ES8606537A1 - Procedimiento de fabricacion de circuitos impresos - Google Patents

Procedimiento de fabricacion de circuitos impresos

Info

Publication number
ES8606537A1
ES8606537A1 ES539842A ES539842A ES8606537A1 ES 8606537 A1 ES8606537 A1 ES 8606537A1 ES 539842 A ES539842 A ES 539842A ES 539842 A ES539842 A ES 539842A ES 8606537 A1 ES8606537 A1 ES 8606537A1
Authority
ES
Spain
Prior art keywords
electrically conductive
oxide particles
face surface
metal oxide
electrically insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES539842A
Other languages
English (en)
Other versions
ES539842A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rhone Poulenc Recherches SA
Original Assignee
Rhone Poulenc Recherches SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rhone Poulenc Recherches SA filed Critical Rhone Poulenc Recherches SA
Publication of ES8606537A1 publication Critical patent/ES8606537A1/es
Publication of ES539842A0 publication Critical patent/ES539842A0/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)
  • General Induction Heating (AREA)
  • Burglar Alarm Systems (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

PROCEDIMIENTO QUE PERMITE APLICAR DEPOSITOS METALICOS MUY ADHERENTES Y DUCTILES SOBRE PELICULAS FLEXIBLES, MEDIANTE MEDIOS ELECTROLITICOS O QUIMICOS. COMPRENDE LAS SIGUIENTES OPERACIONES: PRIMERA, SE PREPARA UNA MEZCLA HOMOGENEA DE UN POLIMERO FORMADOR DE PELICULA TERMOPLASTICO, FINAMENTE DIVIDIDO, EN PRESENCIA DE UN DISOLVENTE Y DE DIVERSOS COADYUVANTES; SEGUNDA, LA MEZCLA PREPARADA SE CONFORMA MEDIANTE EXTRUSION O COLADA; TERCERA, SE REDUCE CUANTITATIVAMENTE EL OXIDO METALICO CONTENIDO EN LA SUPERFICIE DE LA PELICULA, A METAL, POR TRATAMIENTO CON UN BOROHIDRURO; CUARTA, SE REFUERZA ELECTROLITICAMENTE LA SUPERFICIE METALICA OBTENIDA MEDIANTE UNA CAPA METALICA Y A CONTINUACION SE REVISTE POR UNA FOTORRESERVA; QUINTA, SE REVELA LA FOTORRESERVA Y SE REFUERZA ELECTROLITICAMENTE; Y, POR ULTIMO, SE ELIMINA LA FOTORRESERVA Y SE GRABA LA PELICULA DE MANERA NO SELECTIVA.
ES539842A 1983-04-15 1985-01-25 Procedimiento de fabricacion de circuitos impresos Expired ES8606537A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8306405A FR2544341A1 (fr) 1983-04-15 1983-04-15 Procede de metallisation de films souples electriquement isolants et articles obtenus

Publications (2)

Publication Number Publication Date
ES8606537A1 true ES8606537A1 (es) 1986-04-01
ES539842A0 ES539842A0 (es) 1986-04-01

Family

ID=9288009

Family Applications (2)

Application Number Title Priority Date Filing Date
ES531591A Granted ES531591A0 (es) 1983-04-15 1984-04-13 Un procedimiento de preparacion de peliculas flexibles, electricamente aislantes en todo su espesor y metalizadas en su superficie.
ES539842A Expired ES8606537A1 (es) 1983-04-15 1985-01-25 Procedimiento de fabricacion de circuitos impresos

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES531591A Granted ES531591A0 (es) 1983-04-15 1984-04-13 Un procedimiento de preparacion de peliculas flexibles, electricamente aislantes en todo su espesor y metalizadas en su superficie.

Country Status (13)

Country Link
US (1) US4564424A (es)
EP (1) EP0124452B1 (es)
JP (2) JPS6036667A (es)
KR (1) KR910010148B1 (es)
AT (1) ATE32753T1 (es)
AU (1) AU571505B2 (es)
CA (1) CA1234069A (es)
DE (1) DE3469571D1 (es)
ES (2) ES531591A0 (es)
FR (1) FR2544341A1 (es)
IE (1) IE55468B1 (es)
IL (1) IL71544A (es)
ZA (1) ZA842727B (es)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692360A (en) * 1986-01-21 1987-09-08 E. I. Du Pont De Nemours And Company Metal interlayers in films by counter-current diffusion
US4752529A (en) * 1986-01-21 1988-06-21 E. I. Du Pont De Nemours And Company Metal interlayers in films by counter-current diffusion
US4910072A (en) * 1986-11-07 1990-03-20 Monsanto Company Selective catalytic activation of polymeric films
US4900618A (en) * 1986-11-07 1990-02-13 Monsanto Company Oxidation-resistant metal coatings
JPH0826462B2 (ja) * 1987-11-30 1996-03-13 龍徳 四十宮 表面金属化重合体成形物の製造方法
US5104688A (en) * 1990-06-04 1992-04-14 Macdermid, Incorporated Pretreatment composition and process for tin-lead immersion plating
EP0460548A3 (en) * 1990-06-08 1993-03-24 Amp-Akzo Corporation Printed circuits and base materials precatalyzed for etal deposition
US5162144A (en) * 1991-08-01 1992-11-10 Motorola, Inc. Process for metallizing substrates using starved-reaction metal-oxide reduction
US5281483A (en) * 1992-08-14 1994-01-25 Shell Oil Company Metallized films
WO1997007554A1 (en) * 1992-11-02 1997-02-27 Aktsionernoe Obschestvo Zakrytogo Tipa 'elton' Method of manufacturing electrodes for chemical current sources
US6518198B1 (en) * 2000-08-31 2003-02-11 Micron Technology, Inc. Electroless deposition of doped noble metals and noble metal alloys
US20050139811A1 (en) * 2001-02-15 2005-06-30 Integral Technologies, Inc. Surface preparation method for articles manufactured from conductive loaded resin-based materials
TW554086B (en) * 2001-02-16 2003-09-21 Taiyo Mfg Co Ltd Method for producing plated molded product
MXPA04004515A (es) * 2001-11-13 2004-09-10 Reckitt Benckiser Inc Mejoras referentes a articulos para limpieza de inodoro.
AU2002366309A1 (en) * 2001-12-18 2003-06-30 Asahi Kasei Kabushiki Kaisha Metal oxide dispersion
US7449099B1 (en) * 2004-04-13 2008-11-11 Novellus Systems, Inc. Selectively accelerated plating of metal features
BRPI0411770A (pt) * 2003-06-26 2006-08-08 Reckitt Benckiser Inc dispositivo aperfeiçoado de distribuição
EP1797251B1 (en) 2004-08-04 2009-09-09 Reckitt Benckiser Inc. Dispensing device
WO2006114431A1 (de) * 2005-04-27 2006-11-02 Basf Aktiengesellschaft Verfahren zur herstellung metallisierter, extrudierter kunststoff-gegenstände
DK2584066T3 (da) * 2009-12-17 2014-07-14 Byd Co Ltd Overflademetalliseringsmetode, metode til fremstilling af plastgenstande og plastgenstand fremstillet heraf
WO2023027640A2 (en) * 2021-08-26 2023-03-02 Nanyang Technological University Binder-free stretchable interconnect

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3551304A (en) * 1965-07-12 1970-12-29 Bausch & Lomb Method for producing a composite article
FR1469798A (fr) * 1966-02-22 1967-02-17 Ici Ltd Garnitures des encoches de dynamos électriques
FR1524702A (fr) * 1967-05-26 1968-05-10 Ici Ltd Bande d'enregistrement magnétique
US3558441A (en) * 1968-11-01 1971-01-26 Int Electronic Res Corp Method of making a metal core printed circuit board
US3619382A (en) * 1970-01-27 1971-11-09 Gen Electric Process of reducing metal compounds to metal in a matrix
DE2101049A1 (de) * 1971-01-11 1972-08-03 Siemens Ag Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall
DE2623695C2 (de) * 1976-05-26 1984-06-20 Mitsui Toatsu Chemicals, Inc., Tokio/Tokyo Verfahren zur Herstellung eines leitfähigen, gehärteten Produktes
AU548674B2 (en) * 1978-02-28 1986-01-02 Eurographics Holdings N.V. Metallization process
FR2518126B1 (fr) * 1981-12-14 1986-01-17 Rhone Poulenc Spec Chim Procede de metallisation d'articles electriquement isolants en matiere plastique et les articles intermediaires et finis obtenus selon ce procede
EP0082904B1 (fr) * 1981-12-29 1986-04-02 International Business Machines Corporation Système de gestion d'informations visualisables et descriptives
FR2544340A1 (fr) * 1983-04-15 1984-10-19 Rhone Poulenc Rech Procede de metallisation de films souples electriquement isolants en matiere plastique thermostable et articles obtenus

Also Published As

Publication number Publication date
JPH02187330A (ja) 1990-07-23
EP0124452A1 (fr) 1984-11-07
IE55468B1 (en) 1990-09-26
KR910010148B1 (ko) 1991-12-17
EP0124452B1 (fr) 1988-03-02
IL71544A0 (en) 1984-07-31
JPH0521741B2 (es) 1993-03-25
JPS6036667A (ja) 1985-02-25
ES8504973A1 (es) 1985-04-16
CA1234069A (fr) 1988-03-15
DE3469571D1 (en) 1988-04-07
AU571505B2 (en) 1988-04-21
JPH0225432B2 (es) 1990-06-04
FR2544341A1 (fr) 1984-10-19
IL71544A (en) 1987-07-31
US4564424A (en) 1986-01-14
KR840008467A (ko) 1984-12-15
ATE32753T1 (de) 1988-03-15
IE840922L (en) 1984-10-15
ZA842727B (en) 1984-11-28
AU2680284A (en) 1984-10-18
ES531591A0 (es) 1985-04-16
ES539842A0 (es) 1986-04-01

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19970401