JP2001523892A - 熱管理デバイス - Google Patents

熱管理デバイス

Info

Publication number
JP2001523892A
JP2001523892A JP2000521547A JP2000521547A JP2001523892A JP 2001523892 A JP2001523892 A JP 2001523892A JP 2000521547 A JP2000521547 A JP 2000521547A JP 2000521547 A JP2000521547 A JP 2000521547A JP 2001523892 A JP2001523892 A JP 2001523892A
Authority
JP
Japan
Prior art keywords
resin
thermal
heat sink
management device
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000521547A
Other languages
English (en)
Japanese (ja)
Inventor
レブスク，ケビン・ジェイ
ミラー，ジェームズ・ディー
Original Assignee
ビーピー・アモコ・コーポレーション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ビーピー・アモコ・コーポレーション filed Critical ビーピー・アモコ・コーポレーション
Publication of JP2001523892A publication Critical patent/JP2001523892A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2000521547A 1997-11-13 1998-11-09 熱管理デバイス Pending JP2001523892A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6541897P 1997-11-13 1997-11-13
US60/065,418 1997-11-13
PCT/US1998/023711 WO1999026286A1 (fr) 1997-11-13 1998-11-09 Appareil de gestion thermique a caloduc

Publications (1)

Publication Number Publication Date
JP2001523892A true JP2001523892A (ja) 2001-11-27

Family

ID=22062582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000521547A Pending JP2001523892A (ja) 1997-11-13 1998-11-09 熱管理デバイス

Country Status (4)

Country Link
EP (1) EP1029352A1 (fr)
JP (1) JP2001523892A (fr)
CA (1) CA2309630A1 (fr)
WO (1) WO1999026286A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1384567A1 (fr) 2002-07-22 2004-01-28 Polymatech Co., Ltd. Objet moulé en polymère thermiquement conductif et procédé pour le fabriquer
EP1416031A1 (fr) * 2002-10-31 2004-05-06 Polymatech Co., Ltd. Articles moulés polymériques conducteurs de la chaleur
JP2006113126A (ja) * 2004-10-12 2006-04-27 Sony Corp 液晶表示パネルの枠体及び液晶表示装置
US7079405B2 (en) 2002-07-11 2006-07-18 Polymatech Co., Ltd. Thermal conductive polymer molded article and method for producing the same
JP2021507466A (ja) * 2017-12-18 2021-02-22 コベストロ、ドイチュラント、アクチエンゲゼルシャフトＣｏｖｅｓｔｒｏ Ｄｅｕｔｓｃｈｌａｎｄ Ａｇ 熱源からの熱を放散するためのデバイス、および前記デバイスの使用

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6215661B1 (en) * 1999-08-11 2001-04-10 Motorola, Inc. Heat spreader
US6585039B2 (en) * 2000-02-01 2003-07-01 Cool Options, Inc. Composite overmolded heat pipe construction
US6408935B1 (en) * 2000-08-16 2002-06-25 Thermal Corp. Heat sink assembly with over-molded cooling fins
AU2001285013A1 (en) * 2001-08-17 2003-03-03 Honeywell International Inc. Thermal transfer devices using heat pipes
US6986435B2 (en) * 2001-08-23 2006-01-17 Cool Options, Inc. Self-heating food and beverage container made from a thermally conductive polymer composition
US6976769B2 (en) 2003-06-11 2005-12-20 Cool Options, Inc. Light-emitting diode reflector assembly having a heat pipe
US7033670B2 (en) 2003-07-11 2006-04-25 Siemens Power Generation, Inc. LCT-epoxy polymers with HTC-oligomers and method for making the same
US7781063B2 (en) * 2003-07-11 2010-08-24 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
EP1668698A1 (fr) * 2003-09-29 2006-06-14 Siemens Aktiengesellschaft Corps de refroidissement a deformation plastique destine a des composants electriques et/ou electroniques
KR101207775B1 (ko) * 2004-06-15 2012-12-04 지멘스 에너지, 인코포레이티드 수지들 내에 배열되는 고열전도성 물질들
US7553781B2 (en) 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
US8216672B2 (en) 2004-06-15 2012-07-10 Siemens Energy, Inc. Structured resin systems with high thermal conductivity fillers
US20050274774A1 (en) 2004-06-15 2005-12-15 Smith James D Insulation paper with high thermal conductivity materials
US7776392B2 (en) 2005-04-15 2010-08-17 Siemens Energy, Inc. Composite insulation tape with loaded HTC materials
US20050277721A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
US8030818B2 (en) 2004-06-15 2011-10-04 Siemens Energy, Inc. Stator coil with improved heat dissipation
US7846853B2 (en) 2005-04-15 2010-12-07 Siemens Energy, Inc. Multi-layered platelet structure
US7651963B2 (en) 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
KR101277916B1 (ko) 2005-05-20 2013-06-21 스미또모 가가꾸 가부시키가이샤 중합체 조성물 및 그것을 이용한 고분자 발광 소자
US7955661B2 (en) 2005-06-14 2011-06-07 Siemens Energy, Inc. Treatment of micropores in mica materials
US7655295B2 (en) 2005-06-14 2010-02-02 Siemens Energy, Inc. Mix of grafted and non-grafted particles in a resin
US7781057B2 (en) 2005-06-14 2010-08-24 Siemens Energy, Inc. Seeding resins for enhancing the crystallinity of polymeric substructures
US8357433B2 (en) 2005-06-14 2013-01-22 Siemens Energy, Inc. Polymer brushes
WO2011033815A1 (fr) * 2009-09-16 2011-03-24 株式会社カネカ Additif organique thermiquement conducteur, composition de résine et produit durci

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US65418A (en) 1867-06-04 Improvement in boiler-feeders
JPS57145347A (en) * 1981-03-03 1982-09-08 Nec Corp Semiconductor package
JPS58140593A (ja) * 1982-02-15 1983-08-20 Mitsubishi Electric Corp ヒ−トパイプ
US4888247A (en) * 1986-08-27 1989-12-19 General Electric Company Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
US4867235A (en) * 1986-10-20 1989-09-19 Westinghouse Electric Corp. Composite heat transfer means
EP0309982A3 (fr) * 1987-09-30 1990-09-12 E.I. Du Pont De Nemours And Company Plaques composite polymère-céramique
CA2000087A1 (fr) * 1988-10-03 1990-04-03 M. Lana Sheer Article manufacture
US5349237A (en) * 1992-03-20 1994-09-20 Vlsi Technology, Inc. Integrated circuit package including a heat pipe
US5598632A (en) 1994-10-06 1997-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing micro heat panels
US5598320A (en) 1995-03-06 1997-01-28 Ast Research, Inc. Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices
US5621613A (en) 1995-05-16 1997-04-15 Intel Corporation Apparatus for dissipating heat in a hinged computing device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7079405B2 (en) 2002-07-11 2006-07-18 Polymatech Co., Ltd. Thermal conductive polymer molded article and method for producing the same
EP1384567A1 (fr) 2002-07-22 2004-01-28 Polymatech Co., Ltd. Objet moulé en polymère thermiquement conductif et procédé pour le fabriquer
US7189778B2 (en) 2002-07-22 2007-03-13 Polymatech Co., Ltd. Thermally conductive polymer molded article and method for producing the same
EP1416031A1 (fr) * 2002-10-31 2004-05-06 Polymatech Co., Ltd. Articles moulés polymériques conducteurs de la chaleur
US7347955B2 (en) 2002-10-31 2008-03-25 Polymatech Co., Ltd. Heat conducting polymer mold products
JP2006113126A (ja) * 2004-10-12 2006-04-27 Sony Corp 液晶表示パネルの枠体及び液晶表示装置
JP2021507466A (ja) * 2017-12-18 2021-02-22 コベストロ、ドイチュラント、アクチエンゲゼルシャフトＣｏｖｅｓｔｒｏ Ｄｅｕｔｓｃｈｌａｎｄ Ａｇ 熱源からの熱を放散するためのデバイス、および前記デバイスの使用

Also Published As

Publication number Publication date
EP1029352A1 (fr) 2000-08-23
WO1999026286A1 (fr) 1999-05-27
CA2309630A1 (fr) 1999-05-27

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