CA2266471C - Cover tape for formed tape packing system and process for making same - Google Patents
Cover tape for formed tape packing system and process for making same Download PDFInfo
- Publication number
- CA2266471C CA2266471C CA002266471A CA2266471A CA2266471C CA 2266471 C CA2266471 C CA 2266471C CA 002266471 A CA002266471 A CA 002266471A CA 2266471 A CA2266471 A CA 2266471A CA 2266471 C CA2266471 C CA 2266471C
- Authority
- CA
- Canada
- Prior art keywords
- layer
- base film
- film layer
- adhesive
- cover tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 77
- 230000008569 process Effects 0.000 title claims description 72
- 238000012856 packing Methods 0.000 title description 4
- 239000010410 layer Substances 0.000 claims abstract description 409
- 239000012790 adhesive layer Substances 0.000 claims abstract description 106
- 238000000576 coating method Methods 0.000 claims abstract description 51
- 239000011248 coating agent Substances 0.000 claims abstract description 49
- 239000002216 antistatic agent Substances 0.000 claims abstract description 29
- 238000007789 sealing Methods 0.000 claims abstract description 24
- 239000010408 film Substances 0.000 claims description 265
- 239000000853 adhesive Substances 0.000 claims description 132
- 230000001070 adhesive effect Effects 0.000 claims description 132
- 230000005540 biological transmission Effects 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 32
- 238000002310 reflectometry Methods 0.000 claims description 16
- 239000011104 metalized film Substances 0.000 claims description 13
- 239000000945 filler Substances 0.000 claims description 10
- 238000004804 winding Methods 0.000 claims 4
- 230000003068 static effect Effects 0.000 description 14
- -1 polyethylene terephthalate Polymers 0.000 description 11
- 230000036961 partial effect Effects 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 239000005060 rubber Substances 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 230000006378 damage Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010348 incorporation Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 description 3
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 238000007777 rotary screen coating Methods 0.000 description 2
- 238000010022 rotary screen printing Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229920002633 Kraton (polymer) Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Chemical class 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- BFMKFCLXZSUVPI-UHFFFAOYSA-N ethyl but-3-enoate Chemical compound CCOC(=O)CC=C BFMKFCLXZSUVPI-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Chemical class 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2813—Heat or solvent activated or sealable
- Y10T428/2817—Heat sealable
- Y10T428/2826—Synthetic resin or polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2843—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including a primer layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Wrappers (AREA)
- Laminated Bodies (AREA)
- Package Frames And Binding Bands (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/713,504 | 1996-09-13 | ||
| US08/713,504 US6030692A (en) | 1996-09-13 | 1996-09-13 | Cover tape for formed tape packing system and process for making same |
| PCT/US1997/016090 WO1998011768A1 (en) | 1996-09-13 | 1997-09-11 | Cover tape for formed tape packing system and process for making same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2266471A1 CA2266471A1 (en) | 1998-03-19 |
| CA2266471C true CA2266471C (en) | 2008-01-29 |
Family
ID=24866404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002266471A Expired - Lifetime CA2266471C (en) | 1996-09-13 | 1997-09-11 | Cover tape for formed tape packing system and process for making same |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6030692A (https=) |
| EP (1) | EP0925715B1 (https=) |
| JP (1) | JP2001500457A (https=) |
| AT (1) | ATE195400T1 (https=) |
| CA (1) | CA2266471C (https=) |
| DE (1) | DE69702770D1 (https=) |
| WO (1) | WO1998011768A1 (https=) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3383935B2 (ja) * | 1999-01-11 | 2003-03-10 | 北越製紙株式会社 | 電子デバイス用キャリアテープ紙 |
| US6469372B2 (en) * | 2000-05-16 | 2002-10-22 | Texas Instruments Incorporated | Matched thermal expansion carrier tape assemblage for semiconductor devices |
| DE10044435A1 (de) * | 2000-09-08 | 2002-04-04 | Siemens Ag | Bestückelemente-Gurt, Bestückelemente-Entnahmeeinrichtung und Verfahren zum Entnehmen von Bestückelementen aus einem Bestückelemente-Gurt |
| AU2002345671A1 (en) * | 2001-06-13 | 2002-12-23 | International Product Technology, Inc. | Post-seal inspection system |
| SG115510A1 (en) * | 2001-12-20 | 2005-10-28 | Nitto Denko Corp | Cover tape for the electronic part conveyance, process for its production and electronic part conveying member |
| US20050065516A1 (en) * | 2003-09-24 | 2005-03-24 | Tae-Ahn Jahng | Method and apparatus for flexible fixation of a spine |
| US7365414B2 (en) * | 2003-12-01 | 2008-04-29 | Intel Corporation | Component packaging apparatus, systems, and methods |
| US7575721B2 (en) * | 2005-06-06 | 2009-08-18 | Cepheid | Method and apparatus for storing and dispensing reagent beads |
| US8247057B2 (en) | 2005-09-16 | 2012-08-21 | 3M Innovative Properties Company | Cover tape and method for manufacture |
| KR100777086B1 (ko) | 2006-04-12 | 2007-11-19 | 안승배 | 전자 부품 이송용 커버 테이프 및 그 제조 방법 |
| US20090246518A1 (en) * | 2006-04-25 | 2009-10-01 | Denki Kagaku Kogyo Kabushiki Kaisha | Cover film |
| US20080032099A1 (en) * | 2006-07-20 | 2008-02-07 | Elmer's Products, Inc. | Heat activated art mounting sheet |
| KR101464780B1 (ko) | 2006-08-09 | 2014-11-24 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 인열 개시 커버 테이프를 갖는 캐리어 테이프 및 이의 제조방법 |
| JP5554561B2 (ja) * | 2007-04-11 | 2014-07-23 | 住友ベークライト株式会社 | 電子部品包装体 |
| US8205766B2 (en) * | 2009-05-20 | 2012-06-26 | The Bergquist Company | Method for packaging thermal interface materials |
| US8430264B2 (en) * | 2009-05-20 | 2013-04-30 | The Bergquist Company | Method for packaging thermal interface materials |
| KR101139545B1 (ko) * | 2009-07-22 | 2012-04-27 | 스미또모 베이크라이트 가부시키가이샤 | 전자부품 포장용 커버 테이프 및 전자부품 포장체 |
| KR101780916B1 (ko) | 2011-09-30 | 2017-09-21 | 인텔 코포레이션 | 집적회로 구조 및 집적회로 구조의 제조 방법 |
| EP2761664A4 (en) | 2011-09-30 | 2015-06-17 | Intel Corp | CLOSING DIELECTRIC STRUCTURES FOR TRANSISTOR GATES |
| US9580776B2 (en) | 2011-09-30 | 2017-02-28 | Intel Corporation | Tungsten gates for non-planar transistors |
| WO2013048524A1 (en) | 2011-10-01 | 2013-04-04 | Intel Corporation | Source/drain contacts for non-planar transistors |
| WO2013095527A1 (en) * | 2011-12-22 | 2013-06-27 | Intel Corporation | Electrostatic discharge compliant patterned adhesive tape |
| JP6000668B2 (ja) * | 2012-06-07 | 2016-10-05 | 日東電工株式会社 | 半導体素子のマーキング方法、半導体装置の製造方法、及び半導体装置 |
| JP7264007B2 (ja) * | 2019-10-23 | 2023-04-25 | 株式会社村田製作所 | 電子部品連およびベーステープ |
| CN114015373A (zh) * | 2021-12-10 | 2022-02-08 | 苏州佳值电子工业有限公司 | 一种局部遮蔽的集成式双面胶带 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59158596A (ja) * | 1983-02-28 | 1984-09-08 | 奥井 徳次郎 | 小型電子部品の収納方法 |
| MY103125A (en) * | 1987-07-24 | 1993-04-30 | Lintec Corp | Cover tape for sealing chip-holding parts of carrier tape |
| JPH0219271A (ja) * | 1988-07-06 | 1990-01-23 | Toshiba Corp | 半導体装置用テーピング部品 |
| US4966282A (en) * | 1989-01-13 | 1990-10-30 | Nitto Denko Corporation | Electronic component carrier |
| US4944979A (en) * | 1989-10-19 | 1990-07-31 | At&T Bell Laboratories | Tape conveyers for components |
| EP0466937B2 (en) * | 1990-02-06 | 1998-03-18 | Sumitomo Bakelite Company Limited | Plastic carrier tape and cover tape for electronic component chip |
| MY107463A (en) * | 1991-02-28 | 1995-12-30 | Sumitomo Bakelite Co | Cover tape for packaging chip type electronic parts. |
| US5637368A (en) * | 1992-06-04 | 1997-06-10 | Minnesota Mining And Manufacturing Company | Adhesive tape having antistatic properties |
| US5343363A (en) * | 1992-12-21 | 1994-08-30 | Delco Electronics Corporation | Split backed pressure sensitive die carrier tape |
| DE4305910A1 (de) * | 1993-02-26 | 1994-09-01 | Beiersdorf Ag | Selbstklebender Verdeckelungsfilm für die Verpackung elektronischer Bauelemente |
| US5441809A (en) * | 1993-10-28 | 1995-08-15 | Brady U.S.A., Inc. | Dissipative cover tape surface mount device packaging |
| TW339840U (en) * | 1993-12-22 | 1998-09-01 | Lintec Corp | Coating applicator |
| JPH07251860A (ja) * | 1994-03-10 | 1995-10-03 | Colcoat Eng Kk | 電子部品包装用カバーテープ及びその製法 |
| US5447784A (en) * | 1994-06-01 | 1995-09-05 | Rexham Industries Corp. | Electrostatic dissipating cover tape |
| US5491013A (en) * | 1994-08-31 | 1996-02-13 | Rexam Industries Corp. | Static-dissipating adhesive tape |
| US5524765A (en) * | 1994-11-15 | 1996-06-11 | Tempo G | Carrier tape packaging system utilizing a layer of gel for retaining small components |
-
1996
- 1996-09-13 US US08/713,504 patent/US6030692A/en not_active Expired - Lifetime
-
1997
- 1997-09-11 AT AT97941033T patent/ATE195400T1/de not_active IP Right Cessation
- 1997-09-11 EP EP97941033A patent/EP0925715B1/en not_active Expired - Lifetime
- 1997-09-11 CA CA002266471A patent/CA2266471C/en not_active Expired - Lifetime
- 1997-09-11 WO PCT/US1997/016090 patent/WO1998011768A1/en not_active Ceased
- 1997-09-11 JP JP10513858A patent/JP2001500457A/ja active Pending
- 1997-09-11 DE DE69702770T patent/DE69702770D1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69702770D1 (de) | 2000-09-14 |
| US6030692A (en) | 2000-02-29 |
| EP0925715A1 (en) | 1999-06-30 |
| CA2266471A1 (en) | 1998-03-19 |
| JP2001500457A (ja) | 2001-01-16 |
| EP0925715B1 (en) | 2000-08-09 |
| ATE195400T1 (de) | 2000-08-15 |
| WO1998011768A1 (en) | 1998-03-19 |
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