WO2007017307A1 - Laque a la resine epoxy durcissable aux uv et thermiquement pour des ensembles electroniques dans des locaux humides - Google Patents

Laque a la resine epoxy durcissable aux uv et thermiquement pour des ensembles electroniques dans des locaux humides Download PDF

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Publication number
WO2007017307A1
WO2007017307A1 PCT/EP2006/063476 EP2006063476W WO2007017307A1 WO 2007017307 A1 WO2007017307 A1 WO 2007017307A1 EP 2006063476 W EP2006063476 W EP 2006063476W WO 2007017307 A1 WO2007017307 A1 WO 2007017307A1
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WO
WIPO (PCT)
Prior art keywords
epoxy resin
component
resin formulation
weight
formulation according
Prior art date
Application number
PCT/EP2006/063476
Other languages
German (de)
English (en)
Inventor
Grit Stelle
Barbara Lehner
Wolfgang ÜBLER
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2007017307A1 publication Critical patent/WO2007017307A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/02—Homopolymers or copolymers of unsaturated alcohols
    • C08L29/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Definitions

  • UV- and thermally curable epoxy paint for electronic assemblies in damp rooms UV- and thermally curable epoxy paint for electronic assemblies in damp rooms
  • the invention relates to a UV and thermally curable epoxy resin formulation and its use for covering electronic and electrical components and assemblies.
  • a substrate such as a substrate
  • cast resins or housings to protect them from dust, moisture or mechanical damage.
  • These casting resins are usually reactive resins which are applied to the components and assemblies and cured.
  • Casting resins for example one- and two-component epoxy resin formulations which are UV and thermally curable, are known in the prior art. Two-component epoxy resin formulations must either be mixed prior to processing or stored as a premix at low temperatures and processed within a few hours. Known UV and thermally curable one-component resin formulations sometimes require curing temperatures of up to 150 ° C. for thermal post-curing.
  • silicone coatings are, for example, that they may tend to form bubbles during processing, in particular during crosslinking. Furthermore, silicone-based covering compounds can only insufficiently protect components against moisture.
  • the package design of circuits requires that the casting resin used completely cover higher devices, such as integrated circuits, and maintain the desired shape beyond the curing process.
  • the cast resin columns of the arrangement well underflow and connecting pins, also called component legs, well behind.
  • commercially available casting resins and paints often have too high or too low a viscosity. This can lead to insufficiently covering elevated components or, for example, flowing the resin into openings for the through-connection of later-to-mount components and closing them.
  • the object of the present invention is to provide a cast resin material which overcomes at least one of the aforementioned disadvantages of the prior art, in particular protects the components from moisture and satisfies the stated requirements for the application.
  • a UV and thermally curable epoxy resin formulation wherein the epoxy resin formulation based on the total weight of the epoxy resin formulation comprises the following components: a. > 65 wt .-% to ⁇ 95 wt .-% epoxy resin component; b. > 0.5 wt .-% to ⁇ 10 wt .-% hydorxyl component; c. > 0, 1 wt .-% to ⁇ 3 wt .-% photoinitiator component; d. > 0.5 wt .-% to ⁇ 3 wt .-% thermal initiator component; e. > 2% by weight to ⁇ 30% by weight of filler component; f. > 0, l wt .-% to ⁇ 5 wt .-% additive component.
  • the weight percentages of the respective components are chosen so that the total weight of the respective components does not exceed 100% by weight, based on the total formulation.
  • Another object of the present invention is the use of the epoxy resin formulation for covering electrical and electronic components and assemblies.
  • the epoxy resin formulation according to the invention can effectively protect moisture-sensitive components such as capacitors, integrated circuits and processors from penetrating moisture or water.
  • the advantages of the epoxy resin formulation according to the invention are realized in particular by the low water vapor permeability of the cured epoxy resin formulation film. Also advantageous is the good adhesion of the epoxy resin formulation to the substrate and to the component surfaces. This combination of the properties of the epoxy resin formulation according to the invention can advantageously reduce or even prevent penetration of water along the interfaces and thus provide improved protection of the components from moisture.
  • the epoxy resin formulation based on the total weight of the epoxy resin formulation, has the following components: a. > 70 wt .-% to ⁇ 90 wt .-%, preferably> 75 wt .-% to ⁇ 88 wt .-% epoxy resin component; b. > 1 wt .-% to ⁇ 8 wt .-%, preferably> 3 wt .-% to ⁇ 7.5 wt .-% hydroxyl component; c. > 1 wt .-% to ⁇ 2.5 wt .-%, preferably ⁇ 1.5 wt .-% to ⁇ 2 wt .-% of photoinitiator component; d.
  • Epoxy resin components based on aromatic and / or cycloaliphatic epoxy resins are preferably usable as the epoxy resin component.
  • Particularly preferred epoxy resin based aromatic epoxides are, for example, selected from the group comprising epoxy resins based on bisphenols, di- or polyhydroxyaromatics, polyarylalkyls with phenolic OH groups, compounds of the glycidyl ether ester type, for example para-hydroxybenzoic acid glycidyl ether esters, glycidyl esters of polycarboxylic acids with an aromatic nucleus, such as hexahydrophthalic acid or phthalic acid.
  • a preferred cycloaliphatic epoxy resin component is, for example
  • cycloaliphatic epoxy resins are pure cycloaliphatic epoxy resins which have a low ion content. Cationically curable and solvent-free epoxy resins are preferably usable.
  • the proportion of the epoxy resin component in the epoxy resin formulation according to the invention is preferably higher than is customary.
  • the term "epoxy resin” is to be understood as meaning both uniform epoxy resins and mixtures of different epoxy resins. It is particularly preferable to use aromatic and / or cycloaliphatic epoxy resins, it also being possible to use mixtures of aromatic epoxy resins, cycloaliphatic epoxy resins and / or mixtures of both.
  • the epoxy resin component comprises only aromatic and / or cycloaliphatic epoxy resins.
  • the epoxy resin component comprises> 70% by weight to ⁇ 90% by weight, preferably> 75% by weight to ⁇ 88% by weight, based on the total weight of the epoxy resin formulation, aromatic epoxy resins or cycloaliphatic epoxy resins.
  • the advantages of the epoxy resin formulation according to the invention are in particular caused by the epoxy resin component, which cause a low moisture absorption and a low permeability to water vapor of the cured epoxy resin formulation.
  • the epoxy resin component which cause a low moisture absorption and a low permeability to water vapor of the cured epoxy resin formulation.
  • the use of epoxy resin components based on aromatic and / or cycloaliphatic epoxy resins can bring about improved protection of the components from moisture.
  • epoxy resin components comprising aromatic and / or cyclo-aliphatic Epoxy resins reduce the water vapor permeability of the cured epoxy formulation film and also protect moisture sensitive components.
  • the epoxy resin formulation comprises at least one polyol as the hydroxyl component, preferably a polyol selected from the group comprising aliphatic diols and / or aliphatic triols. Particularly preferred are low molecular weight polyols, very particularly preferably, for example, 1, 2-propanediol.
  • Usable as the hydroxyl component is at least one aliphatic diol or at least one aliphatic triol, preferably usable are mixtures of aliphatic diols or mixtures of aliphatic diols and aliphatic triols.
  • the hydroxyl component comprises only polyols selected from the group comprising aliphatic diols, aliphatic triols and / or mixtures thereof.
  • the usable hydroxyl-containing organic compounds can advantageously have a positive influence on the UV and thermal reactivities of the epoxy resin formulations.
  • the aliphatic diols and triols which can preferably be used have a positive effect on the curing process, in particular the curing rate, of the epoxy resin formulation. This can lead to a marked improvement in the properties of the cured epoxy resin formulation coating, which can have improved adhesion of the epoxy resin formulation to the substrate and / or components, in particular when using mixtures of low molecular weight diols or mixtures of diols and triols.
  • the epoxy resin formulation has good adhesion both to the substrate, for example to solder resists, and to the device surfaces, which are formed, for example, from epoxy polymer molding compound and / or metallic surfaces such as brass, whereby the penetration of water along the interfaces reduced or even can be prevented.
  • the substrate for example to solder resists
  • the device surfaces which are formed, for example, from epoxy polymer molding compound and / or metallic surfaces such as brass, whereby the penetration of water along the interfaces reduced or even can be prevented.
  • an initiator mixture comprising a photoinitiator component and a thermal initiator component is preferably used.
  • the epoxy resin formulation of the invention can thus be cured by UV radiation and / or thermally, wherein the UV and the thermal curing can optionally be carried out simultaneously or sequentially.
  • This "dual cure” mechanism which describes the combination of UV and thermal cure, allows UV curing at low temperatures, for example, by short UV irradiation, as well as a thermal curing step to cure shadowed areas, for example Gaps under components or behind connection pins or component legs that are poorly or not at all reached by UV radiation.
  • the UV curing allows rapid curing of the covering compound by UV irradiation.
  • cure may already be achieved by exposure times in the range of 10 seconds to 45 seconds.
  • an increase in viscosity can be achieved, so that the coverage of very irregular component topographies without flowing away of the formulation is made possible.
  • the inaccessible to the irradiation areas, the so-called exposure shadows can be reacted by thermal curing reaction.
  • the epoxy resin formulation preferably contains at least one cationic photoinitiator or at least one cationic photoinitiator system.
  • Preferred photoinitiators are those based on organic onium salts, in particular based on aromatic sulfonium salts.
  • organic onium salts in particular based on aromatic sulfonium salts.
  • Particularly preferred photoinitiators are triarylsulfonium salts and / or thiolanium salts.
  • the photoinitiator component accordingly comprises a triaryl sulfonium hexafluoroantimonate and / or a thiolanium hexafluoroantimonate.
  • the photoinitiator component comprises only triarylsulfonium hexafluoroantimonate or only thiolanium hexafluoroantimonate, in very particularly preferred embodiments the photoinitiator component comprises triarylsulfonium hexafluoroantimonate and thiolanium hexafluoroantimonate.
  • the thermal initiator component comprises a thiolanium salt.
  • Hexafluoroantimonate has proved to be particularly advantageous as the anion of the thiolanium salts.
  • the thermal initiator component comprises a thiolanium hexafluoroantimonate.
  • Benzylthiolanium hexafluoroantimonates are of the general structure (1) below:
  • R 1 hydrogen, alkyl, aryl, alkoxy, thiol ether, halogen, CN or NO 2 ;
  • R 2 hydrogen, alkyl or aryl
  • R 3 hydrogen, alkyl or aryl or an aromatic system fused to the thiolane ring.
  • Unsubstituted benzylthiolanium salts are preferably used, in particular benzylthiolanium hexafluoroantimonate.
  • a particularly preferred anion of the thiolanium salts is hexafluoroantimonate.
  • the thermal initiator component comprises only thiolanium hexafluoroantimonate, preferably benzylthiolanium hexafluoroantimonate. It is advantageous that hexafluoroantimonate can provide a sufficient latency of the initiators, in particular of the thermal initiators.
  • the term "latency” is to be understood as meaning the reduced stability of the initiator against UV radiation and temperature which makes initiation possible.
  • a particular advantage is achieved in that the thiolanium hexafluoroantimonate has both sufficient stability and excitation, as well as a sufficient latency, which makes an excitation possible, can provide.
  • Moisture barrier effect of the cured epoxy resin formulation contribute.
  • a particular advantage of curing below 100 ° C. is achieved by making it possible to use it in a large number of electrical and electronic components, which can only be coated poorly or not at higher temperatures, since many, above all, electronic components have temperatures above 100 ° C. not tolerate.
  • the use of thiolanium hexafluoroantimonate can also allow use of the epoxy formulation for such devices, and provide wider usability.
  • the thermal initiator component and the photoinitiator component comprise a thiolanium hexafluoroantimonate.
  • the thermal initiator component and photoinitiator component may comprise only thiolanium hexafluoroantimonate. This may realize the advantage that UV and latent thermal initiator components may be based on a compound.
  • the epoxy resin formulation of the invention further comprises a filler component.
  • This filler component may contain conventional fillers useful in the formulation of epoxy resin formulations wherein the surface of the filler particles may also be coated or otherwise chemically treated. Preference is given to inorganic filler materials, for example aluminum oxide, aluminum hydroxide,
  • the filler component fused silica and / or quartz flour.
  • the filler component is fused silica and / or quartz flour.
  • An advantage of using fused silica and / or quartz powder is that it can provide a low coefficient of expansion of the formulations and, for example, cracks and fractures during thermal cycling of covered assemblies during operation can be avoided.
  • usable filler materials are not limited to inorganic materials, also preferred are organic materials, for example, based on other plastics or polymers usable.
  • Filler particles of any shape can be used, but spherical particles are preferred for realizing the good flow properties of the epoxy resin formulation. Smaller filler particles can improve the flowability of the formulation, preferred particle size of the particles are ⁇ 25 .mu.m, preferably ⁇ 20 .mu.m, more preferably ⁇ 15 .mu.m, more preferably ⁇ 10 .mu.m and most preferably ⁇ 5 .mu.m.
  • the epoxy resin formulation contains a comparatively small proportion of fillers.
  • a minimum proportion of 2% by weight of filler component has proved favorable.
  • a proportion of the filler component above 30 wt .-% causes an unfavorable change in the properties of the epoxy resin formulation.
  • the proportion of the epoxy resin component in the epoxy resin formulation according to the invention is higher than is customary.
  • the ratio of the proportions of the epoxy resin component to the filler component is preferably at least 2: 1, preferably the ratio of epoxy resin component to filler component is in the range from 2: 1 to 30: 1, preferably in the range from 5: 1 to 20: 1, more preferably in Range from 12: 1 to 18: 1, and most preferably in the range of 13: 1 to 15: 1.
  • known casting resin or epoxy resin formulations frequently have a ratio of resin component to filler component of approximately 1: 2.
  • the inventively low content of filler component or the increased proportion of epoxy resin advantageously contributes to the fact that the cured epoxy resin formulation has a reduced moisture absorption and a reduced water vapor permeability.
  • the complete coverage of high and / or irregular components is made possible without the epoxy resin formulation flows into immediately adjacent openings, for example, for a later have to be preserved in successive via.
  • these requirements for applicability and improved protection of the electrical and electronic components from moisture are made available.
  • an additive component is preferably contained in the epoxy resin formulation according to the invention.
  • This additive component comprises further additives and / or additives which, for example, improve the applicability of the epoxy resin formulation.
  • Usable additives and additives are, for example, dyes, pigments, wetting auxiliaries, leveling agents, adhesion promoters, thixotropic agents, defoamers, flow modifiers, stabilizers, Flame retardants, dyes, wetting agents, sensitizers, degassing aids, or other fillers.
  • the additive component comprises fumed or disperse silica.
  • the additive component pyrogenic silica allows adjustment of the viscosity or thixotropy of the formulation.
  • An addition of fumed silica may provide a targeted adjustment of the viscosity of the formulation.
  • the epoxy resin formulation comprises> 0.4 wt% to ⁇ 3 wt%, preferably> 1 wt% to ⁇ 1.4 wt% fumed silica, based on the total weight of the epoxy resin formulation.
  • the epoxy resin formulation comprises> 0.1 wt% to ⁇ 0.5 wt%, preferably> 0.2 wt% to ⁇ 0.4 wt%, based on the total weight of the Epoxy resin formulation, epoxy silane.
  • Another aspect of the present invention relates to the use of an epoxy resin formulation according to the invention for covering electrical and electronic components and assemblies.
  • the epoxy resin formulation according to the invention is for covering electrical and electronic components and assemblies in places with high humidity, such as Bathroom or rooms with long-term high relative humidity suitable.
  • moisture-sensitive components such as capacitors and processors can be effectively protected by a cover with the epoxy resin formulation according to the invention against ingress of moisture, for example by condensing water vapor.
  • the Epoxidharzformu- lation is also in particular for the protection of electrical or electronic components and assemblies under humid conditions, for example in wet rooms or wet rooms according to the definition in point. 3.31 DIN 18 195 - 1; 2000-08 usable.
  • FIG. 1 shows a schematic representation of an electrical component 1, for example an integrated one
  • connection pins also called IC legs, with a pitch of 50 ⁇ m to 30 ⁇ m, behind which the formulation has flowed.
  • FIG. 2 shows a schematic representation of an electrical component 1, for example, an integrated circuit (IC) with solder contacts 6, which on a Lei terplatte 2 is applied and is surrounded by a mecanicabdeckmasse 7.
  • IC integrated circuit
  • the columns of the component could be filled and at the same time the component could be covered completely with the epoxy resin formulation, while a comparison cover composition did not cover the component on the surface and did not flow under the component.
  • Epoxy resin formulation comprising: (1) 87.7% by weight of aromatic epoxide * 1 ;
  • Aerosil R972 For example, available from Degussa under the trade name Aerosil R972.
  • components (1) to (7) were weighed and mixed at room temperature with a magnetic stirrer and homogenized.
  • the components (8) and (9) were weighed and stirred in with a Labordis solver, type LM-37 (Pendraulik), at about 3000 rpm for 15 minutes until the constituents were completely dispersed in.
  • the mixture was then degassed for 15 minutes at 10-20 mbar. With this formulation boards were covered.
  • the curing was carried out by UV irradiation in the UV-A range with an iron-doped mercury radiator (type F, Dr. Hönle), for 20 to 90 seconds. Subsequently, the sample was heated at 85 ° C. for 60 minutes.
  • the boards coated with the epoxy resin formulations did not show any moisture absorption during the period of use. Furthermore, these 90 minutes were resistant to a humidity of up to 100%. In addition, the resin formulation showed excellent adhesion to the no-clean printed circuit boards used.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

L'invention concerne une formulation de résine époxy durcissable aux UV et thermiquement, cette formulation, relativement à son poids total, comprenant les composants suivants: >65 % à <95 % en poids de résine époxy, >0,5 % à <10 % en poids d'hydroxyle, >0,1 % à <3 % en poids de photo-initiateur, >0,5 % à <3 % en poids d'initiateur thermique, >2 % à <30 % en poids de charge, >0,1 % à <5 % d'additif.
PCT/EP2006/063476 2005-08-08 2006-06-22 Laque a la resine epoxy durcissable aux uv et thermiquement pour des ensembles electroniques dans des locaux humides WO2007017307A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005037358.5 2005-08-08
DE102005037358 2005-08-08

Publications (1)

Publication Number Publication Date
WO2007017307A1 true WO2007017307A1 (fr) 2007-02-15

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013034193A1 (fr) 2011-09-09 2013-03-14 Abb Research Ltd Procédé de production d'une isolation électrique haute tension
CN103616800A (zh) * 2013-10-21 2014-03-05 溧阳市东大技术转移中心有限公司 感光固化树脂组合物
WO2024006422A1 (fr) * 2022-06-29 2024-01-04 Raytheon Company Joint d'étanchéité à double durcissement à écriture directe

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02235917A (ja) * 1989-03-09 1990-09-18 Murata Mfg Co Ltd 光熱硬化併用型樹脂組成物
US6200408B1 (en) * 1997-02-10 2001-03-13 Siemens Aktiengesellschaft Method for cementing a component to a surface

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02235917A (ja) * 1989-03-09 1990-09-18 Murata Mfg Co Ltd 光熱硬化併用型樹脂組成物
US6200408B1 (en) * 1997-02-10 2001-03-13 Siemens Aktiengesellschaft Method for cementing a component to a surface

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 548 (C - 0785) 5 December 1990 (1990-12-05) *
STAPP B ET AL: "PHOTO- AND THERMOINITIATED CURING OF EPOXY RESINS BY SULFONIUM SALTS", ANGEWANDTE MAKROMOLEKULARE CHEMIE. APPLIED MACROMOLECULAR CHEMISTRY AND PHYSICS, WILEY VCH, WEINHEIM, DE, vol. 209, 1 July 1993 (1993-07-01), pages 197 - 212, XP000382864, ISSN: 0003-3146 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013034193A1 (fr) 2011-09-09 2013-03-14 Abb Research Ltd Procédé de production d'une isolation électrique haute tension
US20140329023A1 (en) * 2011-09-09 2014-11-06 Abb Research Ltd. Method of producing high voltage electrical insulation
US10332659B2 (en) 2011-09-09 2019-06-25 Abb Research Ltd. Method of producing high voltage electrical insulation
CN103616800A (zh) * 2013-10-21 2014-03-05 溧阳市东大技术转移中心有限公司 感光固化树脂组合物
CN103616800B (zh) * 2013-10-21 2016-08-10 溧阳市东大技术转移中心有限公司 感光固化树脂组合物
WO2024006422A1 (fr) * 2022-06-29 2024-01-04 Raytheon Company Joint d'étanchéité à double durcissement à écriture directe

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