EP1668698A1 - Corps de refroidissement a deformation plastique destine a des composants electriques et/ou electroniques - Google Patents

Corps de refroidissement a deformation plastique destine a des composants electriques et/ou electroniques

Info

Publication number
EP1668698A1
EP1668698A1 EP04766823A EP04766823A EP1668698A1 EP 1668698 A1 EP1668698 A1 EP 1668698A1 EP 04766823 A EP04766823 A EP 04766823A EP 04766823 A EP04766823 A EP 04766823A EP 1668698 A1 EP1668698 A1 EP 1668698A1
Authority
EP
European Patent Office
Prior art keywords
heat sink
sink according
heat
thermally
deformable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04766823A
Other languages
German (de)
English (en)
Inventor
Wolfgang Von Gentzkow
Dieter Heinl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1668698A1 publication Critical patent/EP1668698A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate

Definitions

  • the invention relates to a heat sink for electrical and / or electronic components, in particular printed circuit boards, which is deformable.
  • heat sinks There are several heat sinks known which are attached to the circuit board or individual components for cooling 0 printed circuit boards and which generally comprise aluminum as a light and very thermally conductive material. These elements are known internationally under the name “heat sinks for thermal management in electronics” .5 The problem with these heat sinks is that they are mainly mounted on the circuit board and the heat released in the components must be dissipated via the poorly heat-conductive circuit board.
  • deformable heat sinks are now known from documents DE 197 04 549 AI and DE 196 24 475 AI. Although these heat sinks offer considerable advantages over the known rigid heat sinks, they also have a considerable disadvantage that they are constructed in several pieces, that is to say they have at least two materials, an outer material and a filling. This multiple structure of the materials on the one hand creates a barrier in the heat dissipation of the heat sink and on the other hand a higher manufacturing effort.
  • the invention relates to a heat sink for electrical and / or electronic components, which is deformable, characterized in that it can be produced using only one material, the material being present in several modifications in the finished heat sink.
  • Such a heat sink is solid but plastically deformable. It consists of a UV-curable reaction resin that contains thermally conductive fillers. The surface of this heat sink is hardened or hardened by UV radiation. This creates a skin that, depending on the curing conditions, can be low-tack to non-tacky and enables problem-free handling of the heat sink.
  • Such a heat sink is technically uniform, although it is grip-resistant on the outside and plastically and / or elastically deformable on the inside.
  • a heat sink with a stable outer skin can be produced, which is in the form of an attenuator and which, on the inside, comprises non-crosslinked heat-conducting material.
  • the heat sink in its partially cross-linked form is sticky on the surface and can therefore be applied to the component in a self-adhesive and deformable manner.
  • the invention is implemented by a reaction resin which is highly filled with thermally conductive fillers and which comprises a mixture of photoinitiators and thermally excitable cationic polymerization initiators. After shaping, this is crosslinked externally by radiation, so that it is stable on the outside but deformable on the inside.
  • UV radiation penetrates through some fillers and can also harden through highly filled materials, it was found that the radiation only causes external crosslinking because it does not penetrate due to the high filler content of the reactive resin the inside of the body penetrates.
  • the grip-resistant and deformable, possibly also self-adhesive, multi-layer structure is therefore made of one material, but includes different states or modifications of this material.
  • reaction resin for example epoxy resins and / or acrylate resins or mixtures of these resins can be used.
  • the resin system is advantageously based on cationically hardenable epoxy resin systems. UV and thermally hardenable one-component 200314931
  • Epoxy resin systems for use.
  • the epoxy resin systems can contain vinyl ethers and / or polyols, which in particular promote their thermal curing.
  • the epoxy resin systems also contain thermally conductive fillers as well as initiators and catalysts for UV and thermally initiated cationic polymerisation and possibly common additives such as e.g. Dyes, pigments, stabilizers, thixotropic agents, flexibilizers, wetting agents, adhesion promoters and processing aids.
  • Linear aliphatic epoxides with cycloalkylene structure such as epoxidized olefins, diolefins and / or polyolefins, aromatic, aliphatic and cycloaliphatic di- or polyglycidyl ethers are suitable as epoxy compounds.
  • epoxy resins with cycloalkylene oxide structures are bis (2,3-epoxycyclopentyl) ether, 2,3-epoxycyclopentyl glycidyl ether, 1,2-bis (2,3-epoxycyclopentyl) ethane, vinylcyclohexene dioxide, 3,4- epoxycyclohexylmethyl-3 ⁇ , ⁇ 4 -epoxycyclo- hexan-carboxylate, 3, 4-epoxy-6-methylcyclohexylmethyl-3, 4 '- epoxy-6-methyl-cyclohexane carboxylate, bis (3, 4-epoxycyclo- hexylmethyl) adipate, and Bis (3,4-epoxy- ⁇ -methylcyclohexylmethyl) adipate.
  • aromatic di- or polyglycidyl ethers used are bisphenol F diglycidyl ether and bisphenol A diglycidyl ether.
  • Cycloaliphatic glycidyl compounds and ⁇ -methylglycidyl compounds are used as aliphatic di- or polyglycidyl ethers. These are glycidyl esters and ⁇ -methyl glycidyl esters of cycloaliphatic polycarboxylic acids such as tetrahydrophthalic acid, 4-methyl-tetrahydrophthalic acid, hexahydrophthalic acid, 3-methyl-hexahydrophthalic acid and 4-methylhexahydrophthalic acid.
  • Suitable cycloaliphatic epoxy resins are the diglycidyl ether and ⁇ -methyl-glycidyl ether of cycloaliphatic alcohols, such as 1,2-diglycidyl ether of 1,3-dihydroxycyclo-hexane and 1,4-dihydroxycyclohexane, 1,4-cyclohexanedimethanol, 1,1- Bis (hydroxy-methyl) cyclohex-3-ene, bis (4-hydroxycyclo-hexyl) methane, 2,2-bis (4-hydroxycyclohexyl) propane and bis (4-hydroxy-cyclohexyl) sulfone.
  • 1,2-diglycidyl ether of 1,3-dihydroxycyclo-hexane and 1,4-dihydroxycyclohexane 1,4-cyclohexanedimethanol
  • 1,1- Bis (hydroxy-methyl) cyclohex-3-ene bis (4-hydroxycyclo-hexyl) methane
  • Preferred cycloaliphatic epoxy resins are bis (4-hydroxycyclohexyl) methane diglycidyl ether, 2, 2-bis (4-hydroxycyclohexyl) propane diglycidyl ether, tetrahydrophthalic acid diglycidyl ester, 4-methyltetrahydrophthalic acid diglycidyl ester, 4-methyl-hexoxy-methylahydylcidyl ester, 4-methyl-hexoxy-methyl-hexahydyl-3-methyl-hexahydroxyl 3 ⁇ - epoxycyclohexane carboxylate and especially hexahydrophthalic acid diglycidyl ester.
  • the cycloaliphatic epoxy resins can also be used in combination with aliphatic epoxy resins.
  • Epoxidation products of unsaturated fatty acid esters can be used as "aliphatic epoxy resins".
  • vinyl ether-functionalized hydroxyl compounds are suitable as vinyl ether-functional compounds.
  • Suitable compounds are in particular cyclohexanedi- methyldivinyl ether, triethylene glycol dininyl ether, butanediol divinyl ether, bis (4-vinyloxybutyl) isophthalate, bis (4-vinyloxybutyl) succinate, bis (4-vinyloxymethylcyclohexylmethyl) glutarate, and hydroxybutylmonovinyl ether or vinyl ether-functionalized hydroxypurylated aliphatic polyether.
  • Vinyl ethers with> 2 vinyl ether groups per molecule are preferred.
  • polystyrene resin Compounds which are obtained by reaction of epoxy compounds with alcohols or phenols are preferably used as the polyol component.
  • polyvalent aliphatic or cycloaliphatic alcohols such as e.g. Glycols
  • trifunctional or tetrafunctional alcohols such as e.g. Trimethylolpropane or ethers of glycols with phenols or bisphenols as well as polymer polyols are used.
  • a mixture of UV-reactive and thermally reactive components is preferably used to initiate the cationic curing.
  • a cationic photoinitiator or a cationic photoinitiator system is used to initiate cationic curing. Its share in the total epoxy resin system can be 0.1 to 5%, advantageously 1 to 3%.
  • these photoinitiators release reactive cations, eg protons, which initiate the cationic curing process of the epoxy resin.
  • the photoinitiators are derived from stable organic onium salts, in particular with nitrogen, phosphorus, oxygen, sulfur, selenium or iodine as the central atom of the cation.
  • Aromatic sulfonium and iodonium salts with complex anions have proven to be particularly advantageous.
  • a photoinitiator releasing a Lewis acid is also possible.
  • Phenacylsulfonium salts, hydroxylphenylsulfonium salts and sulfonium salts are also to be mentioned.
  • Onium salts can also be used, which are not stimulated directly but via a sensitizer to form acids.
  • Organic silicon compounds that are exposed to UV radiation in the presence of organoaluminum compounds bonds release a silanol can be used.
  • Thiolanium salts such as those described in DE 197 50 147 are used as latent thermal initiators for cationic polymerisation.
  • Unsubstituted benzylthiolanium salts are preferably used, in particular benzylthiolanium hexafluoroantimonate.
  • So-called dual-cure catalysts can also be used. These initiate the curing of epoxy resins both when irradiated with UV light and thermally. When irradiated at room temperature, no hardening takes place in shaded areas. However, curing can take place in a subsequent process by increasing the temperature.
  • the curing temperatures are generally between 80 and 150 ° C.
  • UV sources such as xenon, tungsten, mercury and metal halide emitters, can be used for UV radiation.
  • the use of UV lasers is also possible.
  • Metal oxides such as silicon oxide, aluminum oxide, boron nitride, tungsten oxide, titanium oxide, metal nitrides such as aluminum nitride or metals are suitable as heat-conductive fillers.
  • the fillers can be in the form of multimodal mixtures of finely divided powders of spherical, splintery, flaky and / or needle-shaped powder particles.
  • the heat-conductive fillers come in concentrations of 40 to 80 vol.%, Advantageously in concentrations of 60 to 70 vol. - % for use.
  • An epoxy resin filled with thermally conductive material and photoinitiator is rolled on a roller mill between 2 waxed carrier foils to form an approx. 3 mm thick layer.
  • Mats or pillows adapted to the area to be cooled are largely cut or punched out of this layer and surface-crosslinked at room temperature by UV radiation. This creates a grip-resistant, not or only "self-adhesive" sticky multi-layer structure. Since there is no crosslinking due to the high proportion of filler inside the mat, the mat is plastically and / or elastically deformable thanks to the material that is still not crosslinked on the inside, but is uniform in terms of material technology.
  • the material can be adjusted so that when the mat is used for heat removal, it is slowly cross-linked and / or that additional heating of the mat through thermal cross-linking results in a stable, contour-conforming shape after the cooling body has been applied. This is an advantage with regard to maintenance and repair work because the cross-linked heat sink then stabilizes the topography of the components and if necessary, e.g. can be removed without residue for repair purposes.
  • the invention relates to a heat sink for electrical and / or electronic components and printed circuit boards, characterized in that it is produced using a chemically uniform material which is highly filled with thermally conductive fillers and is based on UV and thermally curable reactive resins UV curing maintains a low-tack to tack-free surface and is therefore easy and easy to handle, the inside consists of uncrosslinked, thermally curable material and is therefore flexible and deformable, and can be adapted to different topographies and - can also be thermally hardened on the inside if heat is applied.
  • the invention discloses a heat sink for electrical and / or electronic components, in particular flat assemblies.
  • the heat sink consists of a chemically uniform material that is cross-linked on the outside and is therefore low-tack or tack-free and plastically deformable on the inside and can therefore be adapted to the contour of the structural elements or printed circuit boards to be cooled.
  • the heat sink can be hardened through thermal post-crosslinking.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un corps de refroidissement destiné à des composants électriques et/ou électroniques, en particulier à des circuits imprimés. Le corps de refroidissement est fait d'un matériau chimiquement unitaire qui est réticulé sur l'extérieur et peut de ce fait subir une déformation plastique interne avec une adhérence nulle ou faible, ce qui lui permet de s'adapter aux contours des composants ou circuits imprimés à refroidir. Le corps de refroidissement peut être durci par post-réticulation thermique.
EP04766823A 2003-09-29 2004-09-17 Corps de refroidissement a deformation plastique destine a des composants electriques et/ou electroniques Withdrawn EP1668698A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10345222 2003-09-29
PCT/EP2004/052234 WO2005034236A1 (fr) 2003-09-29 2004-09-17 Corps de refroidissement a deformation plastique destine a des composants electriques et/ou electroniques

Publications (1)

Publication Number Publication Date
EP1668698A1 true EP1668698A1 (fr) 2006-06-14

Family

ID=34399041

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04766823A Withdrawn EP1668698A1 (fr) 2003-09-29 2004-09-17 Corps de refroidissement a deformation plastique destine a des composants electriques et/ou electroniques

Country Status (2)

Country Link
EP (1) EP1668698A1 (fr)
WO (1) WO2005034236A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004113417A1 (fr) 2003-05-23 2004-12-29 Dow Corning Corporation Composition de revetement antireflet a base de resine siloxane presentant une vitesse d'attaque elevee en milieu liquide
JP5587791B2 (ja) 2008-01-08 2014-09-10 東レ・ダウコーニング株式会社 シルセスキオキサン樹脂
EP2238198A4 (fr) 2008-01-15 2011-11-16 Dow Corning Résines à base de silsesquioxane
JP5581225B2 (ja) 2008-03-04 2014-08-27 ダウ・コーニング・コーポレイション シルセスキオキサン樹脂
US8241707B2 (en) 2008-03-05 2012-08-14 Dow Corning Corporation Silsesquioxane resins
EP2373722A4 (fr) 2008-12-10 2013-01-23 Dow Corning Résines silsesquioxanes

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5254500A (en) * 1991-02-05 1993-10-19 Advanced Micro Devices, Inc. Method for making an integrally molded semiconductor device heat sink
KR100189642B1 (ko) * 1991-02-18 1999-06-01 디어터 크리스트 전자 부품 및 조립체를 피복시키거나 접착시키는 방법
JPH04291948A (ja) * 1991-03-20 1992-10-16 Fujitsu Ltd 半導体装置及びその製造方法及び放熱フィン
US5371404A (en) * 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
JP2793559B2 (ja) * 1996-05-30 1998-09-03 日東電工株式会社 耐熱性および熱伝導性にすぐれた感圧性接着剤とその接着シ―ト類およびこれらを用いた電子部品と放熱部材との固定方法
EP1029352A1 (fr) * 1997-11-13 2000-08-23 Bp Amoco Corporation Appareil de gestion thermique a caloduc

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
None *
See also references of WO2005034236A1 *

Also Published As

Publication number Publication date
WO2005034236A1 (fr) 2005-04-14

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