CA1234069A - Procede de metallisation de films souples electriquement isolants et articles obtenus - Google Patents

Procede de metallisation de films souples electriquement isolants et articles obtenus

Info

Publication number
CA1234069A
CA1234069A CA000452029A CA452029A CA1234069A CA 1234069 A CA1234069 A CA 1234069A CA 000452029 A CA000452029 A CA 000452029A CA 452029 A CA452029 A CA 452029A CA 1234069 A CA1234069 A CA 1234069A
Authority
CA
Canada
Prior art keywords
film
metal oxide
oxide
conductive
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000452029A
Other languages
English (en)
French (fr)
Inventor
Robert Cassat
Maurice Alliot-Lugaz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rhodia Chimie SAS
Original Assignee
Rhone Poulenc Chimie SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rhone Poulenc Chimie SA filed Critical Rhone Poulenc Chimie SA
Application granted granted Critical
Publication of CA1234069A publication Critical patent/CA1234069A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Paints Or Removers (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemically Coating (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Burglar Alarm Systems (AREA)
  • General Induction Heating (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CA000452029A 1983-04-15 1984-04-13 Procede de metallisation de films souples electriquement isolants et articles obtenus Expired CA1234069A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8306405A FR2544341A1 (fr) 1983-04-15 1983-04-15 Procede de metallisation de films souples electriquement isolants et articles obtenus
FR83/06405 1983-04-15

Publications (1)

Publication Number Publication Date
CA1234069A true CA1234069A (fr) 1988-03-15

Family

ID=9288009

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000452029A Expired CA1234069A (fr) 1983-04-15 1984-04-13 Procede de metallisation de films souples electriquement isolants et articles obtenus

Country Status (13)

Country Link
US (1) US4564424A (forum.php)
EP (1) EP0124452B1 (forum.php)
JP (2) JPS6036667A (forum.php)
KR (1) KR910010148B1 (forum.php)
AT (1) ATE32753T1 (forum.php)
AU (1) AU571505B2 (forum.php)
CA (1) CA1234069A (forum.php)
DE (1) DE3469571D1 (forum.php)
ES (2) ES8504973A1 (forum.php)
FR (1) FR2544341A1 (forum.php)
IE (1) IE55468B1 (forum.php)
IL (1) IL71544A (forum.php)
ZA (1) ZA842727B (forum.php)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4752529A (en) * 1986-01-21 1988-06-21 E. I. Du Pont De Nemours And Company Metal interlayers in films by counter-current diffusion
US4692360A (en) * 1986-01-21 1987-09-08 E. I. Du Pont De Nemours And Company Metal interlayers in films by counter-current diffusion
US4910072A (en) * 1986-11-07 1990-03-20 Monsanto Company Selective catalytic activation of polymeric films
US4900618A (en) * 1986-11-07 1990-02-13 Monsanto Company Oxidation-resistant metal coatings
JPH0826462B2 (ja) * 1987-11-30 1996-03-13 龍徳 四十宮 表面金属化重合体成形物の製造方法
US5104688A (en) * 1990-06-04 1992-04-14 Macdermid, Incorporated Pretreatment composition and process for tin-lead immersion plating
EP0460548A3 (en) * 1990-06-08 1993-03-24 Amp-Akzo Corporation Printed circuits and base materials precatalyzed for etal deposition
US5162144A (en) * 1991-08-01 1992-11-10 Motorola, Inc. Process for metallizing substrates using starved-reaction metal-oxide reduction
US5281483A (en) * 1992-08-14 1994-01-25 Shell Oil Company Metallized films
WO1997007554A1 (en) * 1992-11-02 1997-02-27 Aktsionernoe Obschestvo Zakrytogo Tipa 'elton' Method of manufacturing electrodes for chemical current sources
US6518198B1 (en) 2000-08-31 2003-02-11 Micron Technology, Inc. Electroless deposition of doped noble metals and noble metal alloys
US20050139811A1 (en) * 2001-02-15 2005-06-30 Integral Technologies, Inc. Surface preparation method for articles manufactured from conductive loaded resin-based materials
TW554086B (en) * 2001-02-16 2003-09-21 Taiyo Mfg Co Ltd Method for producing plated molded product
ES2307786T3 (es) * 2001-11-13 2008-12-01 Reckitt Benckiser Inc. Mejoras ralacionadas con articulos de limpieza de la taza del retrete.
KR100622336B1 (ko) * 2001-12-18 2006-09-18 아사히 가세이 가부시키가이샤 금속 산화물 분산체, 그를 이용한 금속 박막 및 금속 박막의 제조방법
US7449099B1 (en) * 2004-04-13 2008-11-11 Novellus Systems, Inc. Selectively accelerated plating of metal features
EP1636437B1 (en) * 2003-06-26 2015-12-09 Reckitt Benckiser LLC Improved dispensing device
AU2005268631B9 (en) 2004-08-04 2010-01-21 Reckitt Benckiser Llc Dispensing device
WO2006114431A1 (de) * 2005-04-27 2006-11-02 Basf Aktiengesellschaft Verfahren zur herstellung metallisierter, extrudierter kunststoff-gegenstände
DK2584065T3 (da) * 2009-12-17 2014-07-14 Byd Co Ltd Overflademetalliseringsmetode, metode til fremstilling af plastgenstand og plastgenstand fremstillet derved
US20240366135A1 (en) * 2021-08-26 2024-11-07 Nanyang Technological University Binder-free stretchable interconnect

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3551304A (en) * 1965-07-12 1970-12-29 Bausch & Lomb Method for producing a composite article
FR1469798A (fr) * 1966-02-22 1967-02-17 Ici Ltd Garnitures des encoches de dynamos électriques
FR1524702A (fr) * 1967-05-26 1968-05-10 Ici Ltd Bande d'enregistrement magnétique
US3558441A (en) * 1968-11-01 1971-01-26 Int Electronic Res Corp Method of making a metal core printed circuit board
US3619382A (en) * 1970-01-27 1971-11-09 Gen Electric Process of reducing metal compounds to metal in a matrix
DE2101049A1 (de) * 1971-01-11 1972-08-03 Siemens Ag Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall
DE2623695C2 (de) * 1976-05-26 1984-06-20 Mitsui Toatsu Chemicals, Inc., Tokio/Tokyo Verfahren zur Herstellung eines leitfähigen, gehärteten Produktes
AU548674B2 (en) * 1978-02-28 1986-01-02 Eurographics Holdings N.V. Metallization process
FR2518126B1 (fr) * 1981-12-14 1986-01-17 Rhone Poulenc Spec Chim Procede de metallisation d'articles electriquement isolants en matiere plastique et les articles intermediaires et finis obtenus selon ce procede
EP0082904B1 (fr) * 1981-12-29 1986-04-02 International Business Machines Corporation Système de gestion d'informations visualisables et descriptives
FR2544340A1 (fr) * 1983-04-15 1984-10-19 Rhone Poulenc Rech Procede de metallisation de films souples electriquement isolants en matiere plastique thermostable et articles obtenus

Also Published As

Publication number Publication date
ES8606537A1 (es) 1986-04-01
ES531591A0 (es) 1985-04-16
IE55468B1 (en) 1990-09-26
JPH02187330A (ja) 1990-07-23
JPH0225432B2 (forum.php) 1990-06-04
IE840922L (en) 1984-10-15
AU571505B2 (en) 1988-04-21
ZA842727B (en) 1984-11-28
ES539842A0 (es) 1986-04-01
EP0124452B1 (fr) 1988-03-02
US4564424A (en) 1986-01-14
JPH0521741B2 (forum.php) 1993-03-25
IL71544A0 (en) 1984-07-31
AU2680284A (en) 1984-10-18
DE3469571D1 (en) 1988-04-07
ES8504973A1 (es) 1985-04-16
EP0124452A1 (fr) 1984-11-07
JPS6036667A (ja) 1985-02-25
FR2544341A1 (fr) 1984-10-19
IL71544A (en) 1987-07-31
KR840008467A (ko) 1984-12-15
ATE32753T1 (de) 1988-03-15
KR910010148B1 (ko) 1991-12-17

Similar Documents

Publication Publication Date Title
CA1234069A (fr) Procede de metallisation de films souples electriquement isolants et articles obtenus
EP0082094B1 (fr) Procédé de métallisation d'articles électriquement isolants en matière plastique et les articles intermédiaires pour sa mise en oeuvre
CN1481448A (zh) 在聚合物表面镀金属膜的方法
CN1174857C (zh) 带承载箔的电解铜箔及使用该电解铜箔的包铜层压板
FR2481718A1 (fr) Procede de pretraitement de substrats sensiblement non conducteurs pour les rendre receptifs a des revetements electrolytiques
EP0126014B1 (fr) Procédé de métallisation de films souples électriquement isolants en matière plastique thermostable et articles obtenus
FR2529582A1 (fr) Procede perfectionne de revetement electrolytique de surfaces non metalliques
Żenkiewicz et al. Electroless metallization of polymers
LU83033A1 (fr) Procede de fabrication de cuivre pouvant etre detache et applique sur un support d'aluminium,de meme que l'article ainsi obtenu
CN102974839A (zh) 化学沉积法制备纳米厚度片状银粉的方法
CA2167074C (fr) Procede de metalisation de substrats non-conducteurs
JP5721254B2 (ja) 誘電体基材表面の触媒フリー金属化方法及び金属膜付き誘電体基材
JP4646376B2 (ja) ダイレクトプレーティング用アクセレレータ浴液およびダイレクトプレーティング方法
Tzaneva et al. Effect of etching conditions on electroless Ni-P plating of 3D printed polylactic acid
JP2010047828A (ja) 無電解メッキの前処理方法および該基材の無電解メッキ方法
JP4081625B2 (ja) 透明酸化亜鉛皮膜の作製方法
WO2007043337A1 (ja) Ｐｄ／Ｓｎコロイド触媒吸着促進剤
JPH0525298A (ja) 樹脂成形品の金属化に好適な粗面化方法
JP3498134B2 (ja) 電解めっきの前処理方法
EP0166665A2 (fr) Procédé d'obtention de plaques supports de circuits imprimés, composition pour la mise en oeuvre du procédé et plaques ainsi obtenues
JP6559960B2 (ja) メッキ部品の製造方法及びメッキ部品
JP2020029584A (ja) 無電解めっき用銀触媒付与剤用添加剤
JP2009259900A (ja) 表層に貴金属を固定させた樹脂基板、その製造方法、回路基板、及びその製造方法
JP2006316296A (ja) 金属膜形成方法、それを用いた金属パターン形成方法及び金属膜
JPH036361A (ja) ポリイミドフィルムに金属を付着させる方法

Legal Events

Date Code Title Description
MKEX Expiry