siemens Energy, Inc. Insulation paper with high thermal conductivity materials
WO2005124790A3 (fr) * 2004-06-15 2006-02-02 Siemens Power Generation Inc Materiaux a conductivite thermique elevee alignes avec des resines
WO2005124790A2 (fr) * 2004-06-15 2005-12-29 Siemens Power Generation, Inc. Materiaux a conductivite thermique elevee alignes avec des resines
US7837817B2 (en) 2004-06-15 2010-11-23 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
US8216672B2 (en) 2004-06-15 2012-07-10 Siemens Energy, Inc. Structured resin systems with high thermal conductivity fillers
US8030818B2 (en) 2004-06-15 2011-10-04 Siemens Energy, Inc. Stator coil with improved heat dissipation
US7651963B2 (en) 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
US7776392B2 (en) 2005-04-15 2010-08-17 Siemens Energy, Inc. Composite insulation tape with loaded HTC materials
US8277613B2 (en) 2005-04-15 2012-10-02 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
US7846853B2 (en) 2005-04-15 2010-12-07 Siemens Energy, Inc. Multi-layered platelet structure
EP2236561A1 (fr) * 2005-05-20 2010-10-06 Sumitomo Chemical Company, Limited Composition polymerique et dispositif polymerique electroluminescent l'utilisant
EP2960299A1 (fr) * 2005-05-20 2015-12-30 Sumitomo Chemical Co., Ltd. Composition de polymère et dispositif électroluminescent polymère utilisant celle-ci
EP1894976A4 (fr) * 2005-05-20 2009-05-06 Sumitomo Chemical Co Composition polymerique et dispositif polymerique electroluminescent l'utilisant
US9045613B2 (en) 2005-05-20 2015-06-02 Sumitomo Chemical Company, Limited Polymer composition and polymer light-emitting device using same
US7781057B2 (en) 2005-06-14 2010-08-24 Siemens Energy, Inc. Seeding resins for enhancing the crystallinity of polymeric substructures
US7655295B2 (en) 2005-06-14 2010-02-02 Siemens Energy, Inc. Mix of grafted and non-grafted particles in a resin
US8357433B2 (en) 2005-06-14 2013-01-22 Siemens Energy, Inc. Polymer brushes
US8383007B2 (en) 2005-06-14 2013-02-26 Siemens Energy, Inc. Seeding resins for enhancing the crystallinity of polymeric substructures
US7955661B2 (en) 2005-06-14 2011-06-07 Siemens Energy, Inc. Treatment of micropores in mica materials
US20150025188A1 (en) * 2009-09-16 2015-01-22 Kaneka Corporation Thermally-conductive organic additive, resin composition, and cured product
US9234095B2 (en) * 2009-09-16 2016-01-12 Kaneka Corporation Thermally-conductive organic additive, resin composition, and cured product
WO2019121197A1 (fr) * 2017-12-18 2019-06-27 Covestro Deutschland Ag Dispositif de dissipation de chaleur provenant d'une source de chaleur et utilisation dudit dispositif
CN111465804A (zh) * 2017-12-18 2020-07-28 科思创德国股份有限公司 用于热源散热的装置以及所述装置的用途
US11085629B2 (en) 2017-12-18 2021-08-10 Covestro Deutschland Ag Device for dissipating heat from a heat source, and use thereof
CN111465804B (zh) * 2017-12-18 2023-04-04 科思创德国股份有限公司 用于热源散热的装置以及所述装置的用途

Also Published As

Publication number Publication date
CA2309630A1 (fr) 1999-05-27
JP2001523892A (ja) 2001-11-27
EP1029352A1 (fr) 2000-08-23

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