KR880003402A - 금속의 이미지 침전공정 - Google Patents

금속의 이미지 침전공정 Download PDF

Info

Publication number
KR880003402A
KR880003402A KR1019870008542A KR870008542A KR880003402A KR 880003402 A KR880003402 A KR 880003402A KR 1019870008542 A KR1019870008542 A KR 1019870008542A KR 870008542 A KR870008542 A KR 870008542A KR 880003402 A KR880003402 A KR 880003402A
Authority
KR
South Korea
Prior art keywords
polymer
metal
ions
polymerizable
negatively charged
Prior art date
Application number
KR1019870008542A
Other languages
English (en)
Other versions
KR960001596B1 (ko
Inventor
조셉 크라우스 래리
앤드류 라이더 잭
Original Assignee
도날드 밀러 셀
미네소타 마이닝 앤드 매뉴 팩츄어링 컴패니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도날드 밀러 셀, 미네소타 마이닝 앤드 매뉴 팩츄어링 컴패니 filed Critical 도날드 밀러 셀
Publication of KR880003402A publication Critical patent/KR880003402A/ko
Application granted granted Critical
Publication of KR960001596B1 publication Critical patent/KR960001596B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

내용 없음

Description

금속의 이미지 침전공정
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (20)

1) 전자 활성부위를 갖는 중합체 표면내로 보유전하를 유입 시키는 단계와; 2) 중합체 표면내에 또는 표면상에 금속을 형성하기 위해서 보유전하로 금속 이온을 환원시키는 단계로 구성되며 적어도 일부의 중합체 표면부위상에 금속임지를 침전시키는 데 있어서, 1)단계전 또는 1)단계후 2)단계전에 상기중합체 표면에 마스킹 수단을 적용하는 단계를 더 포함하는 것을 특징으로 하여 중합체표면상에 금속이미지를 침전시키는 공정.
제1항에 있어서, 상기 마스킹 수단은 보유전하를 유입하기전에 중합성 표면에 적용되는 것을 특징으로 하는 공정.
제1항에 있어서, 상기 마스킹 수단은 보유전하를 주입한후 금속 이온을 환원하기전에 중합체 표면에 적용되는 것을 특징으로 하는 공정.
제2항에 있어서, 이미지를 침전시키는 공정은 일차용액(일차 용액내의 모든 음전하 삽입이온의 적어도 10몰랄%는 단순하거나 또는 복잡한 음전하 삽입이온이다)과 적어도 하나의 중합성 표면을 접촉시키는 단계, 적어도 하나의 중합성 표면상에 실질적인 금속도금없이 적어도 하나의 중합표면의 중합체를 환원시키는 단계, 환원성 금속 양이온을 갖는 이차용액과 환원된 중합체의 적어도 하나의 표면을 접촉시켜 적어도 하나의 중합성 표면의 환원된 중합체가 금속이온을 환원시켜 적어도 하느이 중합체 표면상에는 금속필름과 적어도 하나의 중합체 표면내에는 금속입자들로 구성된 그룹에서 선택된 형태의 금속을 형성하는 단계로 구성되는 것을 특징으로 하는 공정.
제3항에 있어서, 이미지를 침전시키는 공정은 일차용액(일차 용액내의 모든 음전하 삽입이온의 적어도 10몰랄%는 단순하거나 또는 복잡한 음전하 삽입이온이다)과 적어도 하나의 중합성 표면을 접촉시키는 단계, 적어도 하나의 중합성 표면상에 실질적인 금속도금없이 적어도 하나의 중합표면의 중합체를 환원시키는 단계, 환원성 금속 양이온을 갖는 이차용액과 환원된 중합체의 적어도 하느이 표면을 접촉시켜 적어도 하나의 중합성 표면의 환원된 중합체가 금속이온을 환원시켜 적어도 하나의 중합체 표면상에는 금속필름과 적어도 하나의 중합체 표면내에는 금속입자들로 구성된 그룹에서 선택된 형태의 금속을 형성하는 단계로 구성되는 것을 특징으로 하는 공정.
제1항 내지 제5항중 어느 한항에 있어서, 상기의 단순한 또는 복잡한 음전하 삽입이온은 일차용액중에 모든 음전하 삽입이온의 적어도 60몰랄%를 함유하는 것을 특징으로 하는 공정.
제1항 내지 제5항중 어느 한항에 있어서, 상기의 단순한 또는 복잡한 음전하 삽입이온은 일차용액중에 모든 음전하 삽입이온의 적어도 90몰랄%를 함유하는 것을 특징으로 하는 공정.
제1항 내지 제5항중 어느 한항에 있어서, 상기의 단순한 또는 복잡한 음전하 삽입이온은 일차용액중에 모든 음전하 삽입이온의 적어도 100몰랄%를 함유하는 것을 특징으로 하는 공정.
제1항 내지 제5항중 어느 한항에 있어서, 상기 이온은 Te2-이온, Co(I) 및 V(II) 복합체로부터 선택된 것을 특징으로 하는 공정.
제6항에 있어서, 상기 이온은 Te2-이온, Co(I) 및 V(II) 복합체로부터 선택된 것을 특징으로 하는 공정.
제1항 내지 제5항중 어느 한항에 있어서, 상기의 적어도 하나의 중합성 표면의 중합체는 피로멜리트이미드 전자활성부위를 포함하는 것을 특징으로 하는 공정.
제7항에 있어서, 상기의 적어도 하나의 중합성 표면의 중합체는 피로멜리트 이미드 전자활성부위를 포함하는 것을 특징으로 하는 공정.
제8항에 있어서, 상기의 적어도 하나의 중합성 표면의 중합체는 필로멜리트 이미드 전자활성부위를 포함하는 것을 특징으로 하는 공정.
제1항 내지 제5항중 어느 한항에 있어서, 적어도 50%의 환원된 중합체는 금속이온에 의해 산화되어 금속을 형성하며, 두번째는 금속화공정이 일어나는 것을 특징으로 하는 공정.
제13항에 있어서, 적어도 50%의 환원된 중합체는 금속이온에 의해 산화되어 금속을 형성하며, 두번째는 금속화공정이 일어나는 것을 특징으로 하는 공정.
중합성층내에 미세하게 분산된 전이금속을 지니는 중합성층을 포함하는 제품에 있어서, 중합성층은 전자활성부위를 갖는 중합체를 함유하며, 높은 전도율을 갖는 금속 필름을 중합성 표면과 입자에 고착하며, 금속입자 적어도 10중량%는 중합체내로 적어도 20옹스트롬을 투과하며, 25중량% 이하의 금속입자가 중합체내로 4,000 옹스트롬이상을 투과하는 것을 특징으로 하는 제품.
제16항에 있어서, 25중량%의 입자는 중합체내에 400 옹스트롬 이상을 투과하지 못하는 것을 특징으로 하는 공정.
제16항에 있어서, 높은 전도율이 금속필름 최소한 일부는 전자회로를 형성하는 것을 특징으로 하는 제품.
중합체층 표면내에 미세하게 분산된 입자로서 존재하는 전이 금속을 갖는 중합성 층을 함유하는 층에 있어서, 중합성 층은 전자활성부위를 갖는 중합체를 함유하며, 적어도 40%의 전이금속은 중합체 표면아래에 존재하며 중합체 표면 아래에서 적어도 0.25마이크론의 깊이로 적어도 약간의 전이금속이 신장되며 2%이하의 금속은 2마이크론 이상의 깊이로 존재하는 것을 특징으로 하는 제품.
제19항에 있어서, 상기 전이 금속의 최소한 50%는 상기 중합체 표면 아래에 있으며 적어도 약간의 전이금속은 0.3 마이크론의 깊이로 존재하며, 여기서 상기 전이 금속은 은이 아니며 중합체 표면내에는 주석의 흔적이 없는 것을 특징으로 하는 제품.
※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870008542A 1986-08-05 1987-08-04 금속화 상 형성 방법 KR960001596B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US893392 1986-08-05
US06/893,392 US4775556A (en) 1986-08-05 1986-08-05 Process for metallized imaging
US893,392 1986-08-05

Publications (2)

Publication Number Publication Date
KR880003402A true KR880003402A (ko) 1988-05-16
KR960001596B1 KR960001596B1 (ko) 1996-02-02

Family

ID=25401493

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870008542A KR960001596B1 (ko) 1986-08-05 1987-08-04 금속화 상 형성 방법

Country Status (6)

Country Link
US (1) US4775556A (ko)
EP (1) EP0256680B1 (ko)
JP (1) JP2527759B2 (ko)
KR (1) KR960001596B1 (ko)
CA (1) CA1266590A (ko)
DE (1) DE3787937T2 (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5024858A (en) * 1988-07-07 1991-06-18 E. I. Du Pont De Nemours And Company Metallized polymers and method
US5399425A (en) * 1988-07-07 1995-03-21 E. I. Du Pont De Nemours And Company Metallized polymers
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US4975327A (en) 1989-07-11 1990-12-04 Minnesota Mining And Manufacturing Company Polyimide substrate having a textured surface and metallizing such a substrate
JPH0381545A (ja) * 1989-08-25 1991-04-05 Japan Electron Control Syst Co Ltd 気筒判別信号付クランク角センサ
US5032467A (en) * 1989-09-22 1991-07-16 Minnesota Mining And Manufacturing Company Process for electroplating electroactive polymers and articles derived therefrom
US5015538A (en) * 1989-09-22 1991-05-14 Minnesota Mining And Manufacturing Company Process for pulse electroplating electroactive polymers and articles derived therefrom
US5021129A (en) * 1989-09-25 1991-06-04 International Business Machines Corporation Multilayer structures of different electroactive materials and methods of fabrication thereof
JP2775647B2 (ja) * 1989-11-17 1998-07-16 宇部興産株式会社 メタライズドポリイミドフィルムの製法
JP2524436B2 (ja) * 1990-09-18 1996-08-14 インターナショナル・ビジネス・マシーンズ・コーポレイション 表面処理方法
FR2754276B1 (fr) * 1996-10-03 1998-10-30 Commissariat Energie Atomique Procede et dispositifs pour la formation electrolytique d'un depot sur un ensemble selectionne d'electrodes
US5980813A (en) * 1997-04-17 1999-11-09 Sri International Rapid prototyping using multiple materials
US7048716B1 (en) 1997-05-15 2006-05-23 Stanford University MR-compatible devices
US6272370B1 (en) 1998-08-07 2001-08-07 The Regents Of University Of Minnesota MR-visible medical device for neurological interventions using nonlinear magnetic stereotaxis and a method imaging
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US6463317B1 (en) 1998-05-19 2002-10-08 Regents Of The University Of Minnesota Device and method for the endovascular treatment of aneurysms
WO2000010736A1 (en) * 1998-08-21 2000-03-02 Sri International Printing of electronic circuits and components
US11407662B2 (en) 2017-06-30 2022-08-09 Massachusetts Institute Of Technology Adsorbents, systems, and methods for separation of organic species from water
US11572293B2 (en) 2019-07-08 2023-02-07 Massachusetts Institute Of Technology Asymmetric electrochemical systems and methods

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1381243A (en) * 1972-02-18 1975-01-22 Kollmorgen Corp Method for metallizing substrates
US4459330A (en) * 1982-09-20 1984-07-10 The United States Of America As Represented By The United States Department Of Energy Electroless metal plating of plastics
US4617204A (en) * 1983-01-04 1986-10-14 The United States Of America As Represented By The United States Department Of Energy Chemical synthesis of thin films and supported crystals by oxidation of zintl anions
US4512855A (en) * 1984-07-23 1985-04-23 E. I. Du Pont De Nemours And Company Deposition of metals as interlayers within organic polymeric films
US4710403A (en) * 1986-05-05 1987-12-01 Minnesota Mining And Manufacturing Company Metallized polymers

Also Published As

Publication number Publication date
CA1266590A (en) 1990-03-13
JP2527759B2 (ja) 1996-08-28
EP0256680A3 (en) 1988-12-14
DE3787937D1 (de) 1993-12-02
US4775556A (en) 1988-10-04
EP0256680B1 (en) 1993-10-27
JPS6342363A (ja) 1988-02-23
EP0256680A2 (en) 1988-02-24
KR960001596B1 (ko) 1996-02-02
DE3787937T2 (de) 1994-05-05

Similar Documents

Publication Publication Date Title
KR880003402A (ko) 금속의 이미지 침전공정
IE810759L (en) Coating process
KR870011272A (ko) 중합체 표면상에 금속을 증착시키는 방법
KR870011273A (ko) 비전도성 재료의 표면에 전도성 금속층을 무전해 도금하는 방법
KR840004462A (ko) 전해용 이온 교환막의 제조방법
ES8702518A1 (es) Un metodo de electrodepositar una pelicula de hg1 x cd x te sobre un substrato conductor con estequiometria de hg con- trolada
KR840008467A (ko) 절연성이 있는 필름의 금속화 방법
KR840008466A (ko) 절연성이 있는 필름의 금속화 방법
ES8506823A1 (es) Un procedimiento para la deposicion electroforetica de una pelicula organica sobre un substragto conductor
DE69106675D1 (de) Dünnschichtleitende Vorrichtung und Verfahren zu ihrer Herstellung.
EP0155749A3 (en) Cryoelectrodeposition
ES409263A1 (es) Metodo para depositar selectivamente un metal sobre una su-perficie de un sustrato.
SE8504692D0 (sv) Sett att framstella ett skikt med elektrisk ledningsformaga
SE7703989L (sv) Forfarande vid stromlos avsettning av kopparbeleggnigar
GB1013673A (en) Improvements in or relating to electroplating processes
KR920006544A (ko) 크롬도금용 양극 및 그 제조방법 그리고 크롬도금 전해 장치 및 양극을 사용하는 크롬도금 전해 방법
JPH06188109A (ja) 導電性を有する重合体からなる抵抗素子網の製造方法および該抵抗素子網の支持体
JPS5241654A (en) Formation of roughened coating layer by electro-phoresis and coating c omposition for the same
DE3680619D1 (de) Verfahren zum herstellen einer transfermetallisierungsfolie.
JPS6456441A (en) Selectively additive correction for void of copying layer
WO1987004007A1 (en) A method of improving the electrical characteristics of a thin film
JPS5462242A (en) Electrodeposition coating
KR890016216A (ko) 안정한 합금 조성물을 갖는 전기도금된 합금 피복물 및 그의 도금방법
Azumi et al. Analysis of transient photocurrent in passivated iron electrode in neutral borate solution
JPS54112949A (en) Method of electrocoating

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee